Kan Zhang

Person

HILLSBORO, OR, US

People

Patents Applicationslast 30 patents

Information Patent Application
METAL-ALL-AROUND CONTACT STRUCTURE COUPLED WITH A SOURCE OR DRAIN R...
- Publication number 20250212463
- Publication date Jun 26, 2025
- Intel Corporation
- Robin Chao
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH SEMICONDUCTOR STRUCTURE EXTENDING AC...
- Publication number 20250203975
- Publication date Jun 19, 2025
- Guowei Xu
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH CO-METALIZED ELECTRICAL CONTACT
- Publication number 20250204000
- Publication date Jun 19, 2025
- Intel Corporation
- Kan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH DIELECTRIC CUT AT N-P BOUNDARY
- Publication number 20250204035
- Publication date Jun 19, 2025
- Intel Corporation
- Yang Zhang
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH TRANSISTOR GATE-CHANNEL ARRANGEM...
- Publication number 20250194070
- Publication date Jun 12, 2025
- Tao Chu
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE CONTACTS AND ASYMMETRIC...
- Publication number 20250194179
- Publication date Jun 12, 2025
- Tao Chu
Information Patent Application
CONDUCTIVE VIA WITH FRONT-SIDE AND BACK-SIDE CONNECTIONS WITH A SOU...
- Publication number 20250194211
- Publication date Jun 12, 2025
- Intel Corporation
- Ting-Hsiang Hung
Information Patent Application
BACK-SIDE NANORIBBON REMOVAL
- Publication number 20250176255
- Publication date May 29, 2025
- Intel Corporation
- Chiao-Ti Huang
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH DIFFERENT NANORIBBON THICKNESSES
- Publication number 20250169130
- Publication date May 22, 2025
- Intel Corporation
- Tao Chu
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH SELF-ALIGNED VIA-TO-JUMPER CONNECTIONS
- Publication number 20250142948
- Publication date May 1, 2025
- Intel Corporation
- Robin Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH BACKSIDE SEMICONDUCTOR STRUCTURES
- Publication number 20250140649
- Publication date May 1, 2025
- Intel Corporation
- Feng Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Applicationslast 30 patents

METAL-ALL-AROUND CONTACT STRUCTURE COUPLED WITH A SOURCE OR DRAIN R...

INTEGRATED CIRCUIT DEVICE WITH SEMICONDUCTOR STRUCTURE EXTENDING AC...

INTEGRATED CIRCUIT DEVICE WITH CO-METALIZED ELECTRICAL CONTACT

INTEGRATED CIRCUIT DEVICE WITH DIELECTRIC CUT AT N-P BOUNDARY

INTEGRATED CIRCUIT STRUCTURES WITH TRANSISTOR GATE-CHANNEL ARRANGEM...

INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE CONTACTS AND ASYMMETRIC...

CONDUCTIVE VIA WITH FRONT-SIDE AND BACK-SIDE CONNECTIONS WITH A SOU...

BACK-SIDE NANORIBBON REMOVAL

INTEGRATED CIRCUIT STRUCTURES WITH DIFFERENT NANORIBBON THICKNESSES

INTEGRATED CIRCUIT DEVICES WITH SELF-ALIGNED VIA-TO-JUMPER CONNECTIONS

INTEGRATED CIRCUIT DEVICES WITH BACKSIDE SEMICONDUCTOR STRUCTURES