KAI WU

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process chamber pumping liner
- Patent number D1066440
- Issue date Mar 11, 2025
- Applied Materials, Inc.
- Yang Li
- D15 - Machines not elsewhere specified
Information Patent Grant
Low resistivity tungsten film and method of manufacture
- Patent number 12,191,198
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Feihu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten molybdenum structures
- Patent number 12,159,804
- Issue date Dec 3, 2024
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation of metal vias on metal lines
- Patent number 12,113,020
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Ryan Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low resistivity and stress tungsten gap fill
- Patent number 12,094,773
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming low resistivity tungsten features
- Patent number 12,037,682
- Issue date Jul 16, 2024
- Applied Materials, Inc.
- Peiqi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten gapfill using molybdenum co-flow
- Patent number 12,014,956
- Issue date Jun 18, 2024
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas delivery for tungsten-containing layer
- Patent number 11,939,668
- Issue date Mar 26, 2024
- Applied Materials, Inc.
- Zubin Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Catalyst enhanced molybdenum deposition and gap fill
- Patent number 11,859,277
- Issue date Jan 2, 2024
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for low resistivity and stress tungsten gap fill
- Patent number 11,798,845
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-step pre-clean for selective metal gap fill
- Patent number 11,776,806
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step pre-clean for selective metal gap fill
- Patent number 11,380,536
- Issue date Jul 5, 2022
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a metal gapfill
- Patent number 11,355,391
- Issue date Jun 7, 2022
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of reducing or eliminating defects in tungsten film
- Patent number 10,879,081
- Issue date Dec 29, 2020
- Applied Materials, Inc.
- Guoqiang Jian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process integration approach of selective tungsten via fill
- Patent number 10,727,119
- Issue date Jul 28, 2020
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ pre-clean for selectivity improvement for selective deposition
- Patent number 10,395,916
- Issue date Aug 27, 2019
- Applied Materials, Inc.
- Kai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process integration approach of selective tungsten via fill
- Patent number 10,256,144
- Issue date Apr 9, 2019
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming low-resistance contacts through integrated proc...
- Patent number 9,947,578
- Issue date Apr 17, 2018
- Applied Materials, Inc.
- Yu Lei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for variable substrate temperature control
- Patent number 9,783,889
- Issue date Oct 10, 2017
- Applied Materials, Inc.
- Gwo-Chuan Tzu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten deposition with tungsten hexafluoride (WF6) etchback
- Patent number 9,748,105
- Issue date Aug 29, 2017
- Applied Materials, Inc.
- Kai Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming metal organic tungsten for middle of the line (...
- Patent number 9,653,352
- Issue date May 16, 2017
- Applied Materials, Inc.
- Liqi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cobalt removal for chamber clean or pre-clean process
- Patent number 9,528,183
- Issue date Dec 27, 2016
- Applied Materials, Inc.
- Kai Wu
- B08 - CLEANING
Information Patent Grant
Tungsten growth modulation by controlling surface composition
- Patent number 9,169,556
- Issue date Oct 27, 2015
- Applied Materials, Inc.
- Kai Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Boron ionization for aluminum oxide etch enhancement
- Patent number 9,051,655
- Issue date Jun 9, 2015
- Applied Materials, Inc.
- Kai Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for thermal based substrate processing with v...
- Patent number 8,920,564
- Issue date Dec 30, 2014
- Applied Materials, Inc.
- Gwo-Chuan Tzu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low temperature high pressure high H2/WF6 ratio W process for 3D NA...
- Patent number 8,900,999
- Issue date Dec 2, 2014
- Applied Materials, Inc.
- Kai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of liner and barrier for tungsten as gate electrode and a...
- Patent number 8,865,594
- Issue date Oct 21, 2014
- Applied Materials, Inc.
- Sang-Hyeob Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High temperature tungsten metallization process
- Patent number 8,835,311
- Issue date Sep 16, 2014
- Applied Materials, Inc.
- Joshua Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature tungsten metallization process
- Patent number 8,617,985
- Issue date Dec 31, 2013
- Applied Materials, Inc.
- Joshua Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition of tungsten materials
- Patent number 8,513,116
- Issue date Aug 20, 2013
- Applied Materials, Inc.
- Amit Khandelwal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
TUNGSTEN MOLYBDENUM STRUCTURES
- Publication number 20250038051
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SILICON NITRIDE DAMAGE-FREE DRY ETCH METHOD FOR TUNGSTEN REMOVAL IN...
- Publication number 20240371654
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Qihao ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING LOW RESISTIVITY TUNGSTEN FEATURES
- Publication number 20240368754
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Peiqi WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ENABLE CVD CHAMBER PROCESS WAFERS AT DIFFERENT TEMPERATURES
- Publication number 20240352588
- Publication date Oct 24, 2024
- Applied Materials, Inc.
- Peiqi WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATION SOLUTION FOR NAND DEEP CONTACT GAP FILL
- Publication number 20240282631
- Publication date Aug 22, 2024
- Applied Materials, Inc.
- Xi CEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM AND METHODS TO CO-STRIKE PLASMA TO ENHANCE TUNGST...
- Publication number 20240274407
- Publication date Aug 15, 2024
- Applied Materials, Inc.
- Peiqi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS TUNGSTEN LAYER DEPOSITION
- Publication number 20240266215
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Xi CEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING A TUNGSTEN CONTAINING LAYER
- Publication number 20240258109
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAS DELIVERY FOR TUNGSTEN-CONTAINING LAYER
- Publication number 20240229230
- Publication date Jul 11, 2024
- Applied Materials, Inc.
- Zubin HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS TO IMPROVE PRODUCTIVITY OF ADVANCED CVD W GAPFILL PROCESS
- Publication number 20240222128
- Publication date Jul 4, 2024
- Applied Materials, Inc.
- Mingrui ZHAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING SYSTEM AND METHODS FOR FORMING VOID-FREE AND SEAM-FREE T...
- Publication number 20240209500
- Publication date Jun 27, 2024
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SURFACE DEPASSIVATION WITH THERMAL ETCH AFTER NITROGEN RADICAL TREA...
- Publication number 20240162089
- Publication date May 16, 2024
- Applied Materials, Inc.
- Dixiong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING MULTI-TIER TUNGSTEN FEATURES
- Publication number 20240047268
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Peiqi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITROGEN PLASMA TREATMENT FOR BOTTOM-UP GROWTH
- Publication number 20240014072
- Publication date Jan 11, 2024
- Applied Materials, Inc.
- Tsung-Han YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDWARE TO UNIFORMLY DISTRIBUTE ACTIVE SPECIES FOR SEMICONDUCTOR F...
- Publication number 20230374660
- Publication date Nov 23, 2023
- Applied Materials, Inc.
- Harpreet SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING MULTI-TIER TUNGSTEN FEATURES
- Publication number 20230369113
- Publication date Nov 16, 2023
- Applied Materials, Inc.
- Peiqi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS TO PROMOTE WAFER EDGE TEMPERATURE UNIFORMITY
- Publication number 20230357929
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Zubin HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAS DELIVERY FOR TUNGSTEN-CONTAINING LAYER
- Publication number 20230340662
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Zubin HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAP FILL ENHANCEMENT WITH THERMAL ETCH
- Publication number 20230317458
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Kai WU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNGSTEN MOLYBDENUM STRUCTURES
- Publication number 20230290679
- Publication date Sep 14, 2023
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BOTTOM COVER PLATE TO REDUCE WAFER PLANAR NONUNIFORMITY
- Publication number 20230130756
- Publication date Apr 27, 2023
- Applied Materials, Inc.
- Zubin HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNGSTEN GAPFILL USING MOLYBDENUM CO-FLOW
- Publication number 20230109501
- Publication date Apr 6, 2023
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING LOW RESISTIVITY TUNGSTEN FEATURES
- Publication number 20230107536
- Publication date Apr 6, 2023
- Applied Materials, Inc.
- Peiqi WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ENHANCED STRESS TUNING AND INTERFACIAL ADHESION FOR TUNGSTEN (W) GA...
- Publication number 20230023235
- Publication date Jan 26, 2023
- Xi CEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHADOW RING LIFT TO IMPROVE WAFER EDGE PERFORMANCE
- Publication number 20230002894
- Publication date Jan 5, 2023
- Applied Materials, Inc.
- Zubin HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Catalyst Enhanced Molybdenum Deposition And Gap Fill
- Publication number 20220372617
- Publication date Nov 24, 2022
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING VOID AND SEAM FREE METAL FEATURES
- Publication number 20220359279
- Publication date Nov 10, 2022
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR LOW RESISTIVITY AND STRESS TUNGSTEN GAP FILL
- Publication number 20220336274
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAP FILL METHODS USING CATALYZED DEPOSITION
- Publication number 20220325410
- Publication date Oct 13, 2022
- Applied Materials, Inc.
- Byunghoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STEP PRE-CLEAN FOR SELECTIVE METAL GAP FILL
- Publication number 20220270871
- Publication date Aug 25, 2022
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Process chamber pumping liner

Low resistivity tungsten film and method of manufacture

Tungsten molybdenum structures

Formation of metal vias on metal lines

Methods for low resistivity and stress tungsten gap fill

Methods for forming low resistivity tungsten features

Tungsten gapfill using molybdenum co-flow

Gas delivery for tungsten-containing layer

Catalyst enhanced molybdenum deposition and gap fill

Methods and apparatus for low resistivity and stress tungsten gap fill

Multi-step pre-clean for selective metal gap fill

Multi-step pre-clean for selective metal gap fill

Method for forming a metal gapfill

Methods of reducing or eliminating defects in tungsten film

Process integration approach of selective tungsten via fill

In-situ pre-clean for selectivity improvement for selective deposition

Process integration approach of selective tungsten via fill

Methods for forming low-resistance contacts through integrated proc...

Apparatus for variable substrate temperature control

Tungsten deposition with tungsten hexafluoride (WF6) etchback

Methods for forming metal organic tungsten for middle of the line (...

Cobalt removal for chamber clean or pre-clean process

Tungsten growth modulation by controlling surface composition

Boron ionization for aluminum oxide etch enhancement

Methods and apparatus for thermal based substrate processing with v...

Low temperature high pressure high H2/WF6 ratio W process for 3D NA...

Formation of liner and barrier for tungsten as gate electrode and a...

High temperature tungsten metallization process

High temperature tungsten metallization process

Atomic layer deposition of tungsten materials

Patents Applicationslast 30 patents

TUNGSTEN MOLYBDENUM STRUCTURES

SILICON NITRIDE DAMAGE-FREE DRY ETCH METHOD FOR TUNGSTEN REMOVAL IN...

METHODS FOR FORMING LOW RESISTIVITY TUNGSTEN FEATURES

ENABLE CVD CHAMBER PROCESS WAFERS AT DIFFERENT TEMPERATURES

INTEGRATION SOLUTION FOR NAND DEEP CONTACT GAP FILL

PROCESSING SYSTEM AND METHODS TO CO-STRIKE PLASMA TO ENHANCE TUNGST...

LOW STRESS TUNGSTEN LAYER DEPOSITION

METHOD OF DEPOSITING A TUNGSTEN CONTAINING LAYER

GAS DELIVERY FOR TUNGSTEN-CONTAINING LAYER

METHODS TO IMPROVE PRODUCTIVITY OF ADVANCED CVD W GAPFILL PROCESS

PROCESSING SYSTEM AND METHODS FOR FORMING VOID-FREE AND SEAM-FREE T...

SURFACE DEPASSIVATION WITH THERMAL ETCH AFTER NITROGEN RADICAL TREA...

METHODS FOR FORMING MULTI-TIER TUNGSTEN FEATURES

NITROGEN PLASMA TREATMENT FOR BOTTOM-UP GROWTH

HARDWARE TO UNIFORMLY DISTRIBUTE ACTIVE SPECIES FOR SEMICONDUCTOR F...

METHODS FOR FORMING MULTI-TIER TUNGSTEN FEATURES

APPARATUS AND METHODS TO PROMOTE WAFER EDGE TEMPERATURE UNIFORMITY

GAS DELIVERY FOR TUNGSTEN-CONTAINING LAYER

GAP FILL ENHANCEMENT WITH THERMAL ETCH

TUNGSTEN MOLYBDENUM STRUCTURES

BOTTOM COVER PLATE TO REDUCE WAFER PLANAR NONUNIFORMITY

TUNGSTEN GAPFILL USING MOLYBDENUM CO-FLOW

METHODS FOR FORMING LOW RESISTIVITY TUNGSTEN FEATURES

ENHANCED STRESS TUNING AND INTERFACIAL ADHESION FOR TUNGSTEN (W) GA...

SHADOW RING LIFT TO IMPROVE WAFER EDGE PERFORMANCE

Catalyst Enhanced Molybdenum Deposition And Gap Fill

METHODS OF FORMING VOID AND SEAM FREE METAL FEATURES

METHODS FOR LOW RESISTIVITY AND STRESS TUNGSTEN GAP FILL

GAP FILL METHODS USING CATALYZED DEPOSITION

MULTI-STEP PRE-CLEAN FOR SELECTIVE METAL GAP FILL