Kaveh HOSSEINI

Person

San Jose, CA, US

People

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED PHOTONIC INTEGRATED CIRCUITS
- Publication number 20240329301
- Publication date Oct 3, 2024
- Intel Corporation
- Kaveh Hosseini
- G02 - OPTICS
Information Patent Application
TECHNOLOGIES FOR A MICROLENS DESIGN WITH DIFFERENT LIGHT EMITTING A...
- Publication number 20240329313
- Publication date Oct 3, 2024
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC...
- Publication number 20240319457
- Publication date Sep 26, 2024
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN
- Publication number 20240319437
- Publication date Sep 26, 2024
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
FIBER ARRAY UNIT (FAU) DESIGNS TO ENABLE A HIGHER IO BANDWIDTH PER...
- Publication number 20240061192
- Publication date Feb 22, 2024
- Intel Corporation
- Chia-Pin CHIU
- G02 - OPTICS
Information Patent Application
PHOTONICS PACKAGING WITH HIGH-DENSITY ROUTING
- Publication number 20230411369
- Publication date Dec 21, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED BRIDGE STRUCTURE FOR A PHOTONIC INTEGRATED CIRCUIT
- Publication number 20230358952
- Publication date Nov 9, 2023
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
THERMAL STRUCTURE FOR A MICRO-RING RESONATOR (MRR) IN A PHOTONIC IN...
- Publication number 20230341638
- Publication date Oct 26, 2023
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
COVERED CAVITY FOR A PHOTONIC INTEGRATED CIRCUIT (PIC)
- Publication number 20230341622
- Publication date Oct 26, 2023
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
ON-CAVITY PHOTONIC INTEGRATED CIRCUIT (OCPIC) TO ACHIEVE THE MOST U...
- Publication number 20230314850
- Publication date Oct 5, 2023
- Intel Corporation
- Chia-Pin CHIU
- G02 - OPTICS
Information Patent Application
UNDERCUT DESIGN WITH A BONDED BASE COVER FOR FRIENDLY ASSEMBLY AND...
- Publication number 20230314849
- Publication date Oct 5, 2023
- Intel Corporation
- Chia-Pin CHIU
- G02 - OPTICS
Information Patent Application
TEMPERATURE SENSOR TO ACHIEVE THERMAL STABILIZATION OF MICRO-RING R...
- Publication number 20230314704
- Publication date Oct 5, 2023
- Intel Corporation
- Chia-Pin CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS OF THERMAL INSULATION FOR MICRO-RING RESONATOR (MRR) IN ON-...
- Publication number 20230314703
- Publication date Oct 5, 2023
- Intel Corporation
- Chia-Pin CHIU
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A LENS ASSEMBLY
- Publication number 20230194783
- Publication date Jun 22, 2023
- Intel Corporation
- Kaveh Hosseini
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A GRIN LENS
- Publication number 20230194791
- Publication date Jun 22, 2023
- Intel Corporation
- Xiaoqian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN CAVITY PHOTONIC INTEGRATED CIRCUIT AND METHOD
- Publication number 20230185034
- Publication date Jun 15, 2023
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
MULTICHIP PACKAGE STAIRCASE CAVITIES
- Publication number 20230101340
- Publication date Mar 30, 2023
- Intel Corporation
- Kaveh HOSSEINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-CONFIGURABLE OPTICAL SWITCH IMPLEMENTATIONS WITHIN MULTI-CHIP...
- Publication number 20220413216
- Publication date Dec 29, 2022
- Intel Corporation
- Kaveh Hosseini
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
THERMAL INTERFACE STRUCTURES FOR OPTICAL COMMUNICATION DEVICES
- Publication number 20220390694
- Publication date Dec 8, 2022
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
CONVERTING MULTIPLE LIGHT SIGNALS INTO AND OUT OF A SINGLE WAVELENG...
- Publication number 20220197044
- Publication date Jun 23, 2022
- Intel Corporation
- Kaveh HOSSEINI
- G02 - OPTICS
Information Patent Application
BIDIRECTIONAL OPTICAL GRATING COUPLER WITH MULTIPLE LIGHT PATHS FOR...
- Publication number 20220196936
- Publication date Jun 23, 2022
- Intel Corporation
- Kaveh HOSSEINI
- G02 - OPTICS
Information Patent Application
EMBEDDED FARADAY ROTATORS AND COMPONENTS FOR INCREASING BANDWIDTH A...
- Publication number 20220190918
- Publication date Jun 16, 2022
- Intel Corporation
- Brandon C. MARIN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Kaveh HOSSEINI

Person

Patents Applicationslast 30 patents

EMBEDDED PHOTONIC INTEGRATED CIRCUITS

TECHNOLOGIES FOR A MICROLENS DESIGN WITH DIFFERENT LIGHT EMITTING A...

UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC...

PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN

FIBER ARRAY UNIT (FAU) DESIGNS TO ENABLE A HIGHER IO BANDWIDTH PER...

PHOTONICS PACKAGING WITH HIGH-DENSITY ROUTING

REDUCED BRIDGE STRUCTURE FOR A PHOTONIC INTEGRATED CIRCUIT

THERMAL STRUCTURE FOR A MICRO-RING RESONATOR (MRR) IN A PHOTONIC IN...

COVERED CAVITY FOR A PHOTONIC INTEGRATED CIRCUIT (PIC)

ON-CAVITY PHOTONIC INTEGRATED CIRCUIT (OCPIC) TO ACHIEVE THE MOST U...

UNDERCUT DESIGN WITH A BONDED BASE COVER FOR FRIENDLY ASSEMBLY AND...

TEMPERATURE SENSOR TO ACHIEVE THERMAL STABILIZATION OF MICRO-RING R...

DESIGNS OF THERMAL INSULATION FOR MICRO-RING RESONATOR (MRR) IN ON-...

ELECTRONIC DEVICE INCLUDING A LENS ASSEMBLY

ELECTRONIC DEVICE INCLUDING A GRIN LENS

OPEN CAVITY PHOTONIC INTEGRATED CIRCUIT AND METHOD

MULTICHIP PACKAGE STAIRCASE CAVITIES

FIELD-CONFIGURABLE OPTICAL SWITCH IMPLEMENTATIONS WITHIN MULTI-CHIP...

THERMAL INTERFACE STRUCTURES FOR OPTICAL COMMUNICATION DEVICES

CONVERTING MULTIPLE LIGHT SIGNALS INTO AND OUT OF A SINGLE WAVELENG...

BIDIRECTIONAL OPTICAL GRATING COUPLER WITH MULTIPLE LIGHT PATHS FOR...

EMBEDDED FARADAY ROTATORS AND COMPONENTS FOR INCREASING BANDWIDTH A...