Keh-Chiang Ku

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Partial buried channel transfer device for image sensors
- Patent number 9,698,185
- Issue date Jul 4, 2017
- OmniVision Technologies, Inc.
- Gang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, apparatus and system for providing improved full well capac...
- Patent number 8,804,021
- Issue date Aug 12, 2014
- OmniVision Technologies, Inc.
- Sohei Manabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching narrow, tall dielectric isolation structures from a dielect...
- Patent number 8,729,655
- Issue date May 20, 2014
- OmniVision Technologies, Inc.
- Chia-Ying Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad design for circuit under pad in semiconductor devices
- Patent number 8,729,712
- Issue date May 20, 2014
- OmniVision Technologies, Inc.
- Yin Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of damage-free impurity doping for CMOS image sensors
- Patent number 8,614,112
- Issue date Dec 24, 2013
- OmniVision Technologies, Inc.
- Keh-Chiang Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad design for circuit under pad in semiconductor devices
- Patent number 8,569,856
- Issue date Oct 29, 2013
- OmniVision Technologies, Inc.
- Yin Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation area between semiconductor devices having additional acti...
- Patent number 8,471,316
- Issue date Jun 25, 2013
- OmniVision Technologies, Inc.
- Hsin-Chih Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring support for backside illuminated image sensor
- Patent number 8,466,010
- Issue date Jun 18, 2013
- OmniVision Technologies, Inc.
- Hsin-Chih Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring support for backside illuminated image sensor
- Patent number 8,373,243
- Issue date Feb 12, 2013
- OmniVision Technologies, Inc.
- Hsin-Chih Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching narrow, tall dielectric isolation structures from a dielect...
- Patent number 8,338,263
- Issue date Dec 25, 2012
- OmniVision Technologies, Inc.
- Chia-Ying Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing using scribe line etch
- Patent number 8,071,429
- Issue date Dec 6, 2011
- OmniVision Technologies, Inc.
- Yin Qian
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CMOS Image Sensor With Integrated Silicon Color Filters
- Publication number 20140374862
- Publication date Dec 25, 2014
- OMNIVISION TECHNOLOGIES, INC.
- ChiaYing Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING NARROW, TALL DIELECTRIC ISOLATION STRUCTURES FROM A DIELECT...
- Publication number 20140035087
- Publication date Feb 6, 2014
- Chia-Ying Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD DESIGN FOR CIRCUIT UNDER PAD IN SEMICONDUCTOR DEVICES
- Publication number 20140035089
- Publication date Feb 6, 2014
- OMNIVISION TECHNOLOGIES, INC.
- Yin Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING SUPPORT FOR BACKSIDE ILLUMINATED IMAGE SENSOR
- Publication number 20130122637
- Publication date May 16, 2013
- OMNIVISION TECHNOLOGIES, INC.
- Hsin-Chih Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, APPARATUS AND SYSTEM FOR PROVIDING IMPROVED FULL WELL CAPAC...
- Publication number 20130113969
- Publication date May 9, 2013
- OMNIVISION TECHNOLOGIES, INC.
- Sohei Manabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD DESIGN FOR CIRCUIT UNDER PAD IN SEMICONDUCTOR DEVICES
- Publication number 20130113065
- Publication date May 9, 2013
- OMNIVISION TECHNOLOGIES, INC.
- Yin Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTIAL BURIED CHANNEL TRANSFER DEVICE FOR IMAGE SENSORS
- Publication number 20130092982
- Publication date Apr 18, 2013
- OMNIVISION TECHNOLOGIES, INC.
- Gang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation Area Between Semiconductor Devices Having Additional Acti...
- Publication number 20130056808
- Publication date Mar 7, 2013
- Hsin-Chih Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dopant Implantation Hardmask for Forming Doped Isolation Regions in...
- Publication number 20120319242
- Publication date Dec 20, 2012
- Duli Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING NARROW, TALL DIELECTRIC ISOLATION STRUCTURES FROM A DIELECT...
- Publication number 20120319230
- Publication date Dec 20, 2012
- Chia-Ying Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, APPARATUS AND SYSTEM TO PROVIDE CONDUCTIVITY FOR A SUBSTRAT...
- Publication number 20120280109
- Publication date Nov 8, 2012
- OMNIVISION TECHNOLOGIES, INC.
- Duli Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING SUPPORT FOR BACKSIDE ILLUMINATED IMAGE SENSOR
- Publication number 20120175722
- Publication date Jul 12, 2012
- OMNIVISION TECHNOLOGIES, INC.
- Hsin-Chih Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DAMAGE-FREE IMPURITY DOPING FOR CMOS IMAGE SENSORS
- Publication number 20120080765
- Publication date Apr 5, 2012
- OMNIVISION TECHNOLOGIES, INC.
- Keh-Chiang Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH EPITAXIALLY SELF-ALIGNED PHOTO SENSORS
- Publication number 20110169991
- Publication date Jul 14, 2011
- OMNIVISION TECHNOLOGIES, INC.
- Keh-Chiang Ku
- H01 - BASIC ELECTRIC ELEMENTS

Keh-Chiang Ku

Person

Patents Grantslast 30 patents

Partial buried channel transfer device for image sensors

Method, apparatus and system for providing improved full well capac...

Etching narrow, tall dielectric isolation structures from a dielect...

Pad design for circuit under pad in semiconductor devices

Method of damage-free impurity doping for CMOS image sensors

Pad design for circuit under pad in semiconductor devices

Isolation area between semiconductor devices having additional acti...

Seal ring support for backside illuminated image sensor

Seal ring support for backside illuminated image sensor

Etching narrow, tall dielectric isolation structures from a dielect...

Wafer dicing using scribe line etch

Patents Applicationslast 30 patents

CMOS Image Sensor With Integrated Silicon Color Filters

ETCHING NARROW, TALL DIELECTRIC ISOLATION STRUCTURES FROM A DIELECT...

PAD DESIGN FOR CIRCUIT UNDER PAD IN SEMICONDUCTOR DEVICES

SEAL RING SUPPORT FOR BACKSIDE ILLUMINATED IMAGE SENSOR

METHOD, APPARATUS AND SYSTEM FOR PROVIDING IMPROVED FULL WELL CAPAC...

PAD DESIGN FOR CIRCUIT UNDER PAD IN SEMICONDUCTOR DEVICES

PARTIAL BURIED CHANNEL TRANSFER DEVICE FOR IMAGE SENSORS

Isolation Area Between Semiconductor Devices Having Additional Acti...

Dopant Implantation Hardmask for Forming Doped Isolation Regions in...

ETCHING NARROW, TALL DIELECTRIC ISOLATION STRUCTURES FROM A DIELECT...

METHOD, APPARATUS AND SYSTEM TO PROVIDE CONDUCTIVITY FOR A SUBSTRAT...

SEAL RING SUPPORT FOR BACKSIDE ILLUMINATED IMAGE SENSOR

METHOD OF DAMAGE-FREE IMPURITY DOPING FOR CMOS IMAGE SENSORS

IMAGE SENSOR WITH EPITAXIALLY SELF-ALIGNED PHOTO SENSORS