Kan-Jung Chia

Person

Hsin-feng, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating packaging structure having embedded semicond...
- Patent number 8,999,759
- Issue date Apr 7, 2015
- Unimicron Technology Corporation
- Kan-Jung Chia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging structure having embedded semiconductor element
- Patent number 8,461,689
- Issue date Jun 11, 2013
- Unimicron Technology Corporation
- Kan-Jung Chia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate having semiconductor component embedded therein a...
- Patent number 8,129,835
- Issue date Mar 6, 2012
- Unimicron Technology Corp.
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having embedded photosensitive semiconductor chip...
- Patent number 8,129,829
- Issue date Mar 6, 2012
- Unimicron Technology Corp.
- Shin-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate embedded with semiconductor component
- Patent number 8,058,718
- Issue date Nov 15, 2011
- Unimicron Technology Corp.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure in which coreless substrate has direct electrical...
- Patent number 8,058,723
- Issue date Nov 15, 2011
- Phoenix Precision Technology Corporation
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate structure with a semiconductor chip embedded th...
- Patent number 8,035,127
- Issue date Oct 11, 2011
- Unimicron Technology Corp.
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having embedded semiconductor chip and fabricatio...
- Patent number 7,973,397
- Issue date Jul 5, 2011
- Unimicron Technology Corp.
- Shin-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure having electronic components integrated the...
- Patent number 7,969,745
- Issue date Jun 28, 2011
- Unimicron Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor device and fabricating method thereof
- Patent number 7,902,676
- Issue date Mar 8, 2011
- Unimicron Technology Corp.
- Kan-Jung Chia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier structure embedded with semiconductor chips and method for...
- Patent number 7,829,987
- Issue date Nov 9, 2010
- Unimicron Technology Corp.
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure embedded with semiconductor chip
- Patent number 7,768,119
- Issue date Aug 3, 2010
- Phoenix Precision Technology Corporation
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having semiconductor chip embedded therein and me...
- Patent number 7,705,446
- Issue date Apr 27, 2010
- Phoenix Precision Technology Corporation
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure with embedded electronic components
- Patent number 7,639,473
- Issue date Dec 29, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plate structure having chip embedded therein and the manufacturing...
- Patent number 7,598,610
- Issue date Oct 6, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with circuits directly connected to semiconductor...
- Patent number 7,582,961
- Issue date Sep 1, 2009
- Phoenix Precision Technology Corporation
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 7,579,690
- Issue date Aug 25, 2009
- Phoenix Precision Technology Corporation
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING PACKAGING STRUCTURE HAVING EMBEDDED SEMICOND...
- Publication number 20130252380
- Publication date Sep 26, 2013
- Unimicron Technology Corporation
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING SEMICONDUCTOR COMPONENT EMBEDDED THEREIN A...
- Publication number 20110057305
- Publication date Mar 10, 2011
- Phoenix Precision Technology Corporation
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE HAVING EMBEDDED SEMICONDUCTOR ELEMENT AND METHO...
- Publication number 20110057323
- Publication date Mar 10, 2011
- Unimicron Technology Corporation
- Kan-Jung Chia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE HAVING EMBEDDED SEMICONDUCTOR CHIP
- Publication number 20110031606
- Publication date Feb 10, 2011
- Unimicron Technology Corporation
- Yen-Ju Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED PHOTOSENSITIVE SEMICONDUCTOR CHIP...
- Publication number 20090309179
- Publication date Dec 17, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED SEMICONDUCTOR CHIP AND FABRICATIO...
- Publication number 20090309202
- Publication date Dec 17, 2009
- Phoenix Precision Technology Corporation
- Shin-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package structure in which coreless substrate has direct electrical...
- Publication number 20090236750
- Publication date Sep 24, 2009
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE EMBEDDED WITH SEMICONDUCTOR COMPONENT
- Publication number 20090168380
- Publication date Jul 2, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE EMBEDDED WITH SEMICONDUCTOR COMPONENT
- Publication number 20090166841
- Publication date Jul 2, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package on package structure
- Publication number 20090102039
- Publication date Apr 23, 2009
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20090090541
- Publication date Apr 9, 2009
- Phoenix Precision Technology Corporation
- Kan-Jung Chia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20090051024
- Publication date Feb 26, 2009
- Phoenix Precision Technology Corporation
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE HAVING CHIP EMBEDDED THEREIN AND MANUFACTURING...
- Publication number 20090032930
- Publication date Feb 5, 2009
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of semiconductor chip and package structure having semico...
- Publication number 20080251915
- Publication date Oct 16, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Shih-Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP EMBEDDING STRUCTURE
- Publication number 20080237836
- Publication date Oct 2, 2008
- Phoenix Precision Technology Corporation
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier plate structure havign a chip embedded therein and the manu...
- Publication number 20080185704
- Publication date Aug 7, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE WITH CIRCUITS DIRECTLY CONNECTED TO SEMICONDUCTOR...
- Publication number 20080179725
- Publication date Jul 31, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE HAVING ELECTRONIC COMPONENTS INTEGRATED THE...
- Publication number 20080165515
- Publication date Jul 10, 2008
- Phoenix Precision Technology Corporation
- Shih-Ping HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plate structure having chip embedded therein and the manufacturing...
- Publication number 20080164597
- Publication date Jul 10, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH EMBEDDED ELECTRONIC COMPONENTS
- Publication number 20080151518
- Publication date Jun 26, 2008
- Phoenix Precision Technology Corporation
- Shih-Ping HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier structure embedded with semiconductor chips and method for...
- Publication number 20080150164
- Publication date Jun 26, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier structure embedded with semiconductor chip and method for f...
- Publication number 20080128865
- Publication date Jun 5, 2008
- Phoenix Precission Technology Corporation
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plate structure having chip embedded therein and the manufacturing...
- Publication number 20080029872
- Publication date Feb 7, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE HAVING SEMICONDUCTOR CHIP EMBEDDED THEREIN AND ME...
- Publication number 20080023819
- Publication date Jan 31, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS

Kan-Jung Chia

Person

Patents Grantslast 30 patents

Method for fabricating packaging structure having embedded semicond...

Packaging structure having embedded semiconductor element

Package substrate having semiconductor component embedded therein a...

Package substrate having embedded photosensitive semiconductor chip...

Package substrate embedded with semiconductor component

Package structure in which coreless substrate has direct electrical...

Packaging substrate structure with a semiconductor chip embedded th...

Package substrate having embedded semiconductor chip and fabricatio...

Circuit board structure having electronic components integrated the...

Stacked semiconductor device and fabricating method thereof

Carrier structure embedded with semiconductor chips and method for...

Carrier structure embedded with semiconductor chip

Package structure having semiconductor chip embedded therein and me...

Circuit board structure with embedded electronic components

Plate structure having chip embedded therein and the manufacturing...

Package structure with circuits directly connected to semiconductor...

Semiconductor package structure

Patents Applicationslast 30 patents

METHOD FOR FABRICATING PACKAGING STRUCTURE HAVING EMBEDDED SEMICOND...

PACKAGE SUBSTRATE HAVING SEMICONDUCTOR COMPONENT EMBEDDED THEREIN A...

PACKAGING STRUCTURE HAVING EMBEDDED SEMICONDUCTOR ELEMENT AND METHO...

PACKAGING SUBSTRATE HAVING EMBEDDED SEMICONDUCTOR CHIP

PACKAGE SUBSTRATE HAVING EMBEDDED PHOTOSENSITIVE SEMICONDUCTOR CHIP...

PACKAGE SUBSTRATE HAVING EMBEDDED SEMICONDUCTOR CHIP AND FABRICATIO...

Package structure in which coreless substrate has direct electrical...

PACKAGE SUBSTRATE EMBEDDED WITH SEMICONDUCTOR COMPONENT

PACKAGE SUBSTRATE EMBEDDED WITH SEMICONDUCTOR COMPONENT

Package on package structure

STACKED SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE

PACKAGING SUBSTRATE HAVING CHIP EMBEDDED THEREIN AND MANUFACTURING...

Structure of semiconductor chip and package structure having semico...

SEMICONDUCTOR CHIP EMBEDDING STRUCTURE

Carrier plate structure havign a chip embedded therein and the manu...

PACKAGE STRUCTURE WITH CIRCUITS DIRECTLY CONNECTED TO SEMICONDUCTOR...

CIRCUIT BOARD STRUCTURE HAVING ELECTRONIC COMPONENTS INTEGRATED THE...

Plate structure having chip embedded therein and the manufacturing...

CIRCUIT BOARD STRUCTURE WITH EMBEDDED ELECTRONIC COMPONENTS

Carrier structure embedded with semiconductor chips and method for...

Carrier structure embedded with semiconductor chip and method for f...

Plate structure having chip embedded therein and the manufacturing...

PACKAGE STRUCTURE HAVING SEMICONDUCTOR CHIP EMBEDDED THEREIN AND ME...