Kao-Ming Su

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wire-bonding method for wire-bonding apparatus
- Patent number 7,581,666
- Issue date Sep 1, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-stage die-bonding method for simultaneous die-bonding of multip...
- Patent number 7,547,575
- Issue date Jun 16, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and manufacturing method thereof
- Patent number 7,445,944
- Issue date Nov 4, 2008
- ASE (Shanghai) Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Packaging substrate and manufacturing method thereof
- Publication number 20080124836
- Publication date May 29, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire-bonding method for wire-bonding apparatus
- Publication number 20080102539
- Publication date May 1, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BONDER AND DIE BONDING METHOD THEREOF
- Publication number 20080085571
- Publication date Apr 10, 2008
- Advanced Semiconductor Engeneering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging substrate and method of manufacturing the same
- Publication number 20080044931
- Publication date Feb 21, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire-bonding apparatus and wire-bonding method thereof
- Publication number 20080035706
- Publication date Feb 14, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR