Keen Wah Chow

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and memory device including conductive lines and contacts...
- Patent number 11,990,367
- Issue date May 21, 2024
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus comprising structures including contact vias and conducti...
- Patent number 11,101,171
- Issue date Aug 24, 2021
- Micron Technology, Inc.
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive components and memory assemblies
- Patent number 10,475,810
- Issue date Nov 12, 2019
- Micron Technology, Inc.
- Sudip Bandyopadhyay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive components and memory assemblies
- Patent number 10,014,319
- Issue date Jul 3, 2018
- Micron Technology, Inc.
- Sudip Bandyopadhyay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive components and memory assemblies
- Patent number 9,773,807
- Issue date Sep 26, 2017
- Micron Technology, Inc.
- Sudip Bandyopadhyay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for passivation of plasma etch defects in DRAM devices
- Patent number 7,407,871
- Issue date Aug 5, 2008
- TECH Semiconductor Singapore Pte Ltd.
- Arvind Kumar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUSES AND MEMORY DEVICES INCLUDING CONDUCTIVE LINES AND INTER...
- Publication number 20240266214
- Publication date Aug 8, 2024
- Lodestar Licensing Group LLC
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES TO MANUFACTURE INTER-LAYER VIAS
- Publication number 20240079317
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Jun Rong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING CONDUCTIVE LINES AND CONTACTS, AND RELATED METH...
- Publication number 20210375670
- Publication date Dec 2, 2021
- Micron Technology, Inc.
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Barrier Material Between Silicon-Conta...
- Publication number 20210091009
- Publication date Mar 25, 2021
- Micron Technology, Inc.
- Devesh Kumar Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS COMPRISING STRUCTURES INCLUDING CONTACT VIAS AND CONDUCTI...
- Publication number 20210050252
- Publication date Feb 18, 2021
- Micron Technology, Inc.
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Components and Memory Assemblies
- Publication number 20180308861
- Publication date Oct 25, 2018
- Micron Technology, Inc.
- Sudip Bandyopadhyay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHALLOW TRENCH ISOLATION IN DYNAMIC RANDOM ACCESS MEMORY AND MANUFA...
- Publication number 20130234280
- Publication date Sep 12, 2013
- INOTERA MEMORIES, INC.
- ARVIND KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to improve transistor performance matching for plasma-assist...
- Publication number 20110201185
- Publication date Aug 18, 2011
- TECH Semiconductor Singapore Pte. Ltd.
- Devesh Kumar Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for passivation of plasma etch defects in DRAM devices
- Publication number 20080124814
- Publication date May 29, 2008
- TECH Semiconductor Singapore Pte. Ltd.
- Arvind Kumar
- H01 - BASIC ELECTRIC ELEMENTS

Keen Wah Chow

Person

Patents Grantslast 30 patents

Apparatus and memory device including conductive lines and contacts...

Apparatus comprising structures including contact vias and conducti...

Conductive components and memory assemblies

Conductive components and memory assemblies

Conductive components and memory assemblies

Method for passivation of plasma etch defects in DRAM devices

Patents Applicationslast 30 patents

APPARATUSES AND MEMORY DEVICES INCLUDING CONDUCTIVE LINES AND INTER...

TECHNIQUES TO MANUFACTURE INTER-LAYER VIAS

APPARATUS INCLUDING CONDUCTIVE LINES AND CONTACTS, AND RELATED METH...

Integrated Assemblies Having Barrier Material Between Silicon-Conta...

APPARATUS COMPRISING STRUCTURES INCLUDING CONTACT VIAS AND CONDUCTI...

Conductive Components and Memory Assemblies

SHALLOW TRENCH ISOLATION IN DYNAMIC RANDOM ACCESS MEMORY AND MANUFA...

Method to improve transistor performance matching for plasma-assist...

Method for passivation of plasma etch defects in DRAM devices