Kanae Nakagawa

Person

Sagamihara, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Barrier synchronization circuit, barrier synchronization method, an...
- Patent number 11,709,718
- Issue date Jul 25, 2023
- Fujitsu Limited
- Kanae Nakagawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Barrier synchronization system and parallel information processing...
- Patent number 11,487,593
- Issue date Nov 1, 2022
- Fujitsu Limited
- Kanae Nakagawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermoelectric conversion module, sensor module, and information pr...
- Patent number 10,777,726
- Issue date Sep 15, 2020
- Fujitsu Limited
- Kanae Nakagawa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipating component, manufacturing method for heat dissipat...
- Patent number 10,537,044
- Issue date Jan 14, 2020
- Fujitsu Limited
- Takashi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming bumps, semiconductor device and method for manuf...
- Patent number 8,962,470
- Issue date Feb 24, 2015
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing interposer
- Patent number 8,479,386
- Issue date Jul 9, 2013
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin layer formation method and semiconductor device fabrication m...
- Patent number 8,318,599
- Issue date Nov 27, 2012
- Fujitsu Limited
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method, semiconductor device fabrication method and circuit...
- Patent number 8,058,110
- Issue date Nov 15, 2011
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating method, semiconductor device fabrication method and circuit...
- Patent number 7,927,998
- Issue date Apr 19, 2011
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer and method for manufacturing the same
- Patent number 7,863,524
- Issue date Jan 4, 2011
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, wiring substrate forming method, and substrat...
- Patent number 7,704,856
- Issue date Apr 27, 2010
- Fujitsu Limited
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method, semiconductor device fabrication method and circuit...
- Patent number 7,670,940
- Issue date Mar 2, 2010
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, wiring substrate forming method, and substrat...
- Patent number 7,648,907
- Issue date Jan 19, 2010
- Fujitsu Limited
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an interposer
- Patent number 7,614,142
- Issue date Nov 10, 2009
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, wiring substrate forming method, and substrat...
- Patent number 7,485,962
- Issue date Feb 3, 2009
- Fujitsu Limited
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and method for fabricating the same
- Patent number 7,355,290
- Issue date Apr 8, 2008
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of wiring substrate
- Patent number 7,247,524
- Issue date Jul 24, 2007
- Fujitsu Limited
- Kanae Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface conductive resin, process for forming the same and wiring b...
- Patent number 7,081,304
- Issue date Jul 25, 2006
- Fujitsu Limited
- Kanae Nakagawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface conductive resin, a coaxial cable, a wiring board, and proc...
- Patent number 6,893,681
- Issue date May 17, 2005
- Fujitsu Limited
- Nawalage Florence Cooray
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
BARRIER SYNCHRONIZATION SYSTEM AND PARALLEL INFORMATION PROCESSING...
- Publication number 20210073049
- Publication date Mar 11, 2021
- Fujitsu Limited
- Kanae Nakagawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BARRIER SYNCHRONIZATION CIRCUIT, BARRIER SYNCHRONIZATION METHOD, AN...
- Publication number 20210073048
- Publication date Mar 11, 2021
- Fujitsu Limited
- Kanae Nakagawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMOELECTRIC CONVERSION MODULE, SENSOR MODULE, AND INFORMATION PR...
- Publication number 20170338393
- Publication date Nov 23, 2017
- Fujitsu Limited
- Kanae Nakagawa
- G01 - MEASURING TESTING
Information Patent Application
HEAT DISSIPATING COMPONENT, MANUFACTURING METHOD FOR HEAT DISSIPATI...
- Publication number 20170110386
- Publication date Apr 20, 2017
- Fujitsu Limited
- Takashi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING COMPONENT, MANUFACTURING METHOD FOR HEAT DISSIPATI...
- Publication number 20160338228
- Publication date Nov 17, 2016
- Fujitsu Limited
- Takashi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...
- Publication number 20150132865
- Publication date May 14, 2015
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT...
- Publication number 20110168564
- Publication date Jul 14, 2011
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interposer and method for manufacturing the same
- Publication number 20110056068
- Publication date Mar 10, 2011
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT...
- Publication number 20100112775
- Publication date May 6, 2010
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC DEVICE HAVING FIRST SUBSTRATE WIT...
- Publication number 20090291525
- Publication date Nov 26, 2009
- FUJITSU LIMITED
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...
- Publication number 20090186425
- Publication date Jul 23, 2009
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer and method for fabricating the same
- Publication number 20080134499
- Publication date Jun 12, 2008
- FUJITSU LIMITED
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interposer and method for manufacturing the same
- Publication number 20080073110
- Publication date Mar 27, 2008
- FUJITSU LIMITED
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, wiring substrate forming method, and substrat...
- Publication number 20070287282
- Publication date Dec 13, 2007
- FUJITSU LIMITED
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin layer formation method, semiconductor device and semiconducto...
- Publication number 20070194412
- Publication date Aug 23, 2007
- FUJITSU LIMITED
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, wiring substrate forming method, and substrat...
- Publication number 20070184646
- Publication date Aug 9, 2007
- FUJITSU LIMITED
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer and method for fabricating the same
- Publication number 20070090546
- Publication date Apr 26, 2007
- FUJITSU LIMITED
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and method for fabricating the same
- Publication number 20060220220
- Publication date Oct 5, 2006
- FUJITSU LIMITED
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of wiring substrate
- Publication number 20060216861
- Publication date Sep 28, 2006
- FUJITSU LIMITED
- Kanae Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plating method, semiconductor device fabrication method and circuit...
- Publication number 20060084253
- Publication date Apr 20, 2006
- FUJITSU LIMITED
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plating method, semiconductor device fabrication method and circuit...
- Publication number 20060084251
- Publication date Apr 20, 2006
- FUJITSU LIMITED
- Kanae Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, wiring substrate forming method, and substrat...
- Publication number 20050170640
- Publication date Aug 4, 2005
- FUJITSU LIMITED
- Kanae Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming bumps, semiconductor device and method for manuf...
- Publication number 20050161814
- Publication date Jul 28, 2005
- FUJITSU LIMITED
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface conductive resin, process for forming the same and wiring b...
- Publication number 20030143411
- Publication date Jul 31, 2003
- FUJITSU LIMITED
- Kanae Nakagawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Surface conductive resin, a coaxial cable, a wiring board, and proc...
- Publication number 20030090345
- Publication date May 15, 2003
- Nawalage Florence Cooray
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Kanae Nakagawa

Person

Patents Grantslast 30 patents

Barrier synchronization circuit, barrier synchronization method, an...

Barrier synchronization system and parallel information processing...

Thermoelectric conversion module, sensor module, and information pr...

Heat dissipating component, manufacturing method for heat dissipat...

Method for forming bumps, semiconductor device and method for manuf...

Method for manufacturing interposer

Resin layer formation method and semiconductor device fabrication m...

Plating method, semiconductor device fabrication method and circuit...

Plating method, semiconductor device fabrication method and circuit...

Interposer and method for manufacturing the same

Semiconductor device, wiring substrate forming method, and substrat...

Plating method, semiconductor device fabrication method and circuit...

Semiconductor device, wiring substrate forming method, and substrat...

Method for fabricating an interposer

Semiconductor device, wiring substrate forming method, and substrat...

Interposer and method for fabricating the same

Manufacturing method of wiring substrate

Surface conductive resin, process for forming the same and wiring b...

Surface conductive resin, a coaxial cable, a wiring board, and proc...

Patents Applicationslast 30 patents

BARRIER SYNCHRONIZATION SYSTEM AND PARALLEL INFORMATION PROCESSING...

BARRIER SYNCHRONIZATION CIRCUIT, BARRIER SYNCHRONIZATION METHOD, AN...

THERMOELECTRIC CONVERSION MODULE, SENSOR MODULE, AND INFORMATION PR...

HEAT DISSIPATING COMPONENT, MANUFACTURING METHOD FOR HEAT DISSIPATI...

HEAT DISSIPATING COMPONENT, MANUFACTURING METHOD FOR HEAT DISSIPATI...

METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...

PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT...

Interposer and method for manufacturing the same

PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT...

METHOD FOR FABRICATING ELECTRONIC DEVICE HAVING FIRST SUBSTRATE WIT...

METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...

Interposer and method for fabricating the same

Interposer and method for manufacturing the same

Semiconductor device, wiring substrate forming method, and substrat...

Resin layer formation method, semiconductor device and semiconducto...

Semiconductor device, wiring substrate forming method, and substrat...

Interposer and method for fabricating the same

Electronic device and method for fabricating the same

Manufacturing method of wiring substrate

Plating method, semiconductor device fabrication method and circuit...

Plating method, semiconductor device fabrication method and circuit...

Semiconductor device, wiring substrate forming method, and substrat...

Method for forming bumps, semiconductor device and method for manuf...

Surface conductive resin, process for forming the same and wiring b...

Surface conductive resin, a coaxial cable, a wiring board, and proc...