Karumbu Meyyappan

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low force liquid metal interconnect solutions
- Patent number 11,622,466
- Issue date Apr 4, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-beam test probe
- Patent number 11,543,454
- Issue date Jan 3, 2023
- Intel Corporation
- Paul J. Diglio
- G01 - MEASURING TESTING
Information Patent Grant
Connector port frame for processor package
- Patent number 10,109,940
- Issue date Oct 23, 2018
- Intel Corporation
- Thomas A. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal linear edge connector
- Patent number 10,044,115
- Issue date Aug 7, 2018
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linear edge connector with activator bar and contact load spring
- Patent number 9,859,636
- Issue date Jan 2, 2018
- Intel Corporation
- Thomas A. Boyd
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PATCH INTERPOSER MOLD DESIGN FOR LIQUID METAL CARRIER ARRAY
- Publication number 20240404896
- Publication date Dec 5, 2024
- Intel Corporation
- Eric ERIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS
- Publication number 20240388018
- Publication date Nov 21, 2024
- Intel Corporation
- Karumbu MEYYAPPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-HEALING CAP FOR LIQUID METAL CONTAINMENT IN SOCKET APPLICATIONS
- Publication number 20240363520
- Publication date Oct 31, 2024
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20240297119
- Publication date Sep 5, 2024
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR SEALING LIQUID METAL INTERCONNECT ARRAY PACKAGES
- Publication number 20240074046
- Publication date Feb 29, 2024
- Intel Corporation
- Ziyin Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL BASED FIRST LEVEL INTERCONNECTS
- Publication number 20240006400
- Publication date Jan 4, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR TESTING LIQUID METAL ARRAY INTERCONNECT PACKAGES
- Publication number 20230314503
- Publication date Oct 5, 2023
- Intel Corporation
- Gregorio Roberto Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDD...
- Publication number 20230317619
- Publication date Oct 5, 2023
- Intel Corporation
- Ravindranath V. Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR LIQUID METAL MIXTURES FOR ELECTRICAL INTERCONNECTS
- Publication number 20230317533
- Publication date Oct 5, 2023
- Intel Corporation
- Gregorio Roberto Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW FORCE LIQUID METAL INTERCONNECT SOLUTIONS
- Publication number 20230209759
- Publication date Jun 29, 2023
- Intel Corporation
- Karumbu MEYYAPPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR PACKAGE SERVER ARCHITECTURE
- Publication number 20230197621
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVE...
- Publication number 20230197622
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERCONNECT SER...
- Publication number 20230197594
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REWORKABLE ZERO-FORCE INSERTION ELECTRICAL OPTICAL PACKAGE SOCKET A...
- Publication number 20230185037
- Publication date Jun 15, 2023
- Intel Corporation
- Eric J. M. Moret
- G02 - OPTICS
Information Patent Application
LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20230187850
- Publication date Jun 15, 2023
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20230187337
- Publication date Jun 15, 2023
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE Z-DISAGGREGATION WITH LIQUID METAL INTERCONNECTS
- Publication number 20220399263
- Publication date Dec 15, 2022
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW FORCE LIQUID METAL INTERCONNECT SOLUTIONS
- Publication number 20210392774
- Publication date Dec 16, 2021
- Intel Corporation
- Karumbu MEYYAPPAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE-BEAM TEST PROBE
- Publication number 20200096567
- Publication date Mar 26, 2020
- Intel Corporation
- Paul J. Diglio
- G01 - MEASURING TESTING
Information Patent Application
CONNECTOR PORT FRAME FOR PROCESSOR PACKAGE
- Publication number 20180166807
- Publication date Jun 14, 2018
- THOMAS A. BOYD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Linear edge connector with activator bar and contact load spring
- Publication number 20170187134
- Publication date Jun 29, 2017
- Intel Corporation
- Thomas A. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal linear edge connector
- Publication number 20170187147
- Publication date Jun 29, 2017
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS

Karumbu Meyyappan

Person

Patents Grantslast 30 patents

Low force liquid metal interconnect solutions

Double-beam test probe

Connector port frame for processor package

Universal linear edge connector

Linear edge connector with activator bar and contact load spring

Patents Applicationslast 30 patents

PATCH INTERPOSER MOLD DESIGN FOR LIQUID METAL CARRIER ARRAY

LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS

SELF-HEALING CAP FOR LIQUID METAL CONTAINMENT IN SOCKET APPLICATIONS

LIQUID METAL CONNECTION DEVICE AND METHOD

TECHNOLOGIES FOR SEALING LIQUID METAL INTERCONNECT ARRAY PACKAGES

LIQUID METAL BASED FIRST LEVEL INTERCONNECTS

TECHNOLOGIES FOR TESTING LIQUID METAL ARRAY INTERCONNECT PACKAGES

MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDD...

TECHNOLOGIES FOR LIQUID METAL MIXTURES FOR ELECTRICAL INTERCONNECTS

LOW FORCE LIQUID METAL INTERCONNECT SOLUTIONS

LIQUID METAL INTERCONNECT FOR MODULAR PACKAGE SERVER ARCHITECTURE

LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVE...

LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERCONNECT SER...

REWORKABLE ZERO-FORCE INSERTION ELECTRICAL OPTICAL PACKAGE SOCKET A...

LIQUID METAL CONNECTION DEVICE AND METHOD

FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD

PACKAGE SUBSTRATE Z-DISAGGREGATION WITH LIQUID METAL INTERCONNECTS

LOW FORCE LIQUID METAL INTERCONNECT SOLUTIONS

DOUBLE-BEAM TEST PROBE

CONNECTOR PORT FRAME FOR PROCESSOR PACKAGE

Linear edge connector with activator bar and contact load spring

Universal linear edge connector