Kai Yang

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
AI-optimized harvester configured to maximize yield and minimize im...
- Patent number 11,864,494
- Issue date Jan 9, 2024
- Landing AI
- Dongyan Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
AI-optimized harvester configured to maximize yield and minimize im...
- Patent number 11,412,657
- Issue date Aug 16, 2022
- Landing AI
- Dongyan Wang
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Grant
Method for ranking fault-test pairs based on waveform statistics in...
- Patent number 9,658,947
- Issue date May 23, 2017
- Synopsys, Inc.
- Tien-Chun Wei
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and systems for evaluating checker quality of a verificatio...
- Patent number 8,359,559
- Issue date Jan 22, 2013
- Springsoft Inc.
- Kai Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power-aware debugging
- Patent number 8,176,453
- Issue date May 8, 2012
- Springsoft USA, Inc.
- Kai Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stabilizing fluorine etching of low-k materials
- Patent number 7,132,363
- Issue date Nov 7, 2006
- Advanced Micro Devices, Inc.
- Kai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned gate formation using polysilicon polish with periphera...
- Patent number 6,924,220
- Issue date Aug 2, 2005
- Advanced Micro Devices, Inc.
- Kai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned semiconductor interconnect barrier and manufacturing m...
- Patent number 6,734,559
- Issue date May 11, 2004
- Advanced Micro Devices, Inc.
- Kai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor abrasiveless chemical-mechanical polishing in integrated...
- Patent number 6,699,785
- Issue date Mar 2, 2004
- Advanced Micro Devices, Inc.
- Kai Yang
- B24 - GRINDING POLISHING
Information Patent Grant
Fully depleted SOI device with tungsten damascene contacts and meth...
- Patent number 6,605,843
- Issue date Aug 12, 2003
- Advanced Micro Devices, Inc.
- Zoran Krivokapic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemically preventing Cu dendrite formation and growth by immersion
- Patent number 6,596,637
- Issue date Jul 22, 2003
- Advanced Micro Devices, Inc.
- Diana M. Schonauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnection structure with dummy vias
- Patent number 6,468,894
- Issue date Oct 22, 2002
- Advanced Micro Devices, Inc.
- Kai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recess metallization via selective insulator formation on nucleatio...
- Patent number 6,410,418
- Issue date Jun 25, 2002
- Advanced Micro Devices, Inc.
- Kai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask-less differential etching and planarization of copper films
- Patent number 6,410,442
- Issue date Jun 25, 2002
- Advanced Micro Devices, Inc.
- Kai Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical-mechanical polishing of semiconductors
- Patent number 6,350,678
- Issue date Feb 26, 2002
- Advanced Micro Devices, Inc.
- Shekhar Pramanick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating improved copper metallization including formi...
- Patent number 6,350,687
- Issue date Feb 26, 2002
- Advanced Micro Devices, Inc.
- Steven C. Avanzino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry for chemical mechanical polishing of copper
- Patent number 6,332,989
- Issue date Dec 25, 2001
- Advanced Micro Devices, Inc.
- Kai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemically preventing copper dendrite formation and growth by spraying
- Patent number 6,319,833
- Issue date Nov 20, 2001
- Advanced Micro Devices, Inc.
- Diana M. Schonauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy patterning for semiconductor manufacturing processes
- Patent number 6,259,115
- Issue date Jul 10, 2001
- Advanced Micro Devices, Inc.
- Lu You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper dendrite prevention by chemical removal of dielectric
- Patent number 6,218,290
- Issue date Apr 17, 2001
- Advanced Micro Devices, Inc.
- Diana M. Schonauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of Cu dendrite formation and growth
- Patent number 6,207,569
- Issue date Mar 27, 2001
- Advanced Micro Devices, Inc.
- Diana M. Schonauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemically preventing Cu dendrite formation and growth by double si...
- Patent number 6,197,690
- Issue date Mar 6, 2001
- Advanced Micro Devices, Inc.
- Diana M. Schonauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preventing Cu dendrite formation and growth
- Patent number 6,177,349
- Issue date Jan 23, 2001
- Advanced Micro Devices, Inc.
- Diana M. Schonauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemically removable Cu CMP slurry abrasive
- Patent number 6,169,034
- Issue date Jan 2, 2001
- Advanced Micro Devices, Inc.
- Steven C. Avanzino
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chemical treatment for preventing copper dendrite formation and growth
- Patent number 6,162,727
- Issue date Dec 19, 2000
- Advanced Micro Devices, Inc.
- Diana M. Schonauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry for chemical mechanical polishing of copper
- Patent number 6,143,656
- Issue date Nov 7, 2000
- Advanced Micro Devices, Inc.
- Kai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemically removable Cu CMP slurry abrasive
- Patent number 6,140,239
- Issue date Oct 31, 2000
- Advanced Micro Devices, Inc.
- Steven C. Avanzino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feedback loop for selective conditioning of chemical mechanical pol...
- Patent number 6,113,462
- Issue date Sep 5, 2000
- Advanced Micro Devices, Inc.
- Kai Yang
- B24 - GRINDING POLISHING
Information Patent Grant
Electroplating uniformity by diffuser design
- Patent number 6,103,085
- Issue date Aug 15, 2000
- Advanced Micro Devices, Inc.
- Christy Mei-Chu Woo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of preventing copper dendrite formation and growth
- Patent number 6,074,949
- Issue date Jun 13, 2000
- Advanced Micro Devices, Inc.
- Diana M. Schonauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
GUIDED WORKFLOW FOR DEEP LEARNING ERROR ANALYSIS
- Publication number 20230136672
- Publication date May 4, 2023
- Landing AI
- Mark William Sabini
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Model Management System for Improving Training Data Through Machine...
- Publication number 20220300855
- Publication date Sep 22, 2022
- Daniel Bibireata
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
AI-Optimized Harvester Configured to Maximize Yield and Minimize Im...
- Publication number 20210120736
- Publication date Apr 29, 2021
- Landing AI
- Dongyan Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
AI-Optimized Harvester Configured to Maximize Yield and Minimize Im...
- Publication number 20210120737
- Publication date Apr 29, 2021
- Landing AI
- Dongyan Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for Ranking Fault-Test Pairs Based on Waveform Statistics in...
- Publication number 20140136900
- Publication date May 15, 2014
- Synopsys, Inc.
- Tien-Chun Wei
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Methods and Systems for Evaluating Checker Quality of a Verificatio...
- Publication number 20110302541
- Publication date Dec 8, 2011
- SPRINGSOFT INC.
- Kai Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER-AWARE DEBUGGING
- Publication number 20100192115
- Publication date Jul 29, 2010
- SPRINGSOFT USA, INC.
- Kai Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Damascene processing using dielectric barrier films
- Publication number 20070035025
- Publication date Feb 15, 2007
- Advanced Micro Devices, Inc.
- Kai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Measurement of Thickness Profile and Elastic Modulus Profile of a P...
- Publication number 20060196283
- Publication date Sep 7, 2006
- Kai Yang
- B24 - GRINDING POLISHING
Information Patent Application
Conductor abrasiveless chemical-mechanical polishing in integrated...
- Publication number 20030146512
- Publication date Aug 7, 2003
- Kai Yang
- B24 - GRINDING POLISHING
Information Patent Application
Conductor chemical-mechanical polishing in integrated circuit inter...
- Publication number 20020173140
- Publication date Nov 21, 2002
- Kashmir S. Sahota
- B24 - GRINDING POLISHING
Information Patent Application
Stabilizing fluorine etching of low-k materials
- Publication number 20020140101
- Publication date Oct 3, 2002
- Advanced Micro Devices, Inc.
- Kai Yang
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

AI-optimized harvester configured to maximize yield and minimize im...

AI-optimized harvester configured to maximize yield and minimize im...

Method for ranking fault-test pairs based on waveform statistics in...

Methods and systems for evaluating checker quality of a verificatio...

Power-aware debugging

Stabilizing fluorine etching of low-k materials

Self-aligned gate formation using polysilicon polish with periphera...

Self-aligned semiconductor interconnect barrier and manufacturing m...

Conductor abrasiveless chemical-mechanical polishing in integrated...

Fully depleted SOI device with tungsten damascene contacts and meth...

Chemically preventing Cu dendrite formation and growth by immersion

Metal interconnection structure with dummy vias

Recess metallization via selective insulator formation on nucleatio...

Mask-less differential etching and planarization of copper films

Chemical-mechanical polishing of semiconductors

Method of fabricating improved copper metallization including formi...

Slurry for chemical mechanical polishing of copper

Chemically preventing copper dendrite formation and growth by spraying

Dummy patterning for semiconductor manufacturing processes

Copper dendrite prevention by chemical removal of dielectric

Prevention of Cu dendrite formation and growth

Chemically preventing Cu dendrite formation and growth by double si...

Preventing Cu dendrite formation and growth

Chemically removable Cu CMP slurry abrasive

Chemical treatment for preventing copper dendrite formation and growth

Slurry for chemical mechanical polishing of copper

Chemically removable Cu CMP slurry abrasive

Feedback loop for selective conditioning of chemical mechanical pol...

Electroplating uniformity by diffuser design

Method of preventing copper dendrite formation and growth

Patents Applicationslast 30 patents

GUIDED WORKFLOW FOR DEEP LEARNING ERROR ANALYSIS

Model Management System for Improving Training Data Through Machine...

AI-Optimized Harvester Configured to Maximize Yield and Minimize Im...

AI-Optimized Harvester Configured to Maximize Yield and Minimize Im...

Method for Ranking Fault-Test Pairs Based on Waveform Statistics in...

Methods and Systems for Evaluating Checker Quality of a Verificatio...

POWER-AWARE DEBUGGING

Damascene processing using dielectric barrier films

Measurement of Thickness Profile and Elastic Modulus Profile of a P...

Conductor abrasiveless chemical-mechanical polishing in integrated...

Conductor chemical-mechanical polishing in integrated circuit inter...

Stabilizing fluorine etching of low-k materials