Katsuhiko Tanno

Person

Gifu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,729,911
- Issue date Aug 15, 2023
- Ibiden Co., Ltd.
- Akinori Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,363,714
- Issue date Jun 14, 2022
- Ibiden Co., Ltd.
- Akinori Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and a method of manufacturing a printed wiring...
- Patent number 9,480,170
- Issue date Oct 25, 2016
- Ibiden Co., Ltd.
- Katsuhiko Tanno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a printed wiring board
- Patent number 8,832,935
- Issue date Sep 16, 2014
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,624,132
- Issue date Jan 7, 2014
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball loading mask, apparatus and associated methodology
- Patent number 8,448,838
- Issue date May 28, 2013
- Ibiden Co., Ltd.
- Shigeki Sawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a printed wiring board
- Patent number 8,371,498
- Issue date Feb 12, 2013
- Ibiden Co., Ltd.
- Katsuhiko Tanno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,198,546
- Issue date Jun 12, 2012
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball loading mask, apparatus and associated methodology
- Patent number 8,157,157
- Issue date Apr 17, 2012
- Ibiden Co., Ltd.
- Shigeki Sawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for loading solder balls
- Patent number 8,091,766
- Issue date Jan 10, 2012
- Ibiden Co., Ltd.
- Katsuhiko Tanno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and a method of manufacturing a printed wiring...
- Patent number 8,087,164
- Issue date Jan 3, 2012
- Ibiden Co., Ltd.
- Katsuhiko Tanno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a printed wiring board
- Patent number 8,083,123
- Issue date Dec 27, 2011
- Ibiden Co., Ltd.
- Katsuhiko Tanno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,022,314
- Issue date Sep 20, 2011
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,017,875
- Issue date Sep 13, 2011
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,003,897
- Issue date Aug 23, 2011
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball loading method
- Patent number 8,001,683
- Issue date Aug 23, 2011
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball loading method and solder ball loading unit
- Patent number 7,866,529
- Issue date Jan 11, 2011
- Ibiden Co., Ltd.
- Atsunori Sumita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a printed wiring board
- Patent number 7,845,547
- Issue date Dec 7, 2010
- Ibiden Co., Ltd.
- Katsuhiko Tanno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method and manufacturing apparatus of printed wiring...
- Patent number 7,823,762
- Issue date Nov 2, 2010
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 7,714,233
- Issue date May 11, 2010
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball loading method and solder ball loading unit background...
- Patent number 7,475,803
- Issue date Jan 13, 2009
- Ibiden Co., Ltd.
- Atsunori Sumita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball loading apparatus
- Patent number 7,472,473
- Issue date Jan 6, 2009
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230080335
- Publication date Mar 16, 2023
- IBIDEN CO., LTD.
- Satoru KAWAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220174815
- Publication date Jun 2, 2022
- IBIDEN CO., LTD.
- Akinori YOSHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210092841
- Publication date Mar 25, 2021
- IBIDEN CO., LTD.
- Akinori YOSHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD WITH BUMP AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160100484
- Publication date Apr 7, 2016
- IBIDEN CO., LTD.
- Masatoshi KUNIEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MASK FOR LOADING BALL, BALL LOADING APPARATUS AND METHOD FOR MANUFA...
- Publication number 20150230346
- Publication date Aug 13, 2015
- IBIDEN CO., LTD.
- Katsuhiko TANNO
- B32 - LAYERED PRODUCTS
Information Patent Application
Solder Ball Loading Mask, Apparatus And Associated Methodology
- Publication number 20120080504
- Publication date Apr 5, 2012
- IBIDEN, CO., LTD.
- Shigeki Sawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Ball Loading Mask, Apparatus and Associated Methodology
- Publication number 20120080505
- Publication date Apr 5, 2012
- IBIDEN, CO., LTD.
- Shigeki Sawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR LOADING SOLDER BALLS
- Publication number 20120067938
- Publication date Mar 22, 2012
- IBIDEN CO., LTD.
- Katsuhiko TANNO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Wiring Board And A Method Of Manufacturing A Printed Wiring...
- Publication number 20120031659
- Publication date Feb 9, 2012
- IBIDEN CO., LTD.
- Katsuhiko Tanno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20110214915
- Publication date Sep 8, 2011
- IBIDEN CO., LTD.
- Yoichiro Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20110061232
- Publication date Mar 17, 2011
- IBIDEN CO., LTD.
- Yoichiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20100155129
- Publication date Jun 24, 2010
- IBIDEN CO., LTD.
- Yoichiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20100065323
- Publication date Mar 18, 2010
- IBIDEN CO., LTD.
- Yoichiro Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BALL LOADING MASK, APPARATUS AND ASSOCIATED METHODOLOGY
- Publication number 20090294516
- Publication date Dec 3, 2009
- IBIDEN, CO., LTD.
- Shigeki Sawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A PRINTED WIRING BOARD
- Publication number 20090120680
- Publication date May 14, 2009
- IBIDEN CO., LTD.
- Katsuhiko Tanno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BALL LOADING METHOD AND SOLDER BALL LOADING UNIT
- Publication number 20090084827
- Publication date Apr 2, 2009
- IBIDEN CO., LTD.
- Atsunori Sumita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR LOADING SOLDER BALLS
- Publication number 20090026250
- Publication date Jan 29, 2009
- IBIDEN CO., LTD.
- Katsuhiko TANNO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A PRINTED WIRING BOARD
- Publication number 20090001139
- Publication date Jan 1, 2009
- IBIDEN CO., LTD.
- Katsuhiko Tanno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND A METHOD OF MANUFACTURING A PRINTED WIRING...
- Publication number 20080302560
- Publication date Dec 11, 2008
- IBIDEN CO., LTD.
- Katsuhiko Tanno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A PRINTED WIRING BOARD
- Publication number 20080283580
- Publication date Nov 20, 2008
- IBIDEN CO., LTD.
- Katsuhiko Tanno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20080149369
- Publication date Jun 26, 2008
- IBIDEN CO., LTD.
- Yoichiro KAWAMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLDER BALL LOADING METHOD AND SOLDER BALL LOADING APPARATUS
- Publication number 20080120832
- Publication date May 29, 2008
- IBIDEN CO., LTD.
- Yoichiro Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder ball loading method and solder ball loading apparatus
- Publication number 20070251089
- Publication date Nov 1, 2007
- IBIDEN CO., LTD.
- Yoichiro Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board
- Publication number 20070096327
- Publication date May 3, 2007
- IBIDEN CO., LTD.
- Yoichiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board
- Publication number 20070086147
- Publication date Apr 19, 2007
- IBIDEN CO., LTD.
- Yoichiro Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder ball loading method and solder ball loading unit background...
- Publication number 20060157540
- Publication date Jul 20, 2006
- IBIDEN CO., LTD.
- Atsunori Sumita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Katsuhiko Tanno

Person

Patents Grantslast 30 patents

Printed wiring board and method for manufacturing the same

Printed wiring board and method for manufacturing the same

Printed wiring board and a method of manufacturing a printed wiring...

Method of manufacturing a printed wiring board

Printed wiring board

Solder ball loading mask, apparatus and associated methodology

Method for manufacturing a printed wiring board

Printed wiring board

Solder ball loading mask, apparatus and associated methodology

Method and apparatus for loading solder balls

Printed wiring board and a method of manufacturing a printed wiring...

Method for manufacturing a printed wiring board

Printed wiring board

Printed wiring board

Printed wiring board

Solder ball loading method

Solder ball loading method and solder ball loading unit

Method for manufacturing a printed wiring board

Manufacturing method and manufacturing apparatus of printed wiring...

Printed wiring board

Solder ball loading method and solder ball loading unit background...

Solder ball loading apparatus

Patents Applicationslast 30 patents

PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD WITH BUMP AND METHOD FOR MANUFACTURING THE SAME

MASK FOR LOADING BALL, BALL LOADING APPARATUS AND METHOD FOR MANUFA...

Solder Ball Loading Mask, Apparatus And Associated Methodology

Solder Ball Loading Mask, Apparatus and Associated Methodology

METHOD AND APPARATUS FOR LOADING SOLDER BALLS

Printed Wiring Board And A Method Of Manufacturing A Printed Wiring...

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD

SOLDER BALL LOADING MASK, APPARATUS AND ASSOCIATED METHODOLOGY

METHOD FOR MANUFACTURING A PRINTED WIRING BOARD

SOLDER BALL LOADING METHOD AND SOLDER BALL LOADING UNIT

METHOD AND APPARATUS FOR LOADING SOLDER BALLS

METHOD FOR MANUFACTURING A PRINTED WIRING BOARD

PRINTED WIRING BOARD AND A METHOD OF MANUFACTURING A PRINTED WIRING...

METHOD FOR MANUFACTURING A PRINTED WIRING BOARD

PRINTED WIRING BOARD

SOLDER BALL LOADING METHOD AND SOLDER BALL LOADING APPARATUS

Solder ball loading method and solder ball loading apparatus

Printed wiring board

Printed wiring board

Solder ball loading method and solder ball loading unit background...