Jyh-Chang Lin

Person

Sanchong City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device and semiconductor devices
- Patent number 12,148,656
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Min Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-mount acoustics damping shelf at backplane-identified devices
- Patent number 12,120,840
- Issue date Oct 15, 2024
- Dell Products L.P.
- Richard Eiland
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Codesigned air shroud
- Patent number 12,035,502
- Issue date Jul 9, 2024
- Dell Products L.P.
- Chris Everett Peterson
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
System and method for thermal management of motion sensitive systems
- Patent number 11,977,423
- Issue date May 7, 2024
- Dell Products L.P.
- Hung-Pin Chien
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Amorphous layers for reducing copper diffusion and method forming same
- Patent number 11,967,522
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyh-Nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having a multi-layer diffusion barrier and met...
- Patent number 11,742,393
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyh-nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices including formation o...
- Patent number 11,322,397
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiao-Min Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amorphous layers for reducing copper diffusion and method forming same
- Patent number 11,315,829
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyh-Nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having multi-layer diffusion barrier and metho...
- Patent number 11,264,467
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyh-nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron migration control in interconnect structures
- Patent number 11,264,273
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for fan noise canceller
- Patent number 11,151,978
- Issue date Oct 19, 2021
- Dell Products L.P.
- Chun-Fa Tseng
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Aluminum-containing layers and methods of forming the same
- Patent number 10,978,337
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyh-nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and manufacturing method
- Patent number 10,784,181
- Issue date Sep 22, 2020
- Huawei Technologies Co., Ltd.
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multi-layer diffusion barrier
- Patent number 10,749,004
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyh-nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged chip and signal transmission method based on packaged chip
- Patent number 10,490,506
- Issue date Nov 26, 2019
- Huawei Technologies Co., Ltd.
- Chih Chiang Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip
- Patent number 10,475,741
- Issue date Nov 12, 2019
- Huawei Technologies Co., Ltd.
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of interconnection structure of semi...
- Patent number 10,373,906
- Issue date Aug 6, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyh-Nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voice command recognition method and related electronic device and...
- Patent number 9,691,381
- Issue date Jun 27, 2017
- Mediatek Inc.
- Yiou-Wen Cheng
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Voice control device and method for deciding response of voice cont...
- Patent number 9,691,382
- Issue date Jun 27, 2017
- Mediatek Inc.
- Chao-Ling Hsu
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Electrically stackable semiconductor wafer and chip packages
- Patent number 9,601,474
- Issue date Mar 21, 2017
- Invensas Corporation
- Shou-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection device
- Patent number 9,111,752
- Issue date Aug 18, 2015
- Via Technologies, Inc.
- Ke-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer leveled chip packaging structure and method thereof
- Patent number 9,059,181
- Issue date Jun 16, 2015
- Invensas Corporation
- Shou-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection device
- Patent number 9,048,098
- Issue date Jun 2, 2015
- Via Technologies, Inc.
- Ke-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interlayer dielectric film above metal gate of se...
- Patent number 8,946,095
- Issue date Feb 3, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-leveled chip packaging structure and method thereof
- Patent number 8,587,091
- Issue date Nov 19, 2013
- Invensas Corporation
- Shou-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backlight frequency-modulation controlled 3D display
- Patent number 8,416,353
- Issue date Apr 9, 2013
- Au Optronics Corporation
- Jyh-Wei Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Sideways extending speaker apparatus and methods
- Patent number 8,369,561
- Issue date Feb 5, 2013
- Dell Products L.P.
- Gurmeet Bhutani
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package device
- Patent number 8,314,482
- Issue date Nov 20, 2012
- Invensas Corporation
- Shou-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,248,803
- Issue date Aug 21, 2012
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Jyh-Rong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Keyboard, linkage assembly set, and method of assembling a keyboard
- Patent number 8,053,697
- Issue date Nov 8, 2011
- Changshu Sunrex Technology Co., Ltd.
- Jyh-Tsong Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES
- Publication number 20240395609
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Min CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMORPHOUS LAYERS FOR REDUCING COPPER DIFFUSION AND METHOD FORMING SAME
- Publication number 20240258160
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyh-Nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CODESIGNED AIR SHROUD
- Publication number 20240040738
- Publication date Feb 1, 2024
- Dell Products L.P.
- Chris Everett Peterson
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES
- Publication number 20230377955
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Jen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF MOTION SENSITIVE SYSTEMS
- Publication number 20230195188
- Publication date Jun 22, 2023
- Dell Products L.P.
- HUNG-PIN CHIEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIRECT-MOUNT ACOUSTICS DAMPING SHELF AT BACKPLANE-IDENTIFIED DEVICES
- Publication number 20220322560
- Publication date Oct 6, 2022
- Dell Products L.P.
- Richard EILAND
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES
- Publication number 20220262677
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Min CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Amorphous Layers for Reducing Copper Diffusion and Method Forming Same
- Publication number 20220254679
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyh-Nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-LAYER DIFFUSION BARRIER AND METHOD OF MAKING THE SAME
- Publication number 20220190122
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Jyh-nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES
- Publication number 20220181203
- Publication date Jun 9, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Jen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES
- Publication number 20210233805
- Publication date Jul 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Jen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Amorphous Layers for Reducing Copper Diffusion and Method Forming Same
- Publication number 20210066122
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyh-Nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-LAYER DIFFUSION BARRIER AND METHOD OF MAKING THE SAME
- Publication number 20200365695
- Publication date Nov 19, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Jyh-nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES
- Publication number 20200135553
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Min CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20190198422
- Publication date Jun 27, 2019
- Huawei Technologies Co., Ltd
- Jyh Rong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER DIFFUSION BARRIER AND METHOD OF MAKING THE SAME
- Publication number 20190006474
- Publication date Jan 3, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Jyh-nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF INTERCONNECTION STRUCTURE OF SEMI...
- Publication number 20180308793
- Publication date Oct 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyh-Nan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Manufacturing Method
- Publication number 20180190566
- Publication date Jul 5, 2018
- Huawei Technologies Co., Ltd
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Chip and Signal Transmission Method Based on Packaged Chip
- Publication number 20180190590
- Publication date Jul 5, 2018
- Huawei Technologies Co., Ltd
- Chih Chiang Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP
- Publication number 20180025973
- Publication date Jan 25, 2018
- Huawei Technologies Co., Ltd
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFECTIVE PROGRAMMING METHOD FOR NON-VOLATILE FLASH MEMORY USING JU...
- Publication number 20170103813
- Publication date Apr 13, 2017
- Integrated Silicon Solution, Inc.
- Arthur Wang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR APPARATUS AND CLEANING METHOD FOR THE SEMICONDUCTOR A...
- Publication number 20170053783
- Publication date Feb 23, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yin-Bin TSENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE ETCHING FOR RC DELAY IMPROVEMENT
- Publication number 20160071801
- Publication date Mar 10, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyh-nan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Leveled Chip Packaging Structure and Method Thereof
- Publication number 20150364457
- Publication date Dec 17, 2015
- Invensas Corporation
- Shou-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION DEVICE
- Publication number 20150228639
- Publication date Aug 13, 2015
- VIA TECHNOLOGIES, INC.
- Ke-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-TREATMENT METHOD FOR METAL-OXIDE REDUCTION AND DEVICE FORMED
- Publication number 20150001728
- Publication date Jan 1, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOICE CONTROL DEVICE AND METHOD FOR DECIDING RESPONSE OF VOICE CONT...
- Publication number 20140249820
- Publication date Sep 4, 2014
- MEDIATEK INC.
- Chao-Ling Hsu
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
Wafer Leveled Chip Packaging Structure and Method Thereof
- Publication number 20140217587
- Publication date Aug 7, 2014
- Invensas Corporation
- Shou-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING INTERLAYER DIELECTRIC FILM ABOVE METAL GATE OF SE...
- Publication number 20140120706
- Publication date May 1, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- LI Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, ELECTRONIC DEVICE, AND MACHINE READABLE STORAGE MEDIUM FOR...
- Publication number 20140075570
- Publication date Mar 13, 2014
- Chao-Ling Hsu
- G06 - COMPUTING CALCULATING COUNTING

Jyh-Chang Lin

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device and semiconductor devices

Direct-mount acoustics damping shelf at backplane-identified devices

Codesigned air shroud

System and method for thermal management of motion sensitive systems

Amorphous layers for reducing copper diffusion and method forming same

Semiconductor device having a multi-layer diffusion barrier and met...

Method of manufacturing semiconductor devices including formation o...

Amorphous layers for reducing copper diffusion and method forming same

Semiconductor device having multi-layer diffusion barrier and metho...

Electron migration control in interconnect structures

System and method for fan noise canceller

Aluminum-containing layers and methods of forming the same

Apparatus and manufacturing method

Semiconductor device having a multi-layer diffusion barrier

Packaged chip and signal transmission method based on packaged chip

Chip

Structure and formation method of interconnection structure of semi...

Voice command recognition method and related electronic device and...

Voice control device and method for deciding response of voice cont...

Electrically stackable semiconductor wafer and chip packages

Electrostatic discharge protection device

Wafer leveled chip packaging structure and method thereof

Electrostatic discharge protection device

Method of forming interlayer dielectric film above metal gate of se...

Wafer-leveled chip packaging structure and method thereof

Backlight frequency-modulation controlled 3D display

Sideways extending speaker apparatus and methods

Semiconductor package device

Semiconductor package and method of manufacturing the same

Keyboard, linkage assembly set, and method of assembling a keyboard

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES

AMORPHOUS LAYERS FOR REDUCING COPPER DIFFUSION AND METHOD FORMING SAME

CODESIGNED AIR SHROUD

ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES

SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF MOTION SENSITIVE SYSTEMS

DIRECT-MOUNT ACOUSTICS DAMPING SHELF AT BACKPLANE-IDENTIFIED DEVICES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES

Amorphous Layers for Reducing Copper Diffusion and Method Forming Same

MULTI-LAYER DIFFUSION BARRIER AND METHOD OF MAKING THE SAME

ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES

ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES

Amorphous Layers for Reducing Copper Diffusion and Method Forming Same

MULTI-LAYER DIFFUSION BARRIER AND METHOD OF MAKING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF

MULTI-LAYER DIFFUSION BARRIER AND METHOD OF MAKING THE SAME

STRUCTURE AND FORMATION METHOD OF INTERCONNECTION STRUCTURE OF SEMI...

Apparatus and Manufacturing Method

Packaged Chip and Signal Transmission Method Based on Packaged Chip

CHIP

EFFECTIVE PROGRAMMING METHOD FOR NON-VOLATILE FLASH MEMORY USING JU...

SEMICONDUCTOR APPARATUS AND CLEANING METHOD FOR THE SEMICONDUCTOR A...

SEMICONDUCTOR DEVICE ETCHING FOR RC DELAY IMPROVEMENT

Wafer Leveled Chip Packaging Structure and Method Thereof

ELECTROSTATIC DISCHARGE PROTECTION DEVICE

PRE-TREATMENT METHOD FOR METAL-OXIDE REDUCTION AND DEVICE FORMED

VOICE CONTROL DEVICE AND METHOD FOR DECIDING RESPONSE OF VOICE CONT...

Wafer Leveled Chip Packaging Structure and Method Thereof

METHOD OF FORMING INTERLAYER DIELECTRIC FILM ABOVE METAL GATE OF SE...

METHOD, ELECTRONIC DEVICE, AND MACHINE READABLE STORAGE MEDIUM FOR...