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KAMALESH K. SRIVASTAVA
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WAPPINGERS FALLS, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
Patent number
11,244,917
Issue date
Feb 8, 2022
International Business Machines Corporation
Virendra R. Jadhav
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
Patent number
11,171,102
Issue date
Nov 9, 2021
International Business Machines Corporation
Virendra R. Jadhav
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
Patent number
11,094,657
Issue date
Aug 17, 2021
International Business Machines Corporation
Virendra R. Jadhav
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
Patent number
10,403,590
Issue date
Sep 3, 2019
International Business Machines Corporation
Virendra R. Jadhav
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
Patent number
10,396,051
Issue date
Aug 27, 2019
International Business Machines Corporation
Virendra R. Jadhav
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
Patent number
9,640,501
Issue date
May 2, 2017
International Business Machines Corporation
Virendra R. Jadhav
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
Patent number
9,472,520
Issue date
Oct 18, 2016
International Business Machines Corporation
Virendra R. Jadhav
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
Patent number
9,111,816
Issue date
Aug 18, 2015
International Business Machines Corporation
Virendra R. Jadhav
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
Patent number
8,910,853
Issue date
Dec 16, 2014
International Business Machines Corporation
Charles L. Arvin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
Patent number
8,493,746
Issue date
Jul 23, 2013
International Business Machines Corporation
Charles L. Arvin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interconnections for flip-chip using lead-free solders and having i...
Patent number
8,314,500
Issue date
Nov 20, 2012
Ultratech, Inc.
Luc Belanger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
Patent number
8,293,587
Issue date
Oct 23, 2012
International Business Machines Corporation
Virendra R Jadhav
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Optimization of metallurgical properties of a solder joint
Patent number
8,197,612
Issue date
Jun 12, 2012
International Business Machines Corporation
James A Busby
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip-chip assembly with organic chip carrier having mushroom-plated...
Patent number
7,952,207
Issue date
May 31, 2011
International Business Machines Corporation
Virendra R. Jadhav
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interconnection for flip-chip using lead-free solders and having im...
Patent number
7,932,169
Issue date
Apr 26, 2011
International Business Machines Corporation
Luc Belanger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and process for reducing undercooling in a lead-free tin-ric...
Patent number
7,784,669
Issue date
Aug 31, 2010
International Business Machines Corporation
Gareth G. Hougham
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Forming robust solder interconnect structures by reducing effects o...
Patent number
7,767,575
Issue date
Aug 3, 2010
Tessera Intellectual Properties, Inc.
Kamalesh K. Srivastava
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and process for reducing undercooling in a lead-free tin-ric...
Patent number
7,703,661
Issue date
Apr 27, 2010
International Business Machines Corporation
Gareth G. Hougham
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of forming a bond pad on an I/C chip and resulting structure
Patent number
7,572,726
Issue date
Aug 11, 2009
International Business Machines Corporation
Julie C. Biggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming robust solder interconnect structures by reducin...
Patent number
7,473,997
Issue date
Jan 6, 2009
International Business Machines Corporation
Kamalesh K. Srivastava
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process of etching a titanium/tungsten surface and etchant used the...
Patent number
7,425,278
Issue date
Sep 16, 2008
International Business Machines Corporation
Krystyna Waleria Semkow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for selective electroplating of semiconductor device I/O pad...
Patent number
7,144,490
Issue date
Dec 5, 2006
International Business Machines Corporation
Tien-Jen Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming robust solder interconnect structures by reducin...
Patent number
6,995,084
Issue date
Feb 7, 2006
International Business Machines Corporation
Kamalesh K. Srivastava
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
I/C chip suitable for wire bonding
Patent number
6,995,475
Issue date
Feb 7, 2006
International Business Machines Corporation
Julie C. Biggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual damascene flowable oxide insulation structure and metallic bar...
Patent number
6,727,589
Issue date
Apr 27, 2004
International Business Machines Corporation
Stephen E. Greco
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low impedance power distribution structure for a semiconductor chip...
Patent number
6,661,100
Issue date
Dec 9, 2003
International Business Machines Corporation
Brent A. Anderson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sacrificial seed layer process for forming C4 solder bumps
Patent number
6,622,907
Issue date
Sep 23, 2003
International Business Machines Corporation
Lisa A. Fanti
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Reactive Ion Etching chamber design for flip chip interconnections
Patent number
6,531,069
Issue date
Mar 11, 2003
International Business Machines Corporation
Kamalesh K. Srivastava
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interim oxidation of silsesquioxane dielectric for dual damascene p...
Patent number
6,479,884
Issue date
Nov 12, 2002
International Business Machines Corporation
Robert Cook
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
In situ formation of protective layer on silsesquioxane dielectric...
Patent number
6,348,736
Issue date
Feb 19, 2002
International Business Machines Corporation
Vincent J. McGahay
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
Publication number
20190326242
Publication date
Oct 24, 2019
International Business Machines Corporation
Virendra R. JADHAV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
Publication number
20190326243
Publication date
Oct 24, 2019
International Business Machines Corporation
Virendra R. JADHAV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
Publication number
20190157230
Publication date
May 23, 2019
International Business Machines Corporation
Virendra R. JADHAV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
Publication number
20170170135
Publication date
Jun 15, 2017
International Business Machines Corporation
Virendra R. JADHAV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
Publication number
20170133338
Publication date
May 11, 2017
International Business Machines Corporation
Virendra R. JADHAV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
Publication number
20150054152
Publication date
Feb 26, 2015
International Business Machines Corporation
Virendra R. JADHAV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
Publication number
20130284495
Publication date
Oct 31, 2013
Charles L. Arvin
B82 - NANO-TECHNOLOGY
Information
Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
Publication number
20120312447
Publication date
Dec 13, 2012
International Business Machines Corporation
Virendra R. JADHAV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
Publication number
20120181071
Publication date
Jul 19, 2012
International Business Machines Corporation
VIRENDRA R. JADHAV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CREATION OF LEAD-FREE SOLDER JOINT WITH INTERMETALLICS
Publication number
20120083113
Publication date
Apr 5, 2012
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP ASSEMBLY WITH ORGANIC CHIP CARRIER HAVING MUSHROOM-PLATED...
Publication number
20110195543
Publication date
Aug 11, 2011
International Business Machines Corporation
Virendra R. Jadhav
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
Publication number
20100200271
Publication date
Aug 12, 2010
International Business Machines Corporation
Charles L. Arvin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RIC...
Publication number
20100155456
Publication date
Jun 24, 2010
International Business Machines Corp.
GARETH G. HOUGHAM
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Interconnection for flip-chip using lead-free solders and having im...
Publication number
20100062597
Publication date
Mar 11, 2010
Luc Belanger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTIMIZATION OF METALLURGICAL PROPERTIES OF A SOLDER JOINT
Publication number
20090266447
Publication date
Oct 29, 2009
International Business Machines Corporation
JAMES A. BUSBY
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERL...
Publication number
20090197103
Publication date
Aug 6, 2009
Da-Yuan Shih
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERL...
Publication number
20090197114
Publication date
Aug 6, 2009
Da-Yuan Shih
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCING EFFECTS O...
Publication number
20090163019
Publication date
Jun 25, 2009
International Business Machines Corporation
Kamalesh K. Srivastava
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP ASSEMBLY WITH ORGANIC CHIP CARRIER HAVING MUSHROOM-PLATED...
Publication number
20090146316
Publication date
Jun 11, 2009
International Business Machines Corporation
Virendra R. Jadhav
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
Publication number
20090095502
Publication date
Apr 16, 2009
International Business Machines Corporation
VIRENDRA R. JADHAV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RIC...
Publication number
20080290142
Publication date
Nov 27, 2008
International Business Machines Corporation
Gareth G. Hougham
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING I...
Publication number
20080157395
Publication date
Jul 3, 2008
Luc Belanger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESS OF ETCHING A TITANIUM/TUNGSTEN SURFACE AND ETCHANT USED THE...
Publication number
20080124939
Publication date
May 29, 2008
International Business Machines Corporation
Krystyna Waleria Semkow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR IMPROVED COPPER LAYER ETCHING OF WAFERS WITH C4 CONNECTI...
Publication number
20080119056
Publication date
May 22, 2008
International Business Machines Corporation
Carla A. Bailey
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTORS AND METHODS OF MAKING
Publication number
20070080455
Publication date
Apr 12, 2007
International Business Machines Corporation
Donna S. Zupanski-Nielsen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Device with area array pads for test probing
Publication number
20060249854
Publication date
Nov 9, 2006
Tien-Jen Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming a bond pad on an I/C chip and resulting structure
Publication number
20060081981
Publication date
Apr 20, 2006
International Business Machines Corporation
Julie C. Biggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCIN...
Publication number
20060009022
Publication date
Jan 12, 2006
International Business Machines Corporation
Kamalesh K. Srivastava
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCIN...
Publication number
20050208748
Publication date
Sep 22, 2005
International Business Machines Corporation
Kamalesh K. Srivastava
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE WITH AREA ARRAY PADS FOR TEST PROBING
Publication number
20050167837
Publication date
Aug 4, 2005
International Business Machines Corporation
Tien-Jen Cheng
H01 - BASIC ELECTRIC ELEMENTS