Kai-Chen YANG

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,369,250
- Issue date Jul 22, 2025
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encryption and decryption system and method
- Patent number 12,340,447
- Issue date Jun 24, 2025
- Hon Hai Precision Industry Co., Ltd.
- Yung-Hui Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of forming semiconductor device structures
- Patent number 12,308,292
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chen Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact features of semiconductor device and method of forming same
- Patent number 12,272,600
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package structure
- Patent number 12,266,616
- Issue date Apr 1, 2025
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing system, behavior recognition device and...
- Patent number 12,259,709
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kai-Ting Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode package structure and manufacturing method the...
- Patent number 12,255,279
- Issue date Mar 18, 2025
- Unimicron Technology Corp.
- Wen-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating contact structure
- Patent number 12,237,218
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass carrier having protection structure and manufacturing method...
- Patent number 12,218,017
- Issue date Feb 4, 2025
- Unimicron Technology Corp.
- Wen Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming FinFET devices with a fin top hardmask
- Patent number 12,211,921
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,160,953
- Issue date Dec 3, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for boosting performance of FinFETs via strained...
- Patent number 12,148,830
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme for image sensor substrate
- Patent number 12,136,642
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Yun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation system
- Patent number 12,125,665
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Yun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dopant deactivation underneath gate
- Patent number 12,068,374
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Dhanyakumar Mahaveer Sathaiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertical structure
- Patent number 12,062,705
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS FinFET structures including work-function materials having dif...
- Patent number 11,961,768
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ya-Wen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,943,877
- Issue date Mar 26, 2024
- Unimicron Technology Corp.
- Wen-Yu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of cutting metal gates and structures formed thereof
- Patent number 11,923,251
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsu-Hsiu Perng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
FinFET structure with fin top hard mask and method of forming the same
- Patent number 11,923,457
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Finfet device and a method for fabricating the same
- Patent number 11,901,365
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wang-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uninterruptible power system and operation method thereof
- Patent number 11,870,296
- Issue date Jan 9, 2024
- CYBER POWER SYSTEMS, INC.
- Kai-Tsung Yang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor manufacturing system, behavior recognition device and...
- Patent number 11,860,607
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kai-Ting Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package structure and method of manufacturing th...
- Patent number 11,824,012
- Issue date Nov 21, 2023
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector including a movable terminal having first and...
- Patent number 11,799,231
- Issue date Oct 24, 2023
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Kai-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,764,344
- Issue date Sep 19, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure and manufacturing method thereof
- Patent number 11,764,120
- Issue date Sep 19, 2023
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full well capacity for image sensor
- Patent number 11,721,774
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Yun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,710,690
- Issue date Jul 25, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION COMPONENT WITH ANISOTROPIC HEAT CONDUCTION AND MET...
- Publication number 20250236776
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chieh Yang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250233063
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-HAO LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING SYSTEM, BEHAVIOR RECOGNITION DEVICE AND...
- Publication number 20250189950
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- KAI-TING YANG
- G05 - CONTROLLING REGULATING
Information Patent Application
METHOD OF FABRICATING CONTACT STRUCTURE
- Publication number 20250167045
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149426
- Publication date May 8, 2025
- Unimicron Technology Corp.
- An-Sheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP METAL GATE FOR STACKED DEVICE STRUCTURE
- Publication number 20250151367
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING FINFET DEVICES WITH A FIN TOP HARDMASK
- Publication number 20250133808
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Cheng CHING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPRESSIBLE BONDS AND METHODS...
- Publication number 20250125309
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Hsiang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE ELECTRODE DEPOSITION IN STACKING TRANSISTORS AND STRUCTURES RE...
- Publication number 20250095997
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Plugs With Reduced R/C and the Methods of Forming The Same
- Publication number 20240413020
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Hsiu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20240413067
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chia-Yu PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240387265
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR BOOSTING PERFORMANCE OF FINFETS VIA STRAINED...
- Publication number 20240379849
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANTATION SYSTEM
- Publication number 20240379321
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Yun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-PACKAGED STRUCTURE FOR OPTICS AND ELECTRICS
- Publication number 20240377598
- Publication date Nov 14, 2024
- Unimicron Technology Corp.
- Chin-Sheng WANG
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOPANT DEACTIVATION UNDERNEATH GATE
- Publication number 20240371940
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dhanyakumar Mahaveer SATHAIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHODS O...
- Publication number 20240321817
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTED SYNCHRONIZATION SYSTEM
- Publication number 20240259151
- Publication date Aug 1, 2024
- Ufi Space Co., Ltd.
- Chih-Chin Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240248264
- Publication date Jul 25, 2024
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240251504
- Publication date Jul 25, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237202
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237209
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOLD STATE MONITORING SYSTEM AND METHOD THEREOF
- Publication number 20240210911
- Publication date Jun 27, 2024
- Industrial Technology Research Institute
- Yu-Hung PAI
- G05 - CONTROLLING REGULATING
Information Patent Application
MULTI-LAYER CERAMIC CAPACITOR AND METHOD FOR PRODUCING THE SAME
- Publication number 20240177937
- Publication date May 30, 2024
- Yageo Corporation
- Masayuki FUJIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ELECTRODE OF CERAMIC CAPACITOR AND METHOD OF FORMING THE SAME
- Publication number 20240170211
- Publication date May 23, 2024
- Yageo Corporation
- Hsing-I HSIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE...
- Publication number 20240162051
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240138059
- Publication date Apr 25, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240138063
- Publication date Apr 25, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FINFET STRUCTURE WITH FIN TOP HARD MASK AND METHOD OF FORMING THE SAME
- Publication number 20240105850
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Che-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING SYSTEM, BEHAVIOR RECOGNITION DEVICE AND...
- Publication number 20240094705
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KAI-TING YANG
- H01 - BASIC ELECTRIC ELEMENTS

Kai-Chen YANG

Person

Patents Grantslast 30 patents

Circuit board structure and manufacturing method thereof

Encryption and decryption system and method

Methods of forming semiconductor device structures

Contact features of semiconductor device and method of forming same

Integrated circuit package structure

Semiconductor manufacturing system, behavior recognition device and...

Light-emitting diode package structure and manufacturing method the...

Method of fabricating contact structure

Glass carrier having protection structure and manufacturing method...

Method for forming FinFET devices with a fin top hardmask

Circuit board structure and manufacturing method thereof

Method and device for boosting performance of FinFETs via strained...

Passivation scheme for image sensor substrate

Ion implantation system

Method of dopant deactivation underneath gate

Semiconductor device and method of forming vertical structure

CMOS FinFET structures including work-function materials having dif...

Circuit board structure and manufacturing method thereof

Methods of cutting metal gates and structures formed thereof

FinFET structure with fin top hard mask and method of forming the same

Finfet device and a method for fabricating the same

Manufacturing method of package structure

Uninterruptible power system and operation method thereof

Semiconductor manufacturing system, behavior recognition device and...

Integrated circuit package structure and method of manufacturing th...

Electrical connector including a movable terminal having first and...

Package structure and manufacturing method thereof

Chip packaging structure and manufacturing method thereof

Full well capacity for image sensor

Package structure and manufacturing method thereof

Patents Applicationslast 30 patents

HEAT DISSIPATION COMPONENT WITH ANISOTROPIC HEAT CONDUCTION AND MET...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR MANUFACTURING SYSTEM, BEHAVIOR RECOGNITION DEVICE AND...

METHOD OF FABRICATING CONTACT STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

BOTTOM-UP METAL GATE FOR STACKED DEVICE STRUCTURE

METHOD FOR FORMING FINFET DEVICES WITH A FIN TOP HARDMASK

SEMICONDUCTOR DEVICE STRUCTURE WITH COMPRESSIBLE BONDS AND METHODS...

GATE ELECTRODE DEPOSITION IN STACKING TRANSISTORS AND STRUCTURES RE...

Contact Plugs With Reduced R/C and the Methods of Forming The Same

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

METHOD AND DEVICE FOR BOOSTING PERFORMANCE OF FINFETS VIA STRAINED...

ION IMPLANTATION SYSTEM

CO-PACKAGED STRUCTURE FOR OPTICS AND ELECTRICS

SEMICONDUCTOR DEVICE HAVING DOPANT DEACTIVATION UNDERNEATH GATE

IMPROVED BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHODS O...

DISTRIBUTED SYNCHRONIZATION SYSTEM

PACKAGE STRUCTURE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

MOLD STATE MONITORING SYSTEM AND METHOD THEREOF

MULTI-LAYER CERAMIC CAPACITOR AND METHOD FOR PRODUCING THE SAME

METAL ELECTRODE OF CERAMIC CAPACITOR AND METHOD OF FORMING THE SAME

COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

FINFET STRUCTURE WITH FIN TOP HARD MASK AND METHOD OF FORMING THE SAME

SEMICONDUCTOR MANUFACTURING SYSTEM, BEHAVIOR RECOGNITION DEVICE AND...