Kanji Otsuka

Person

Higashiyamato-shi, Tokyo, 207-0002, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Writing method and semiconductor device including a search memory m...
- Patent number 10,423,666
- Issue date Sep 24, 2019
- Nagase & Co., Ltd.
- Masato Nishizawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device for logic operation
- Patent number 9,866,219
- Issue date Jan 9, 2018
- MEISEI GAKUEN
- Kanji Otsuka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and method of writing/reading entry address in...
- Patent number 9,240,237
- Issue date Jan 19, 2016
- Nagase & Co., Ltd.
- Kanji Otsuka
- G11 - INFORMATION STORAGE
Information Patent Grant
Multi chip semiconductor device
- Patent number 8,736,074
- Issue date May 27, 2014
- Fuji Xerox Co., Ltd.
- Daisuke Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and method of manufacturing same
- Patent number 8,508,046
- Issue date Aug 13, 2013
- Disco Corporation
- Masao Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 8,373,072
- Issue date Feb 12, 2013
- Fuji Xerox Co., Ltd.
- Daisuke Iguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory/logic conjugate system
- Patent number 8,305,789
- Issue date Nov 6, 2012
- Kanji Otsuka
- G11 - INFORMATION STORAGE
Information Patent Grant
High-speed semiconductor device and method for manufacturing the same
- Patent number 8,217,466
- Issue date Jul 10, 2012
- Jjtech Co., Ltd.
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal transmission circuit and signal transmission system with red...
- Patent number 7,969,256
- Issue date Jun 28, 2011
- Fuji Xerox Co., Ltd.
- Kanji Otsuka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor integrated circuit package, printed circuit board, se...
- Patent number 7,906,840
- Issue date Mar 15, 2011
- Kyocera Corporation
- Kanji Otsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna apparatus utilizing aperture of transmission line
- Patent number 7,872,612
- Issue date Jan 18, 2011
- Renesas Electronics Corporation
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for adjusting characteristics thereof
- Patent number 7,804,111
- Issue date Sep 28, 2010
- Tama-Tlo Ltd.
- Kanji Otsuka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electrostatic discharge protection circuit and terminating resistor...
- Patent number 7,791,852
- Issue date Sep 7, 2010
- Fujitsu Microelectronics Limited
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wiring substrate having terminated buses
- Patent number 7,631,422
- Issue date Dec 15, 2009
- Rohm Co., Ltd.
- Kanji Otsuka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor integrated circuit for high-speed, high-frequency sig...
- Patent number 7,511,347
- Issue date Mar 31, 2009
- Elpida Memory Inc.
- Kazuhiko Kajigaya
- G11 - INFORMATION STORAGE
Information Patent Grant
Signal transmission apparatus and interconnection structure
- Patent number 7,446,567
- Issue date Nov 4, 2008
- Oki Electric Industry Co., Ltd.
- Kanji Otsuka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Narrow impedance conversion device
- Patent number 7,446,625
- Issue date Nov 4, 2008
- Oki Electric Industry Co., Ltd.
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed signal transmission system
- Patent number 7,295,032
- Issue date Nov 13, 2007
- National Institute of Advanced Industrial Science and Technology
- Kanji Otsuka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor memory device
- Patent number 7,280,385
- Issue date Oct 9, 2007
- Kabushiki Kaisha Toshiba
- Kanji Otsuka
- G11 - INFORMATION STORAGE
Information Patent Grant
Signal transmission system, and signal transmission line
- Patent number 7,190,188
- Issue date Mar 13, 2007
- Sony Corporation
- Kanji Otsuka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Signal transmission system
- Patent number 7,173,449
- Issue date Feb 6, 2007
- Kanji Otsuka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of terminating bus, bus termination resistor, and wiring sub...
- Patent number 7,116,184
- Issue date Oct 3, 2006
- Rohm Co., Ltd.
- Kanji Otsuka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transmission cable structure for GHz frequency band signals and con...
- Patent number 7,113,002
- Issue date Sep 26, 2006
- Fujikura Ltd.
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure and semiconductor integrated circuit
- Patent number 6,975,489
- Issue date Dec 13, 2005
- NEC Corporation
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit device
- Patent number 6,961,229
- Issue date Nov 1, 2005
- Sanyo Electric Co., Ltd.
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure for transmission line having grooved conductors
- Patent number 6,914,502
- Issue date Jul 5, 2005
- Oki Electric Industry Co., Ltd.
- Kanji Otsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 6,812,742
- Issue date Nov 2, 2004
- Fujitsu Limited
- Kanji Otsuka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor integrated circuit having switching transistors and v...
- Patent number 6,731,153
- Issue date May 4, 2004
- Matsushita Electric Industrial Co., Ltd.
- Kanji Otsuka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic device
- Patent number 6,693,801
- Issue date Feb 17, 2004
- Kanji Otsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Driver circuit, receiver circuit, and signal transmission bus system
- Patent number 6,670,830
- Issue date Dec 30, 2003
- Oki Electric Industry Co., Ltd.
- Kanji Otsuka
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR SUBSTRATE ASSEMBLY AND MANUFACTURING METHOD THEREFOR
- Publication number 20240274571
- Publication date Aug 15, 2024
- Tadatomo SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND INFORMATION WRITING/READING METHOD
- Publication number 20180129756
- Publication date May 10, 2018
- Nagase & Co., Ltd
- Masato NISHIZAWA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE FOR LOGIC OPERATION
- Publication number 20160211851
- Publication date Jul 21, 2016
- Meisei Gakuen
- Kanji OTSUKA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20160066415
- Publication date Mar 3, 2016
- DENSO CORPORATION
- Ryohei KATAOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF WRITING/READING ENTRY ADDRESS IN...
- Publication number 20150070957
- Publication date Mar 12, 2015
- Nagase & Co., Ltd
- Kanji Otsuka
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY/LOGIC CONJUGATE SYSTEM
- Publication number 20130061004
- Publication date Mar 7, 2013
- Kanji Otsuka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER LEVEL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130034934
- Publication date Feb 7, 2013
- SK Link Co., Ltd.
- Koichi MEGURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit substrate and method of manufacturing same
- Publication number 20120193799
- Publication date Aug 2, 2012
- SKLink Co., Ltd.
- Masao SAKUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY/LOGIC CONJUGATE SYSTEM
- Publication number 20110255323
- Publication date Oct 20, 2011
- Kanji Otsuka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PAIRED LOW-CHARACTERISTIC IMPEDANCE POWER LINE AND GROUND LINE STRU...
- Publication number 20110073352
- Publication date Mar 31, 2011
- Kanji Otsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING AND COMPOSITE WIRING
- Publication number 20110042120
- Publication date Feb 24, 2011
- IBIDEN CO., LTD.
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100289156
- Publication date Nov 18, 2010
- FUJI XEROX CO., LTD
- Daisuke IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20100013318
- Publication date Jan 21, 2010
- FUJI XEROX CO., LTD
- Daisuke Iguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STORAGE BATTERY
- Publication number 20100014211
- Publication date Jan 21, 2010
- TAMA-TLO Ltd.
- Kanji Otsuka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Device and Method for Adjusting Characteristics Thereof
- Publication number 20090108955
- Publication date Apr 30, 2009
- Kanji Otsuka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor Device and Manufacturing Method Thereof
- Publication number 20090096029
- Publication date Apr 16, 2009
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Integrated Circuit Package, Printed Circuit Board, Se...
- Publication number 20090072358
- Publication date Mar 19, 2009
- Kyocera Corporation
- Kanji Otsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Antenna apparatus utilizing aperture of transmission line
- Publication number 20080316136
- Publication date Dec 25, 2008
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Signal transmission circuit and signal transmission system
- Publication number 20080310521
- Publication date Dec 18, 2008
- FUJI XEROX CO., LTD
- Kanji Otsuka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Electrostatic discharge protection circuit and terminating resistor...
- Publication number 20080042686
- Publication date Feb 21, 2008
- Kanji OTSUKA
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Narrow impedance conversion device
- Publication number 20070176708
- Publication date Aug 2, 2007
- Oki Electric Industry Co., Ltd.
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of terminating bus,bus termination resistor and wiring subtr...
- Publication number 20060226927
- Publication date Oct 12, 2006
- Rohm Co., Ltd.
- Kanji Otsuka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor memory device
- Publication number 20060203586
- Publication date Sep 14, 2006
- Kanji Otsuka
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor integrated circuit
- Publication number 20060108640
- Publication date May 25, 2006
- ELPIDA MEMORY INC.
- Kazuhiko Kajigaya
- G11 - INFORMATION STORAGE
Information Patent Application
High-speed signal transmission system
- Publication number 20050179465
- Publication date Aug 18, 2005
- Kanji Otsuka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Signal transmission system, and signal transmission line
- Publication number 20050040846
- Publication date Feb 24, 2005
- Kanji Otsuka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Transmission cable structure for GHz frequency band signals and con...
- Publication number 20040227580
- Publication date Nov 18, 2004
- FUJIKURA LTD.
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic circuit device
- Publication number 20040207432
- Publication date Oct 21, 2004
- Kanji Otsuka
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Signal transmission apparatus and interconnection structure
- Publication number 20040165669
- Publication date Aug 26, 2004
- Kanji Otsuka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Circuit structure and semiconductor integrated circuit
- Publication number 20030184311
- Publication date Oct 2, 2003
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS

Kanji Otsuka

Person

Patents Grantslast 30 patents

Writing method and semiconductor device including a search memory m...

Device for logic operation

Semiconductor device and method of writing/reading entry address in...

Multi chip semiconductor device

Circuit substrate and method of manufacturing same

Printed circuit board

Memory/logic conjugate system

High-speed semiconductor device and method for manufacturing the same

Signal transmission circuit and signal transmission system with red...

Semiconductor integrated circuit package, printed circuit board, se...

Antenna apparatus utilizing aperture of transmission line

Semiconductor device and method for adjusting characteristics thereof

Electrostatic discharge protection circuit and terminating resistor...

Method of manufacturing wiring substrate having terminated buses

Semiconductor integrated circuit for high-speed, high-frequency sig...

Signal transmission apparatus and interconnection structure

Narrow impedance conversion device

High-speed signal transmission system

Semiconductor memory device

Signal transmission system, and signal transmission line

Signal transmission system

Method of terminating bus, bus termination resistor, and wiring sub...

Transmission cable structure for GHz frequency band signals and con...

Circuit structure and semiconductor integrated circuit

Electronic circuit device

Wiring structure for transmission line having grooved conductors

Electronic device

Semiconductor integrated circuit having switching transistors and v...

Electronic device

Driver circuit, receiver circuit, and signal transmission bus system

Patents Applicationslast 30 patents

SEMICONDUCTOR SUBSTRATE ASSEMBLY AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE AND INFORMATION WRITING/READING METHOD

DEVICE FOR LOGIC OPERATION

MULTILAYER WIRING BOARD

SEMICONDUCTOR DEVICE AND METHOD OF WRITING/READING ENTRY ADDRESS IN...

MEMORY/LOGIC CONJUGATE SYSTEM

WAFER LEVEL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Circuit substrate and method of manufacturing same

MEMORY/LOGIC CONJUGATE SYSTEM

PAIRED LOW-CHARACTERISTIC IMPEDANCE POWER LINE AND GROUND LINE STRU...

WIRING AND COMPOSITE WIRING

SEMICONDUCTOR DEVICE

PRINTED CIRCUIT BOARD

STORAGE BATTERY

Semiconductor Device and Method for Adjusting Characteristics Thereof

Semiconductor Device and Manufacturing Method Thereof

Semiconductor Integrated Circuit Package, Printed Circuit Board, Se...

Antenna apparatus utilizing aperture of transmission line

Signal transmission circuit and signal transmission system

Electrostatic discharge protection circuit and terminating resistor...

Narrow impedance conversion device

Method of terminating bus,bus termination resistor and wiring subtr...

Semiconductor memory device

Semiconductor integrated circuit

High-speed signal transmission system

Signal transmission system, and signal transmission line

Transmission cable structure for GHz frequency band signals and con...

Electronic circuit device

Signal transmission apparatus and interconnection structure

Circuit structure and semiconductor integrated circuit