BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a vertical cross-sectional view of the configuration of a main-part of a single wafer etching apparatus according to an embodiment of the present invention;
FIG. 2 is a top view showing the relationship of a supply nozzle of the apparatus and a wafer;
FIG. 3 is another top view showing the relationship of the supply nozzle and the wafer;
FIG. 4 is still another top view showing the relationship of the supply nozzle and the wafer;
FIG. 5 is a figure showing variations in thickness of the wafer in Example 1; and
FIG. 6 is a figure showing variations in thickness of the wafer in Comparative Example 1.