Keith E. Nelson

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method therefor
- Patent number 7,927,927
- Issue date Apr 19, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Son Ky Quan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package including a polymer encapsulated die
- Patent number 6,093,972
- Issue date Jul 25, 2000
- Motorola, Inc.
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid device with optically transmissive coating
- Patent number 5,973,337
- Issue date Oct 26, 1999
- Motorola, Inc.
- James H. Knapp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component
- Patent number 5,900,669
- Issue date May 4, 1999
- Motorola, Inc.
- James H. Knapp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package including a polymer encapsulated die, and m...
- Patent number 5,895,229
- Issue date Apr 20, 1999
- Motorola, Inc.
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method thereof
- Patent number 5,776,798
- Issue date Jul 7, 1998
- Motorola, Inc.
- Son Ky Quan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of making
- Patent number 5,468,910
- Issue date Nov 21, 1995
- Motorola, Inc.
- James H. Knapp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of molding a carrier ring to leads
- Patent number 5,182,071
- Issue date Jan 26, 1993
- Motorola, Inc.
- James H. Knapp
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Low reflection input configuration for integrated circuit packages
- Patent number 5,006,820
- Issue date Apr 9, 1991
- Motorola, Inc.
- Jerry E. Prioste
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package and method therefor
- Publication number 20020053452
- Publication date May 9, 2002
- Son Ky Quan
- H01 - BASIC ELECTRIC ELEMENTS

Keith E. Nelson

Person

Patents Grantslast 30 patents

Semiconductor package and method therefor

Microelectronic package including a polymer encapsulated die

Ball grid device with optically transmissive coating

Semiconductor component

Microelectronic package including a polymer encapsulated die, and m...

Semiconductor package and method thereof

Semiconductor device package and method of making

Method of molding a carrier ring to leads

Low reflection input configuration for integrated circuit packages

Patents Applicationslast 30 patents

Semiconductor package and method therefor