Kazuo Kimura

Person

Aichi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ceramic substrate, ceramic package for housing light emitting element
- Patent number 7,648,775
- Issue date Jan 19, 2010
- NGK Spark Plug Co., Ltd.
- Hisashi Wakako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating printed-wiring substrate
- Patent number 6,887,512
- Issue date May 3, 2005
- NGK Spark Plug Co., Ltd.
- Hisashi Wakako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 6,573,458
- Issue date Jun 3, 2003
- NGK Spark Plug Co., Ltd.
- Hideshi Matsubara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed-wiring substrate and method for fabricating the printed-wir...
- Patent number 6,472,609
- Issue date Oct 29, 2002
- NGK Spark Plug Co., Ltd.
- Hisashi Wakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resinous circuit board with pins improved in joining strength
- Patent number 6,376,782
- Issue date Apr 23, 2002
- NGK Spark Plug Co., Ltd.
- Kazuo Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making laminate ceramic substrate with domed pads
- Patent number 6,224,703
- Issue date May 1, 2001
- NGK Spark Plug Co., Ltd.
- Kozo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate having pads to be attached to terminal members wi...
- Patent number 5,838,069
- Issue date Nov 17, 1998
- NGK Spark Plug Co., Ltd.
- Motohiko Itai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic lid assembly for semiconductor packages
- Patent number 5,825,086
- Issue date Oct 20, 1998
- NGK Spark Plug Co., Ltd.
- Kazuo Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic IC package base and ceramic cover
- Patent number 5,798,566
- Issue date Aug 25, 1998
- NGK Spark Plug Co., Ltd.
- Kazuhisa Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic package lid having metallized layer with varying widths
- Patent number 5,779,081
- Issue date Jul 14, 1998
- NGK Spark Plug Co., Ltd.
- Kazuo Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Outer lead for a semiconductor IC package and a method of fabricati...
- Patent number 5,668,060
- Issue date Sep 16, 1997
- NGK Spark Plug Co., Ltd.
- Kazuhisa Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Outer lead for a semiconductor IC package having individually annea...
- Patent number 5,583,379
- Issue date Dec 10, 1996
- NGK Spark Plug Co., Ltd.
- Kazuhisa Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jig for electroplating lead pins of an integrated circuit package
- Patent number 5,580,432
- Issue date Dec 3, 1996
- NGK Spark Plug Co., Ltd.
- Takahiro Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of electroplating lead pins of integrated circuit package
- Patent number 5,459,102
- Issue date Oct 17, 1995
- NGK Spark Plug Co., Ltd.
- Takahiro Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-ceramics composite materials
- Patent number 4,532,190
- Issue date Jul 30, 1985
- NGK Spark Plug Co., Ltd.
- Rokuro Kanbe
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
Ceramic substrate, ceramic package for housing light emitting element
- Publication number 20060147746
- Publication date Jul 6, 2006
- NGK SPARK PLUG CO., LTD.
- Hisashi Wakako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed-wiring substrate and method for fabricating the printed-wir...
- Publication number 20020189860
- Publication date Dec 19, 2002
- NGK SPARK PLUG CO., LTD.
- Hisashi Wakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed-wiring substrate and method for fabricating the printed-wir...
- Publication number 20010047881
- Publication date Dec 6, 2001
- NGK SPARK PLUG CO., LTD.
- Hisashi Wakako
- H01 - BASIC ELECTRIC ELEMENTS

Kazuo Kimura

Person

Patents Grantslast 30 patents

Ceramic substrate, ceramic package for housing light emitting element

Method for fabricating printed-wiring substrate

Printed circuit board

Printed-wiring substrate and method for fabricating the printed-wir...

Resinous circuit board with pins improved in joining strength

Method of making laminate ceramic substrate with domed pads

Ceramic substrate having pads to be attached to terminal members wi...

Ceramic lid assembly for semiconductor packages

Ceramic IC package base and ceramic cover

Ceramic package lid having metallized layer with varying widths

Outer lead for a semiconductor IC package and a method of fabricati...

Outer lead for a semiconductor IC package having individually annea...

Jig for electroplating lead pins of an integrated circuit package

Method of electroplating lead pins of integrated circuit package

Metal-ceramics composite materials

Patents Applicationslast 30 patents

Ceramic substrate, ceramic package for housing light emitting element

Printed-wiring substrate and method for fabricating the printed-wir...

Printed-wiring substrate and method for fabricating the printed-wir...