Kambiz SAMADI

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hard macro having blockage sites, integrated circuit including same...
- Patent number 11,004,780
- Issue date May 11, 2021
- QUALCOMM Incorporated
- Kambiz Samadi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hard macro having blockage sites, integrated circuit including same...
- Patent number 10,510,651
- Issue date Dec 17, 2019
- QUALCOMM Incorporated
- Kambiz Samadi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hard macro having blockage sites, integrated circuit including same...
- Patent number 10,192,813
- Issue date Jan 29, 2019
- QUALCOMM Incorporated
- Kambiz Samadi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-processor core three-dimensional (3D) integrated circuits (IC...
- Patent number 10,176,147
- Issue date Jan 8, 2019
- QUALCOMM Incorporated
- Kambiz Samadi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power distribution networks for a three-dimensional (3D) integrated...
- Patent number 10,121,743
- Issue date Nov 6, 2018
- QUALCOMM Incorporated
- Pratyush Kamal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection propagation for inter-logical block connections in integ...
- Patent number 9,929,733
- Issue date Mar 27, 2018
- QUALCOMM Incorporated
- Pratyush Kamal
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power gate placement techniques in three-dimensional (3D) integrate...
- Patent number 9,754,923
- Issue date Sep 5, 2017
- QUALCOMM Incorporated
- Jing Xie
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power delivery network (PDN) design for monolithic three-dimensiona...
- Patent number 9,741,691
- Issue date Aug 22, 2017
- QUALCOMM Incorporated
- Sung Kyu Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory controller placement in a three-dimensional (3D) integrated...
- Patent number 9,626,311
- Issue date Apr 18, 2017
- QUALCOMM Incorporated
- Sung Kyu Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Techniques for implementing a synthetic jet to cool a device
- Patent number 9,629,233
- Issue date Apr 18, 2017
- QUALCOMM Incorporated
- Mehdi Saeidi
- G05 - CONTROLLING REGULATING
Information Patent Grant
Memory controller placement in a three-dimensional (3D) integrated...
- Patent number 9,569,380
- Issue date Feb 14, 2017
- QUALCOMM Incorporated
- Sung Kyu Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Clock tree synthesis for low cost pre-bond testing of 3D integrated...
- Patent number 9,508,615
- Issue date Nov 29, 2016
- QUALCOMM Incorporated
- Sung Kyu Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intellectual property block design with folded blocks and duplicate...
- Patent number 9,483,598
- Issue date Nov 1, 2016
- QUALCOMM Incorporated
- Sung Kyu Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Monolithic three dimensional (3D) integrated circuits (ICs) (3DICs)...
- Patent number 9,147,438
- Issue date Sep 29, 2015
- QUALCOMM Incorporated
- Pratyush Kamal
- G11 - INFORMATION STORAGE
Information Patent Grant
Placement of monolithic inter-tier vias (MIVs) within monolithic th...
- Patent number 9,123,721
- Issue date Sep 1, 2015
- QUALCOMM Incorporated
- Kambiz Samadi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Clock distribution network for 3D integrated circuit
- Patent number 9,098,666
- Issue date Aug 4, 2015
- QUALCOMM Incorporated
- Kambiz Samadi
- G11 - INFORMATION STORAGE
Information Patent Grant
3D floorplanning using 2D and 3D blocks
- Patent number 9,064,077
- Issue date Jun 23, 2015
- QUALCOMM Incorporated
- Kambiz Samadi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flip-flops in a monolithic three-dimensional (3D) integrated circui...
- Patent number 9,041,448
- Issue date May 26, 2015
- QUALCOMM Incorporated
- Yang Du
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
HARD MACRO HAVING BLOCKAGE SITES, INTEGRATED CIRCUIT INCLUDING SAME...
- Publication number 20200105652
- Publication date Apr 2, 2020
- QUALCOMM Incorporated
- Kambiz Samadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING INTEGRATION OF DIE TO DIE WITH POLYMER PLANARIZAT...
- Publication number 20190259677
- Publication date Aug 22, 2019
- QUALCOMM Incorporated
- Jon LASITER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARD MACRO HAVING BLOCKAGE SITES, INTEGRATED CIRCUIT INCLUDING SAME...
- Publication number 20190122973
- Publication date Apr 25, 2019
- QUALCOMM Incorporated
- Kambiz Samadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION NETWORKS FOR A THREE-DIMENSIONAL (3D) INTEGRATED...
- Publication number 20190027435
- Publication date Jan 24, 2019
- QUALCOMM Incorporated
- Pratyush Kamal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION NETWORKS FOR A THREE-DIMENSIONAL (3D) INTEGRATED...
- Publication number 20180286800
- Publication date Oct 4, 2018
- QUALCOMM Incorporated
- Pratyush Kamal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PROCESSOR CORE THREE-DIMENSIONAL (3D) INTEGRATED CIRCUITS (IC...
- Publication number 20180260360
- Publication date Sep 13, 2018
- QUALCOMM Incorporated
- Kambiz Samadi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENHANCEMENT OF CHIP THERMAL PERFORMANCE THROUGH SILICON THERMAL CON...
- Publication number 20170092558
- Publication date Mar 30, 2017
- QUALCOMM Incorporated
- Arpit MITTAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR IMPLEMENTING A SYNTHETIC JET TO COOL A DEVICE
- Publication number 20160360606
- Publication date Dec 8, 2016
- QUALCOMM Incorporated
- Mehdi SAEIDI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER DELIVERY NETWORK (PDN) DESIGN FOR MONOLITHIC THREE-DIMENSIONA...
- Publication number 20160322331
- Publication date Nov 3, 2016
- QUALCOMM Incorporated
- Sung Kyu LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLECTUAL PROPERTY BLOCK DESIGN WITH FOLDED BLOCKS AND DUPLICATE...
- Publication number 20160232271
- Publication date Aug 11, 2016
- QUALCOMM Incorporated
- Sung Kyu LIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CLOCK TREE SYNTHESIS FOR LOW COST PRE-BOND TESTING OF 3D INTEGRATED...
- Publication number 20160233134
- Publication date Aug 11, 2016
- QUALCOMM Incorporated
- Sung Kyu LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CONTROLLER PLACEMENT IN A THREE-DIMENSIONAL (3D) INTEGRATED...
- Publication number 20160217087
- Publication date Jul 28, 2016
- QUALCOMM Incorporated
- Sung Kyu Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH QUALITY PHYSICAL DESIGN FOR MONOLITHIC THREE-DIMENSIONAL INTEG...
- Publication number 20160042110
- Publication date Feb 11, 2016
- QUALCOMM Incorporated
- Sung Kyu LIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PLACEMENT OF MONOLITHIC INTER-TIER VIAS (MIVs) WITHIN MONOLITHIC TH...
- Publication number 20150333005
- Publication date Nov 19, 2015
- QUALCOMM Incorporated
- Kambiz Samadi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PLACEMENT OF MONOLITHIC INTER-TIER VIAS (MIVs) WITHIN MONOLITHIC TH...
- Publication number 20150145143
- Publication date May 28, 2015
- QUALCOMM Incorporated
- Kambiz Samadi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MONOLITHIC THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs)...
- Publication number 20150109843
- Publication date Apr 23, 2015
- QUALCOMM Incorporated
- Pratyush Kamal
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS OF DESIGNING THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (IC...
- Publication number 20150112646
- Publication date Apr 23, 2015
- QUALCOMM Incorporated
- Pratyush Kamal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIGITAL TEMPERATURE ESTIMATORS (DTEs) DISPOSED IN INTEGRATED CIRCUI...
- Publication number 20150103866
- Publication date Apr 16, 2015
- QUALCOMM Incorporated
- Kambiz Samadi
- G01 - MEASURING TESTING
Information Patent Application
FLIP-FLOPS IN A MONOLITHIC THREE-DIMENSIONAL (3D) INTEGRATED CIRCUI...
- Publication number 20140253196
- Publication date Sep 11, 2014
- QUALCOMM Incorporated
- Yang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOCK DISTRIBUTION NETWORK FOR 3D INTEGRATED CIRCUIT
- Publication number 20140145347
- Publication date May 29, 2014
- QUALCOMM Incorporated
- Kambiz Samadi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D FLOORPLANNING USING 2D AND 3D BLOCKS
- Publication number 20140149958
- Publication date May 29, 2014
- QUALCOMM Incorporated
- Kambiz Samadi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HARD MACRO HAVING BLOCKAGE SITES, INTEGRATED CIRCUIT INCLUDING SAME...
- Publication number 20140131885
- Publication date May 15, 2014
- QUALCOMM Incorporated
- Kambiz Samadi
- G06 - COMPUTING CALCULATING COUNTING

Kambiz SAMADI

Person

Patents Grantslast 30 patents

Hard macro having blockage sites, integrated circuit including same...

Hard macro having blockage sites, integrated circuit including same...

Hard macro having blockage sites, integrated circuit including same...

Multi-processor core three-dimensional (3D) integrated circuits (IC...

Power distribution networks for a three-dimensional (3D) integrated...

Connection propagation for inter-logical block connections in integ...

Power gate placement techniques in three-dimensional (3D) integrate...

Power delivery network (PDN) design for monolithic three-dimensiona...

Memory controller placement in a three-dimensional (3D) integrated...

Techniques for implementing a synthetic jet to cool a device

Memory controller placement in a three-dimensional (3D) integrated...

Clock tree synthesis for low cost pre-bond testing of 3D integrated...

Intellectual property block design with folded blocks and duplicate...

Monolithic three dimensional (3D) integrated circuits (ICs) (3DICs)...

Placement of monolithic inter-tier vias (MIVs) within monolithic th...

Clock distribution network for 3D integrated circuit

3D floorplanning using 2D and 3D blocks

Flip-flops in a monolithic three-dimensional (3D) integrated circui...

Patents Applicationslast 30 patents

HARD MACRO HAVING BLOCKAGE SITES, INTEGRATED CIRCUIT INCLUDING SAME...

DEVICE COMPRISING INTEGRATION OF DIE TO DIE WITH POLYMER PLANARIZAT...

HARD MACRO HAVING BLOCKAGE SITES, INTEGRATED CIRCUIT INCLUDING SAME...

POWER DISTRIBUTION NETWORKS FOR A THREE-DIMENSIONAL (3D) INTEGRATED...

POWER DISTRIBUTION NETWORKS FOR A THREE-DIMENSIONAL (3D) INTEGRATED...

MULTI-PROCESSOR CORE THREE-DIMENSIONAL (3D) INTEGRATED CIRCUITS (IC...

ENHANCEMENT OF CHIP THERMAL PERFORMANCE THROUGH SILICON THERMAL CON...

TECHNIQUES FOR IMPLEMENTING A SYNTHETIC JET TO COOL A DEVICE

POWER DELIVERY NETWORK (PDN) DESIGN FOR MONOLITHIC THREE-DIMENSIONA...

INTELLECTUAL PROPERTY BLOCK DESIGN WITH FOLDED BLOCKS AND DUPLICATE...

CLOCK TREE SYNTHESIS FOR LOW COST PRE-BOND TESTING OF 3D INTEGRATED...

MEMORY CONTROLLER PLACEMENT IN A THREE-DIMENSIONAL (3D) INTEGRATED...

HIGH QUALITY PHYSICAL DESIGN FOR MONOLITHIC THREE-DIMENSIONAL INTEG...

PLACEMENT OF MONOLITHIC INTER-TIER VIAS (MIVs) WITHIN MONOLITHIC TH...

PLACEMENT OF MONOLITHIC INTER-TIER VIAS (MIVs) WITHIN MONOLITHIC TH...

MONOLITHIC THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs)...

METHODS OF DESIGNING THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (IC...

DIGITAL TEMPERATURE ESTIMATORS (DTEs) DISPOSED IN INTEGRATED CIRCUI...

FLIP-FLOPS IN A MONOLITHIC THREE-DIMENSIONAL (3D) INTEGRATED CIRCUI...

CLOCK DISTRIBUTION NETWORK FOR 3D INTEGRATED CIRCUIT

3D FLOORPLANNING USING 2D AND 3D BLOCKS

HARD MACRO HAVING BLOCKAGE SITES, INTEGRATED CIRCUIT INCLUDING SAME...