Kee Kwang Lau

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure
- Patent number 8,766,438
- Issue date Jul 1, 2014
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package design and method of manufacture for chip grid array
- Patent number 7,456,496
- Issue date Nov 25, 2008
- Advanpack Solutions PTE LTD
- Tan Kim Hwee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package design and method of manufacture for chip grid array
- Patent number 6,929,981
- Issue date Aug 16, 2005
- Advanpack Solutions PTE, Ltd.
- Tan Kim Hwee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip grid array package design and method of manufacture
- Patent number 6,734,039
- Issue date May 11, 2004
- Advanpack Solutions PTE LTD
- Tan Kim Hwee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLIP CHIP IN PACKAGE USING FLEXIBLE AND REMOVABLE LEADFRAME
- Publication number 20080150107
- Publication date Jun 26, 2008
- ADVANPACK SOLUTION PTES LTD
- Teck Tiong TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip in package using flexible and removable leadframe
- Publication number 20070196979
- Publication date Aug 23, 2007
- Advanpack Solutions Pte Ltd
- Teck Tiong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded passive component
- Publication number 20060060937
- Publication date Mar 23, 2006
- Advanpack Solutions Pte Ltd
- Eng Han Matthew Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package design and method of manufacture for chip grid array
- Publication number 20050205987
- Publication date Sep 22, 2005
- Advanpack Solutions Pte. Ltd.
- Tan Kim Hwee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless semiconductor packaging structure with inverted flip chip...
- Publication number 20040108580
- Publication date Jun 10, 2004
- Advanpack Solutions Pte. Ltd.
- Kim Hwee Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for constraining the spread of solder during reflow for prep...
- Publication number 20040084508
- Publication date May 6, 2004
- Advanpack Solutions Pte. Ltd.
- John Briar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor chip grid array package design and method of manufacture
- Publication number 20040046238
- Publication date Mar 11, 2004
- Advanpack Solutions Pte. Ltd.
- Tan Kim Hwee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Package design and method of manufacture for chip grid array
- Publication number 20040046257
- Publication date Mar 11, 2004
- Advanpack Solutions Pte. Ltd.
- Tan Kim Hwee
- H01 - BASIC ELECTRIC ELEMENTS

Kee Kwang Lau

Person

Patents Grantslast 30 patents

Package structure

Package design and method of manufacture for chip grid array

Package design and method of manufacture for chip grid array

Semiconductor chip grid array package design and method of manufacture

Patents Applicationslast 30 patents

FLIP CHIP IN PACKAGE USING FLEXIBLE AND REMOVABLE LEADFRAME

Flip chip in package using flexible and removable leadframe

Embedded passive component

Package design and method of manufacture for chip grid array

Leadless semiconductor packaging structure with inverted flip chip...

Method for constraining the spread of solder during reflow for prep...

Semiconductor chip grid array package design and method of manufacture

Package design and method of manufacture for chip grid array