Kedar Sapre

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Intrench profile
- Patent number 9,012,302
- Issue date Apr 21, 2015
- Applied Materials, Inc.
- Kedar Sapre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intrench profile
- Patent number 8,927,390
- Issue date Jan 6, 2015
- Applied Materials, Inc.
- Kedar Sapre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double patterning etching process
- Patent number 8,759,223
- Issue date Jun 24, 2014
- Applied Materials, Inc.
- Kedar Sapre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner property improvement
- Patent number 8,617,989
- Issue date Dec 31, 2013
- Applied Materials, Inc.
- Kedar Sapre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformality of oxide layers along sidewalls of deep vias
- Patent number 8,404,583
- Issue date Mar 26, 2013
- Applied Materials, Inc.
- Zhong Qiang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced pattern loading using bis(diethylamino)silane (C8H22N2Si) a...
- Patent number 8,236,708
- Issue date Aug 7, 2012
- Applied Materials, Inc.
- Sasha Kweskin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon-selective dry etch for carbon-containing films
- Patent number 8,211,808
- Issue date Jul 3, 2012
- Applied Materials, Inc.
- Kedar Sapre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-ozone CVD with reduced pattern loading using incubation per...
- Patent number 7,994,019
- Issue date Aug 9, 2011
- Applied Materials, Inc.
- Sasha Kweskin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical vapor deposition of high quality flow-like silicon dioxide...
- Patent number 7,825,038
- Issue date Nov 2, 2010
- Applied Materials, Inc.
- Nitin K. Ingle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
INTRENCH PROFILE
- Publication number 20150031211
- Publication date Jan 29, 2015
- Applied Materials, Inc.
- Kedar Sapre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN DEPOSITION SEQUENCE
- Publication number 20140273451
- Publication date Sep 18, 2014
- Benjamin C. Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTRENCH PROFILE
- Publication number 20130260533
- Publication date Oct 3, 2013
- Kedar Sapre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSENSITIVE DRY REMOVAL PROCESS FOR SEMICONDUCTOR INTEGRATION
- Publication number 20130260564
- Publication date Oct 3, 2013
- Kedar Sapre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRETREATMENT AND IMPROVED DIELECTRIC COVERAGE
- Publication number 20130252440
- Publication date Sep 26, 2013
- Applied Materials, Inc.
- Lei Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER PROPERTY IMPROVEMENT
- Publication number 20130102149
- Publication date Apr 25, 2013
- Applied Materials, Inc.
- Kedar Sapre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE PATTERNING ETCHING PROCESS
- Publication number 20130048605
- Publication date Feb 28, 2013
- Applied Materials, Inc.
- Kedar SAPRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED TRIPLE PATTERNING
- Publication number 20120085733
- Publication date Apr 12, 2012
- Applied Materials, Inc.
- Bencherki Mebarki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING LOW MOISTURE DIELECTRIC FILMS
- Publication number 20120058281
- Publication date Mar 8, 2012
- Applied Materials, Inc.
- Zhong Qiang Hua
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REDUCED PATTERN LOADING USING BIS(DIETHYLAMINO)SILANE (C8H22N2Si) A...
- Publication number 20110223774
- Publication date Sep 15, 2011
- Applied Materials, Inc.
- Sasha Kweskin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONFORMALITY OF OXIDE LAYERS ALONG SIDEWALLS OF DEEP VIAS
- Publication number 20110223760
- Publication date Sep 15, 2011
- Applied Materials, Inc.
- Zhong Qiang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-SELECTIVE DRY ETCH FOR CARBON-CONTAINING FILMS
- Publication number 20110053380
- Publication date Mar 3, 2011
- Applied Materials, Inc.
- Kedar Sapre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL VAPOR DEPOSITION OF HIGH QUALITY FLOW-LIKE SILICON DIOXIDE...
- Publication number 20090031953
- Publication date Feb 5, 2009
- Applied Materials, Inc.
- Nitin K. Ingle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
OXYGEN SACVD TO FORM SACRIFICAL OXIDE LINERS IN SUBSTRATE GAPS
- Publication number 20080311753
- Publication date Dec 18, 2008
- Applied Materials, Inc.
- Yi Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL VAPOR DEPOSITION OF HIGH QUALITY FLOW-LIKE SILICON DIOXIDE...
- Publication number 20070281496
- Publication date Dec 6, 2007
- Applied Materials, Inc.
- Nitin K. Ingle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Kedar Sapre

Person

Patents Grantslast 30 patents

Intrench profile

Intrench profile

Double patterning etching process

Liner property improvement

Conformality of oxide layers along sidewalls of deep vias

Reduced pattern loading using bis(diethylamino)silane (C8H22N2Si) a...

Silicon-selective dry etch for carbon-containing films

Silicon-ozone CVD with reduced pattern loading using incubation per...

Chemical vapor deposition of high quality flow-like silicon dioxide...

Patents Applicationslast 30 patents

INTRENCH PROFILE

TUNGSTEN DEPOSITION SEQUENCE

INTRENCH PROFILE

INSENSITIVE DRY REMOVAL PROCESS FOR SEMICONDUCTOR INTEGRATION

PRETREATMENT AND IMPROVED DIELECTRIC COVERAGE

LINER PROPERTY IMPROVEMENT

DOUBLE PATTERNING ETCHING PROCESS

SELF ALIGNED TRIPLE PATTERNING

METHODS FOR FORMING LOW MOISTURE DIELECTRIC FILMS

REDUCED PATTERN LOADING USING BIS(DIETHYLAMINO)SILANE (C8H22N2Si) A...

CONFORMALITY OF OXIDE LAYERS ALONG SIDEWALLS OF DEEP VIAS

SILICON-SELECTIVE DRY ETCH FOR CARBON-CONTAINING FILMS

CHEMICAL VAPOR DEPOSITION OF HIGH QUALITY FLOW-LIKE SILICON DIOXIDE...

OXYGEN SACVD TO FORM SACRIFICAL OXIDE LINERS IN SUBSTRATE GAPS

CHEMICAL VAPOR DEPOSITION OF HIGH QUALITY FLOW-LIKE SILICON DIOXIDE...