Claims
- 1. A method of making an electrical connecting device, said device having a first circuit board provided thereon with input/output terminals, a second circuit board provided with holes at positions corresponding to said input/output terminals of said first circuit board, and conductive material filled in each of said holes, wherein said first and second circuit boards are electrically connected to each other by inserting said input/output terminals of said first circuit board into the respective holes of said second circuit board, said method comprising the steps of:
- forming at least portions of said second circuit board, around said holes, with photosensitive polymer; and
- etching said second circuit board to form holes thereon, each of said holes having a bottle shape in which a cross-sectional area thereof at an internal side is larger than that at an open-end thereof.
Priority Claims (4)
Number |
Date |
Country |
Kind |
5-257004 |
Oct 1993 |
JPX |
|
6-043445 |
Mar 1994 |
JPX |
|
6-223787 |
Sep 1994 |
JPX |
|
7-38142 |
Feb 1995 |
JPX |
|
Parent Case Info
This is a division of application Ser. No. 08/403,678 filed Mar. 14, 1995, now U.S. Pat. No. 5,610,371, which is a continuation-in-part of application Ser. No. 08/277,992, Jul. 20, 1994 now U.S. Pat. No. 5,440,454.
US Referenced Citations (20)
Foreign Referenced Citations (8)
Number |
Date |
Country |
60-116193 |
Jun 1985 |
JPX |
60-115696 |
Jun 1985 |
JPX |
2-159047 |
Jun 1990 |
JPX |
3-276750 |
Dec 1991 |
JPX |
4-12588 |
Jan 1992 |
JPX |
5-74503 |
Mar 1993 |
JPX |
5-190219 |
Jul 1993 |
JPX |
5-267035 |
Oct 1993 |
JPX |
Non-Patent Literature Citations (1)
Entry |
J.R. Petrozello, "Past-Encapsulated Terminal", IBM Technical Disclosure Bulletin, vol. 21, No. 11, Apr. 1979, pp. 4444-4445. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
403678 |
Mar 1995 |
|
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
277992 |
Jul 1994 |
|