Claims
- 1. An electrical connecting conductor for electrically connecting different terminals, comprising a conductive fluid in which liquid metal and an organic liquid are stirred and a particulate liquid metal is mixed with the organic liquid.
- 2. The electrical connecting conductor according to claim 1, wherein the liquid metal is a Ga--Sn alloy.
- 3. The electrical connecting conductor according to claim 2, wherein the liquid metal is a Ga--Sn alloy having the eutectic composition of 92.0 wt % of Ga and 8.0 wt % of Sn.
- 4. The electrical connecting conductor according to claim 1, wherein the liquid metal is a Ga--In alloy.
- 5. The electrical connecting conductor according to claim 4, wherein the liquid metal is a Ga--In alloy having the eutectic composition of 75.5 wt % of Ga and 24.5 wt % of In.
- 6. The electrical connecting conductor according to claim 1, wherein the organic liquid is perfluorocarbon oil, silicone oil or hydrocarbon.
- 7. An electrical connecting device comprising a connecting section provided with a bottom in which the conductive fluid according to claim 1 is accommodated and the connecting section is electrically connected with an inserted connecting terminal through the conductive fluid.
- 8. An electrical circuit device according to claim 7 in which a connecting terminal on the circuit board is inserted into the cylindrical connecting section having the bottom, the conductive fluid being accommodated in the cylindrical connecting section, wherein a minimum interval between the outer circumferential surface of the connecting terminal dipped in the conductive fluid and the inside wall of the connecting section is 10 to 100 .mu.m.
- 9. The electrical circuit device according to claim 8, wherein a fore end of the connecting terminal dipped in the conductive fluid in the connecting section is formed spherical, and the width of the connecting terminal is maximum at the fore end.
- 10. The electrical circuit device according to claim 8, wherein a fore end of the connecting terminal dipped in the conductive fluid in the connecting section is thin and an intermediate portion of the connecting terminal dipped in the conductive fluid is thick.
- 11. An electrical connecting device comprising:
- a first circuit board being provided thereon with input/output terminals;
- a second circuit board being provided with holes at positions corresponding to said input/output terminals of said first circuit board, each of said holes having a bottle shape in which the cross-sectional area thereof at an internal side is larger than that at an open-end thereof; and
- conductive material filled in each of said holes, wherein said first and second circuit boards are electrically connected to each other by inserting said input/output terminals of said first circuit board into the respective holes of said second circuit board,
- wherein said conductive material is a liquid metal, and
- wherein said conductive material is in liquid state at room temperature.
- 12. An electrical connecting device, comprising:
- a first circuit board being provided thereon with input/output terminals;
- a second circuit board being provided with holes at positions corresponding to said input/output terminals of said first circuit board, each of said holes having a bottle shape in which the cross-sectional area thereof at an internal side is larger than that at an open-end thereof; and
- conductive material filled in each of said holes, wherein said first and second circuit boards are electrically connected to each other by inserting said input/output terminals of said first circuit board into the respective holes of said second circuit board,
- wherein said conductive material is a compound conductive fluid in which particulate liquid metal and an organic liquid are mixed; liquid metal particles are dispersed in an organic liquid.
Priority Claims (3)
Number |
Date |
Country |
Kind |
6-043445 |
Mar 1994 |
JPX |
|
6-223787 |
Sep 1994 |
JPX |
|
7-038142 |
Feb 1995 |
JPX |
|
BACKGROUND OF THE INVENTION
This application is a Continuation-In-Part Application of U.S. application Ser. No. 08/277,992 filed on Jul. 20, 1994 and now pending.
US Referenced Citations (17)
Foreign Referenced Citations (8)
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Date |
Country |
60-116193 |
Jun 1985 |
JPX |
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Jun 1985 |
JPX |
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Jun 1990 |
JPX |
3-276750 |
Dec 1991 |
JPX |
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Jan 1992 |
JPX |
5-74503 |
Mar 1993 |
JPX |
5-190219 |
Jul 1993 |
JPX |
5-267035 |
Oct 1993 |
JPX |
Non-Patent Literature Citations (1)
Entry |
IBM Technical Disclosure Bulletin, Paste-Encapsulated Terminal, J. R. Petrozello, vol. 21, No. 11, Apr. 1979, pp. 4444-4445. |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
277992 |
Jul 1994 |
|