Kazuaki Ano

Person

Hayami-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having marking layer
- Patent number 8,310,069
- Issue date Nov 13, 2012
- Texas Instruements Incorporated
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delamination resistant packaged die having support and shaped die h...
- Patent number 8,058,706
- Issue date Nov 15, 2011
- Texas Instruments Incorporated
- Chien-Te Feng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device having improved contacts
- Patent number 7,893,544
- Issue date Feb 22, 2011
- Texas Instruments Incorporated
- Kazuaki Ano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Roll-on encapsulation method for semiconductor packages
- Patent number 7,829,389
- Issue date Nov 9, 2010
- Texas Instruments Incorporated
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile ball-grid array package for high power
- Patent number 7,350,293
- Issue date Apr 1, 2008
- Texas Instruments Incorporated
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved contacts
- Patent number 7,233,074
- Issue date Jun 19, 2007
- Texas Instruments Incorporated
- Kazuaki Ano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding for thin semiconductor package
- Patent number 7,192,861
- Issue date Mar 20, 2007
- Texas Instruments Incorporated
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile ball-grid array package for high power
- Patent number 7,154,166
- Issue date Dec 26, 2006
- Texas Instruments Incorporated
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for carrying a semiconductor chip and semiconductor devic...
- Patent number 6,977,443
- Issue date Dec 20, 2005
- Texas Instruments Incorporated
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost substrate for an integrated circuit device with bondpads f...
- Patent number 6,969,638
- Issue date Nov 29, 2005
- Texas Instruments Incorporated
- Erwin R. Estepa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding for thin semiconductor package
- Patent number 6,815,836
- Issue date Nov 9, 2004
- Texas Instruments Incorporated
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method
- Patent number 6,087,717
- Issue date Jul 11, 2000
- Texas Instruments Incorporated
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,060,775
- Issue date May 9, 2000
- Texas Instruments Incorporated
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device with Improved Contacts
- Publication number 20110136335
- Publication date Jun 9, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Kazuaki Ano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DELAMINATION RESISTANT PACKAGED DIE HAVING SUPPORT AND SHAPED DIE H...
- Publication number 20110057296
- Publication date Mar 10, 2011
- TEXAS INSTRUMENTS INCORPORATED
- CHIEN-TE FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Secured to Leadframe by Friction
- Publication number 20110001227
- Publication date Jan 6, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH LAMINATED INTERPOSING LAYER
- Publication number 20090236715
- Publication date Sep 24, 2009
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SEMICONDUCTOR DEVICE PACKAGE ASSEMBLY AND METHOD
- Publication number 20090108433
- Publication date Apr 30, 2009
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROLL-ON ENCAPSULATION METHOD FOR SEMICONDUCTOR PACKAGES
- Publication number 20090093088
- Publication date Apr 9, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MARKING LAYER
- Publication number 20090091029
- Publication date Apr 9, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe Array with Riveted Heat Sinks
- Publication number 20080230880
- Publication date Sep 25, 2008
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING EVAPORATED SYMBOLIZATION
- Publication number 20080179761
- Publication date Jul 31, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Kazuaki Ano
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Semiconductor Device with Improved Contacts
- Publication number 20070284740
- Publication date Dec 13, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Kazuaki Ano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having improved mechanical and thermal reliabi...
- Publication number 20070035023
- Publication date Feb 15, 2007
- Kazuaki Ano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low profile ball-grid array package for high power
- Publication number 20060157831
- Publication date Jul 20, 2006
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for applying solder
- Publication number 20050139643
- Publication date Jun 30, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Kazuaki Ano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding for thin semiconductor package
- Publication number 20050042855
- Publication date Feb 24, 2005
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High reliability solder joint with multilayer structure
- Publication number 20040262370
- Publication date Dec 30, 2004
- Kazuaki Ano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING FOR THIN SEMICONDUCTOR PACKAGE
- Publication number 20040191954
- Publication date Sep 30, 2004
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air release molding system
- Publication number 20030203063
- Publication date Oct 30, 2003
- Kazuaki Ano
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor device and mounting method
- Publication number 20030132520
- Publication date Jul 17, 2003
- Masako Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WIREBONDED MULTICHIP MODULE
- Publication number 20030111716
- Publication date Jun 19, 2003
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate for carrying a semiconductor chip and semiconductor devic...
- Publication number 20030042586
- Publication date Mar 6, 2003
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low profile ball-grid array package for high power
- Publication number 20030034553
- Publication date Feb 20, 2003
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS

Kazuaki Ano

Person

Patents Grantslast 30 patents

Semiconductor package having marking layer

Delamination resistant packaged die having support and shaped die h...

Semiconductor device having improved contacts

Roll-on encapsulation method for semiconductor packages

Low profile ball-grid array package for high power

Semiconductor device with improved contacts

Wire bonding for thin semiconductor package

Low profile ball-grid array package for high power

Substrate for carrying a semiconductor chip and semiconductor devic...

Low cost substrate for an integrated circuit device with bondpads f...

Wire bonding for thin semiconductor package

Semiconductor device and manufacturing method

Semiconductor device

Patents Applicationslast 30 patents

Semiconductor Device with Improved Contacts

DELAMINATION RESISTANT PACKAGED DIE HAVING SUPPORT AND SHAPED DIE H...

Semiconductor Chip Secured to Leadframe by Friction

SEMICONDUCTOR PACKAGE STRUCTURE WITH LAMINATED INTERPOSING LAYER

MULTILAYER SEMICONDUCTOR DEVICE PACKAGE ASSEMBLY AND METHOD

ROLL-ON ENCAPSULATION METHOD FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE HAVING MARKING LAYER

Leadframe Array with Riveted Heat Sinks

SEMICONDUCTOR PACKAGE HAVING EVAPORATED SYMBOLIZATION

Semiconductor Device with Improved Contacts

Semiconductor device having improved mechanical and thermal reliabi...

Low profile ball-grid array package for high power

Method and system for applying solder

Wire bonding for thin semiconductor package

High reliability solder joint with multilayer structure

WIRE BONDING FOR THIN SEMICONDUCTOR PACKAGE

Air release molding system

Semiconductor device and mounting method

WIREBONDED MULTICHIP MODULE

Substrate for carrying a semiconductor chip and semiconductor devic...

Low profile ball-grid array package for high power