Keishiro Okamoto

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device and method of manufacturing electronic device
- Patent number 9,462,693
- Issue date Oct 4, 2016
- Fujitsu Limited
- Keishiro Okamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor apparatus
- Patent number 9,177,938
- Issue date Nov 3, 2015
- Fujitsu Limited
- Motoaki Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power source device
- Patent number 9,082,756
- Issue date Jul 14, 2015
- Fujitsu Limited
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming bumps, semiconductor device and method for manuf...
- Patent number 8,962,470
- Issue date Feb 24, 2015
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, method for manufacturing the same and elec...
- Patent number 8,866,312
- Issue date Oct 21, 2014
- Fujitsu Limited
- Motoaki Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method of semiconductor device,...
- Patent number 8,728,867
- Issue date May 20, 2014
- Fujitsu Limited
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and power...
- Patent number 8,674,520
- Issue date Mar 18, 2014
- Fujitsu Limited
- Nobuhiro Imaizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same, and power s...
- Patent number 8,492,784
- Issue date Jul 23, 2013
- Fujitsu Limited
- Keishiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel interconnection board and method of fabricating the same
- Patent number 8,257,542
- Issue date Sep 4, 2012
- Fujitsu Limited
- Keishiro Okamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilevel interconnection board and method of fabricating the same
- Patent number 7,622,184
- Issue date Nov 24, 2009
- Fujitsu Limited
- Keishiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor system-in-package
- Patent number 7,557,014
- Issue date Jul 7, 2009
- Fujitsu Limited
- Keishiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for fabricating the same
- Patent number 7,420,130
- Issue date Sep 2, 2008
- Fujitsu Limited
- Keishiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for fabricating the same
- Patent number 7,246,435
- Issue date Jul 24, 2007
- Fujitsu Limited
- Keishiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor system-in-package
- Patent number 7,176,556
- Issue date Feb 13, 2007
- Fujitsu Limited
- Keishiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection method, electrode surface activation apparatus...
- Patent number 6,806,118
- Issue date Oct 19, 2004
- Fujitsu Limited
- Keishiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Piezoelectric actuator, method of manufacturing the same, ink-jet h...
- Patent number 6,781,290
- Issue date Aug 24, 2004
- Fujitsu Limited
- Kazuaki Kurihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME AND ELEC...
- Publication number 20150171053
- Publication date Jun 18, 2015
- FUJITSU LIMITED
- Motoaki TANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...
- Publication number 20150132865
- Publication date May 14, 2015
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20150049450
- Publication date Feb 19, 2015
- FUJITSU LIMITED
- Keishiro Okamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER SOURCE DEVICE
- Publication number 20140203444
- Publication date Jul 24, 2014
- Fujitsu Limited
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120217626
- Publication date Aug 30, 2012
- FUJITSU LIMITED
- Taiji SAKAI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME AND ELEC...
- Publication number 20120217660
- Publication date Aug 30, 2012
- FUJITSU LIMITED
- Motoaki TANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND POWER...
- Publication number 20120211899
- Publication date Aug 23, 2012
- FUJITSU LIMITED
- Nobuhiro IMAIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE,...
- Publication number 20120211901
- Publication date Aug 23, 2012
- FUJITSU LIMITED
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20120211762
- Publication date Aug 23, 2012
- FUJITSU LIMITED
- Tadahiro IMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120211764
- Publication date Aug 23, 2012
- Fujitsu Limited,
- Keishiro OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME, AND POWER S...
- Publication number 20120199991
- Publication date Aug 9, 2012
- FUJITSU LIMITED
- Keishiro OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL INTERCONNECTION BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20100024963
- Publication date Feb 4, 2010
- Fujitsu Limited
- Keishiro Okamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...
- Publication number 20090186425
- Publication date Jul 23, 2009
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and method for fabricating the same
- Publication number 20070240901
- Publication date Oct 18, 2007
- Fujitsu Limited
- Keishiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilevel interconnection board and method of fabricating the same
- Publication number 20070077391
- Publication date Apr 5, 2007
- FUJITSU LIMITED
- Keishiro Okamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor system-in-package
- Publication number 20070065981
- Publication date Mar 22, 2007
- FUJITSU LIMITED
- Keishiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and method for fabricating the same
- Publication number 20060175084
- Publication date Aug 10, 2006
- FUJITSU LIMITED
- Keishiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming bumps, semiconductor device and method for manuf...
- Publication number 20050161814
- Publication date Jul 28, 2005
- FUJITSU LIMITED
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrode connection method, electrode surface activation apparatus...
- Publication number 20030148593
- Publication date Aug 7, 2003
- FUJITSU LIMITED
- Keishiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Piezoelectric actuator, method of manufacturing the same, ink-jet h...
- Publication number 20030117041
- Publication date Jun 26, 2003
- Kazuaki Kurihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Semiconductor system-in-package
- Publication number 20030080400
- Publication date May 1, 2003
- FUJITSU LIMITED
- Keishiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS

Keishiro Okamoto

Person

Patents Grantslast 30 patents

Electronic device and method of manufacturing electronic device

Method for manufacturing semiconductor apparatus

Semiconductor device and power source device

Method for forming bumps, semiconductor device and method for manuf...

Semiconductor apparatus, method for manufacturing the same and elec...

Semiconductor device, manufacturing method of semiconductor device,...

Semiconductor device, method for manufacturing the same, and power...

Semiconductor device and method for producing the same, and power s...

Multilevel interconnection board and method of fabricating the same

Multilevel interconnection board and method of fabricating the same

Semiconductor system-in-package

Wiring board and method for fabricating the same

Wiring board and method for fabricating the same

Semiconductor system-in-package

Electrode connection method, electrode surface activation apparatus...

Piezoelectric actuator, method of manufacturing the same, ink-jet h...

Patents Applicationslast 30 patents

SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME AND ELEC...

METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND POWER SOURCE DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME AND ELEC...

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND POWER...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME, AND POWER S...

MULTILEVEL INTERCONNECTION BOARD AND METHOD OF FABRICATING THE SAME

METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...

Wiring board and method for fabricating the same

Multilevel interconnection board and method of fabricating the same

Semiconductor system-in-package

Wiring board and method for fabricating the same

Method for forming bumps, semiconductor device and method for manuf...

Electrode connection method, electrode surface activation apparatus...

Piezoelectric actuator, method of manufacturing the same, ink-jet h...

Semiconductor system-in-package