Kathleen A. Stalter

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dielectric interposer for chip to substrate soldering
- Patent number 6,984,792
- Issue date Jan 10, 2006
- International Business Machines Corporation
- Peter J. Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric interposer for chip to substrate soldering
- Patent number 6,657,313
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Peter J. Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling a carrier and a semiconductor device
- Patent number 6,584,684
- Issue date Jul 1, 2003
- International Business Machines
- Peter J. Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming cone shaped solder for chip interconnection
- Patent number 6,559,527
- Issue date May 6, 2003
- International Business Machines Corporation
- Peter Jeffrey Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of interconnecting electronic components using a plurality o...
- Patent number 6,548,909
- Issue date Apr 15, 2003
- International Business Machines Corporation
- Peter J. Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process and apparatus to remove closely spaced chips on a multi-chi...
- Patent number 6,360,938
- Issue date Mar 26, 2002
- International Business Machines Corporation
- Stephen A. DeLaurentis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure, materials, and methods for socketable ball grid
- Patent number 6,300,164
- Issue date Oct 9, 2001
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, materials, and applications of ball grid array interconn...
- Patent number 6,297,559
- Issue date Oct 2, 2001
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,283,359
- Issue date Sep 4, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder disc connection
- Patent number 6,278,184
- Issue date Aug 21, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Z-axis compressible polymer with fine metal matrix suspension
- Patent number 6,270,363
- Issue date Aug 7, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of interconnecting electronic components using a plurality o...
- Patent number 6,258,625
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder disc connection
- Patent number 6,253,986
- Issue date Jul 3, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling a chip carrier to a semiconductor device
- Patent number 6,220,499
- Issue date Apr 24, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus to remove closely spaced chips on a multi-chi...
- Patent number 6,216,937
- Issue date Apr 17, 2001
- International Business Machines Corporation
- Stephen A. DeLaurentis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module with metal-ion matrix induced dendrites for interconnection
- Patent number 6,218,629
- Issue date Apr 17, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming cone shaped solder for chip interconnection
- Patent number 6,184,062
- Issue date Feb 6, 2001
- International Business Machines Corporation
- Peter Jeffrey Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,158,644
- Issue date Dec 12, 2000
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure, materials, and methods for socketable ball grid
- Patent number 6,120,885
- Issue date Sep 19, 2000
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder disc connection
- Patent number 6,070,321
- Issue date Jun 6, 2000
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic ball grid array using in-situ solder stretch
- Patent number 5,975,409
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced ceramic ball grid array using in-situ solder stretch with...
- Patent number 5,968,670
- Issue date Oct 19, 1999
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced ceramic ball grid array using in-situ solder stretch with...
- Patent number 5,964,396
- Issue date Oct 12, 1999
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Dielectric interposer for chip to substrate soldering
- Publication number 20030193093
- Publication date Oct 16, 2003
- International Business Machines Corporation
- Peter J. Brofman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of interconnecting electronic components using a plurality o...
- Publication number 20010019178
- Publication date Sep 6, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for forming cone shaped solder for chip interconnection
- Publication number 20010015495
- Publication date Aug 23, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for assembling a carrier and a semiconductor device
- Publication number 20010007288
- Publication date Jul 12, 2001
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process and apparatus to remove closely spaced chips on a multi-chi...
- Publication number 20010006188
- Publication date Jul 5, 2001
- Stephen A. DeLaurentis
- H01 - BASIC ELECTRIC ELEMENTS

Kathleen A. Stalter

Person

Patents Grantslast 30 patents

Dielectric interposer for chip to substrate soldering

Dielectric interposer for chip to substrate soldering

Method for assembling a carrier and a semiconductor device

Process for forming cone shaped solder for chip interconnection

Method of interconnecting electronic components using a plurality o...

Process and apparatus to remove closely spaced chips on a multi-chi...

Structure, materials, and methods for socketable ball grid

Structure, materials, and applications of ball grid array interconn...

Method for enhancing fatigue life of ball grid arrays

Solder disc connection

Z-axis compressible polymer with fine metal matrix suspension

Method of interconnecting electronic components using a plurality o...

Solder disc connection

Method for assembling a chip carrier to a semiconductor device

Process and apparatus to remove closely spaced chips on a multi-chi...

Module with metal-ion matrix induced dendrites for interconnection

Process for forming cone shaped solder for chip interconnection

Method for enhancing fatigue life of ball grid arrays

Structure, materials, and methods for socketable ball grid

Solder disc connection

Ceramic ball grid array using in-situ solder stretch

Enhanced ceramic ball grid array using in-situ solder stretch with...

Enhanced ceramic ball grid array using in-situ solder stretch with...

Patents Applicationslast 30 patents

Dielectric interposer for chip to substrate soldering

Method of interconnecting electronic components using a plurality o...

Process for forming cone shaped solder for chip interconnection

Method for assembling a carrier and a semiconductor device

Process and apparatus to remove closely spaced chips on a multi-chi...