KATOH Takeo

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon wafer and method for manufacturing the same
- Patent number 10,177,008
- Issue date Jan 8, 2019
- Sumco Corporation
- Takashi Nakayama
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method of polishing a silicon wafer
- Patent number 8,877,643
- Issue date Nov 4, 2014
- Sumco Corporation
- Shuhei Matsuda
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing epitaxial wafer
- Patent number 8,759,229
- Issue date Jun 24, 2014
- Sumco Corporation
- Sakae Koyata
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for etching single wafer
- Patent number 8,466,071
- Issue date Jun 18, 2013
- Sumco Corporation
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for judging whether semiconductor wafer is non-defective waf...
- Patent number 8,379,196
- Issue date Feb 19, 2013
- Sumco Corporation
- Eiji Kamiyama
- G01 - MEASURING TESTING
Information Patent Grant
Method of polishing silicon wafer
- Patent number 8,147,295
- Issue date Apr 3, 2012
- Sumco Corporation
- Takeo Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for etching wafer by single-wafer process and single wafe...
- Patent number 8,066,896
- Issue date Nov 29, 2011
- Sumco Corporation
- Sakae Koyata
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for smoothing wafer surface and apparatus used therefor
- Patent number 7,955,982
- Issue date Jun 7, 2011
- Sumco Corporation
- Takeo Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single wafer etching method
- Patent number 7,906,438
- Issue date Mar 15, 2011
- Sumco Corporation
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing silicon wafer
- Patent number 7,648,890
- Issue date Jan 19, 2010
- Sumco Corporation
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing silicon wafers
- Patent number 7,601,644
- Issue date Oct 13, 2009
- Sumco Corporation
- Sakae Koyata
- B24 - GRINDING POLISHING
Information Patent Grant
Bonded semiconductor substrate manufacturing method thereof
- Patent number 7,491,342
- Issue date Feb 17, 2009
- Sumco Corporation
- Eiji Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for etching wafer by single-wafer process
- Patent number 7,488,400
- Issue date Feb 10, 2009
- Sumco Corporation
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SILICON WAFER AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160322233
- Publication date Nov 3, 2016
- SUMCO CORPORATION
- Takashi NAKAYAMA
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD OF POLISHING SILICON WAFER AS WELL AS SILICON WAFER
- Publication number 20120080775
- Publication date Apr 5, 2012
- Shuhei Matsuda
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR JUDGING WHETHER SEMICONDUCTOR WAFER IS NON-DEFECTIVE WAF...
- Publication number 20100309461
- Publication date Dec 9, 2010
- SUMCO CORPORATION
- Eiji Kamiyama
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR SMOOTHING WAFER SURFACE AND APPARATUS USED THEREFOR
- Publication number 20100151597
- Publication date Jun 17, 2010
- SUMCO CORPORATION
- Takeo Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND WAFER OBTAINED THROUGH THE METHOD
- Publication number 20100021688
- Publication date Jan 28, 2010
- SUMCO CORPORATION
- Takeo Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF POLISHING SILICON WAFER
- Publication number 20090298394
- Publication date Dec 3, 2009
- SUMCO CORPORATION
- Takeo Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON WAFER
- Publication number 20090294910
- Publication date Dec 3, 2009
- SUMCO CORPORATION
- Takeo KATOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR THIN FILM-ATTACHED SUBSTRATE AND PRODUCTION METHOD TH...
- Publication number 20090297867
- Publication date Dec 3, 2009
- SUMCO CORPORATION
- Takeo KATOH
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR WAFER
- Publication number 20090294918
- Publication date Dec 3, 2009
- SUMCO CORPORATION
- Takeo KATOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON WAFER
- Publication number 20090297426
- Publication date Dec 3, 2009
- SUMCO CORPORATION
- Takeo KATOH
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR CLEANING SEMICONDUCTOR WAFER
- Publication number 20090293919
- Publication date Dec 3, 2009
- SUMCO CORPORATION
- Takeo Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE WAFER ETCHING APPARATUS
- Publication number 20090186488
- Publication date Jul 23, 2009
- KATOH Takeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single-Wafer Etching Method for Wafer and Etching Apparatus Thereof
- Publication number 20090181546
- Publication date Jul 16, 2009
- Takeo Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching Method of Single Wafer
- Publication number 20090117749
- Publication date May 7, 2009
- SUMCO CORPORATION
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Epitaxial Wafer
- Publication number 20090053894
- Publication date Feb 26, 2009
- Sakae Koyata
- C30 - CRYSTAL GROWTH
Information Patent Application
ETCHANT FOR SILICON WAFER SURFACE SHAPE CONTROL AND METHOD FOR MANU...
- Publication number 20090042390
- Publication date Feb 12, 2009
- Sakae Koyata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for Etching Single Wafer
- Publication number 20090004876
- Publication date Jan 1, 2009
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SILICON WAFER
- Publication number 20080214094
- Publication date Sep 4, 2008
- Takeo KATOH
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus for etching wafer by single-wafer process and single wafe...
- Publication number 20070298614
- Publication date Dec 27, 2007
- SUMCO CORPORATION
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Silicon Wafers
- Publication number 20070224821
- Publication date Sep 27, 2007
- SUMCO CORPORATION
- Sakae Koyata
- B24 - GRINDING POLISHING
Information Patent Application
Single Wafer Etching Apparatus and Single Wafer Etching Method
- Publication number 20070175863
- Publication date Aug 2, 2007
- SUMCO CORPORATION
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD OF SINGLE WAFER
- Publication number 20070161247
- Publication date Jul 12, 2007
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for etching wafer by single-wafer process and single wafe...
- Publication number 20070087568
- Publication date Apr 19, 2007
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing silicon wafer
- Publication number 20070042567
- Publication date Feb 22, 2007
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminated semiconductor substrate process for producing the same
- Publication number 20060118935
- Publication date Jun 8, 2006
- Eiji Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS

KATOH Takeo

Person

Patents Grantslast 30 patents

Silicon wafer and method for manufacturing the same

Method of polishing a silicon wafer

Method for manufacturing epitaxial wafer

Method for etching single wafer

Method for judging whether semiconductor wafer is non-defective waf...

Method of polishing silicon wafer

Apparatus for etching wafer by single-wafer process and single wafe...

Method for smoothing wafer surface and apparatus used therefor

Single wafer etching method

Process for producing silicon wafer

Method for manufacturing silicon wafers

Bonded semiconductor substrate manufacturing method thereof

Apparatus for etching wafer by single-wafer process

Patents Applicationslast 30 patents

SILICON WAFER AND METHOD FOR MANUFACTURING THE SAME

METHOD OF POLISHING SILICON WAFER AS WELL AS SILICON WAFER

METHOD FOR JUDGING WHETHER SEMICONDUCTOR WAFER IS NON-DEFECTIVE WAF...

METHOD FOR SMOOTHING WAFER SURFACE AND APPARATUS USED THEREFOR

WAFER MANUFACTURING METHOD AND WAFER OBTAINED THROUGH THE METHOD

METHOD OF POLISHING SILICON WAFER

SILICON WAFER

SEMICONDUCTOR THIN FILM-ATTACHED SUBSTRATE AND PRODUCTION METHOD TH...

SEMICONDUCTOR WAFER

SILICON WAFER

METHOD FOR CLEANING SEMICONDUCTOR WAFER

SINGLE WAFER ETCHING APPARATUS

Single-Wafer Etching Method for Wafer and Etching Apparatus Thereof

Etching Method of Single Wafer

Method for Manufacturing Epitaxial Wafer

ETCHANT FOR SILICON WAFER SURFACE SHAPE CONTROL AND METHOD FOR MANU...

Method for Etching Single Wafer

METHOD FOR MANUFACTURING SILICON WAFER

Apparatus for etching wafer by single-wafer process and single wafe...

Method for Manufacturing Silicon Wafers

Single Wafer Etching Apparatus and Single Wafer Etching Method

ETCHING METHOD OF SINGLE WAFER

Apparatus for etching wafer by single-wafer process and single wafe...

Process for producing silicon wafer

Laminated semiconductor substrate process for producing the same