Kaoru Hashimoto

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive material and method for filling via-hole
- Patent number 7,531,115
- Issue date May 12, 2009
- Fujitsu Limited
- Isao Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive material and method for filling via-hole
- Patent number 6,886,248
- Issue date May 3, 2005
- Fujitsu Limited
- Isao Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing piezoelectric materials
- Patent number 6,156,259
- Issue date Dec 5, 2000
- Fujitsu Limited
- Motoyuki Nishizawa
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Process of fabricating semiconductor unit employing bumps to bond t...
- Patent number 6,121,062
- Issue date Sep 19, 2000
- Fujitsu Limited
- Kazuaki Karasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector employing liquid conductor for electrical contact
- Patent number 5,779,492
- Issue date Jul 14, 1998
- Fujitsu Limited
- Takeshi Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting device and method for making same
- Patent number 5,746,927
- Issue date May 5, 1998
- Fujitsu Limited
- Kaoru Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector employing liquid conductor for electrical contact
- Patent number 5,626,484
- Issue date May 6, 1997
- Fujitsu Limited
- Takeshi Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making metal particle spherical and removing oxide film...
- Patent number 5,616,164
- Issue date Apr 1, 1997
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connecting device and method for making same
- Patent number 5,610,371
- Issue date Mar 11, 1997
- Fujitsu Limited
- Kaoru Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting device and method for making same
- Patent number 5,603,981
- Issue date Feb 18, 1997
- Fujitsu Limited
- Kaoru Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting device and method for making same
- Patent number 5,440,454
- Issue date Aug 8, 1995
- Fujitsu Limited
- Kaoru Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting method
- Patent number 5,417,362
- Issue date May 23, 1995
- Fujitsu Limited
- Tatsuo Chiyonobu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of producing multiple-layer glass-ceramic circuit board
- Patent number 5,287,620
- Issue date Feb 22, 1994
- Fujitsu Limited
- Hitoshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for flip chip connecting a semiconductor chip
- Patent number 5,284,796
- Issue date Feb 8, 1994
- Fujitsu Limited
- Teru Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate with integrated circuit bonded thereon
- Patent number 4,460,916
- Issue date Jul 17, 1984
- Fujitsu Limited
- Kaoru Hashimoto
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Multilayer circuit boards
- Patent number 4,313,026
- Issue date Jan 26, 1982
- Fujitsu Limited
- Seiichi Yamada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Conductive material and method for filling via-hole
- Publication number 20050147522
- Publication date Jul 7, 2005
- FUJITSU LIMITED
- Isao Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive material and method for filling via-hole
- Publication number 20030135997
- Publication date Jul 24, 2003
- FUJITSU LIMITED
- Isao Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kaoru Hashimoto

Person

Patents Grantslast 30 patents

Conductive material and method for filling via-hole

Conductive material and method for filling via-hole

Method of manufacturing piezoelectric materials

Process of fabricating semiconductor unit employing bumps to bond t...

Connector employing liquid conductor for electrical contact

Electrical connecting device and method for making same

Connector employing liquid conductor for electrical contact

Methods for making metal particle spherical and removing oxide film...

Electrical connecting device and method for making same

Electrical connecting device and method for making same

Electrical connecting device and method for making same

Electrical connecting method

Process of producing multiple-layer glass-ceramic circuit board

Process for flip chip connecting a semiconductor chip

Ceramic substrate with integrated circuit bonded thereon

Multilayer circuit boards

Patents Applicationslast 30 patents

Conductive material and method for filling via-hole

Conductive material and method for filling via-hole