Kelvin Tan Aik Boo

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional bonding scheme and associated systems and methods
- Patent number 12,148,736
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates for semiconductor packages, including hybrid substrates...
- Patent number 11,894,289
- Issue date Feb 6, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with systems and methods for managing high...
- Patent number 11,710,722
- Issue date Jul 25, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal distribution network for semiconductor devices and associat...
- Patent number 11,688,662
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with multiple substrates and die stacks
- Patent number 11,562,987
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates for semiconductor packages, including hybrid substrates...
- Patent number 11,527,459
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICE PACKAGES AND ELE...
- Publication number 20240304598
- Publication date Sep 12, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC PACKAGE WITH STACK MOUNTED COMPONENTS AND R...
- Publication number 20240234390
- Publication date Jul 11, 2024
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC PACKAGES INCLUDING INTERPOSER STRUCTURES AN...
- Publication number 20240234403
- Publication date Jul 11, 2024
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...
- Publication number 20240128163
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS...
- Publication number 20240071980
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND M...
- Publication number 20240072024
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20240071869
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE FOR A SEMICONDUCTOR DEVICE
- Publication number 20240071880
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT
- Publication number 20240071881
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240071990
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT
- Publication number 20240074048
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS...
- Publication number 20240072022
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-RELEASING SOLDER MASK PATTERN FOR SEMICONDUCTOR DEVICES AND...
- Publication number 20240057265
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NESTED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MAKING THE SAME
- Publication number 20240047423
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL SEMICONDUCTOR TRACE LENGTH MATCHING AND ASSOCIATE...
- Publication number 20230378043
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
- Publication number 20230378128
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
- Publication number 20230378129
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR MANAGING HIGH...
- Publication number 20230369291
- Publication date Nov 16, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR USING AN INTE...
- Publication number 20230282588
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ROLE SEMICONDUCTOR DEVICE SUBSTRATES, SEMICONDUCTOR DEVICE AS...
- Publication number 20230282559
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL DISTRIBUTION NETWORK FOR SEMICONDUCTOR DEVICES AND ASSOCIAT...
- Publication number 20230061803
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING DIRECT-CONTACT HEAT PATHS AND METHODS OF MANUFA...
- Publication number 20230066375
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL BONDING SCHEME AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20230069476
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...
- Publication number 20230056648
- Publication date Feb 23, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...
- Publication number 20220352052
- Publication date Nov 3, 2022
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH MULTIPLE SUBSTRATES AND DIE STACKS
- Publication number 20220336417
- Publication date Oct 20, 2022
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR MANAGING HIGH...
- Publication number 20220336419
- Publication date Oct 20, 2022
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS

Kelvin Tan Aik Boo

Person

Patents Grantslast 30 patents

Three-dimensional bonding scheme and associated systems and methods

Substrates for semiconductor packages, including hybrid substrates...

Semiconductor assemblies with systems and methods for managing high...

Thermal distribution network for semiconductor devices and associat...

Semiconductor devices with multiple substrates and die stacks

Substrates for semiconductor packages, including hybrid substrates...

Patents Applicationslast 30 patents

MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICE PACKAGES AND ELE...

STACKED MICROELECTRONIC PACKAGE WITH STACK MOUNTED COMPONENTS AND R...

STACKED MICROELECTRONIC PACKAGES INCLUDING INTERPOSER STRUCTURES AN...

SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...

WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS...

MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND M...

SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING

PACKAGE SUBSTRATE FOR A SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT

EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT

STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS...

STRESS-RELEASING SOLDER MASK PATTERN FOR SEMICONDUCTOR DEVICES AND...

NESTED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MAKING THE SAME

THREE DIMENSIONAL SEMICONDUCTOR TRACE LENGTH MATCHING AND ASSOCIATE...

CROSS STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS

THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS

SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR MANAGING HIGH...

SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR USING AN INTE...

MULTI-ROLE SEMICONDUCTOR DEVICE SUBSTRATES, SEMICONDUCTOR DEVICE AS...

THERMAL DISTRIBUTION NETWORK FOR SEMICONDUCTOR DEVICES AND ASSOCIAT...

APPARATUS INCLUDING DIRECT-CONTACT HEAT PATHS AND METHODS OF MANUFA...

THREE-DIMENSIONAL BONDING SCHEME AND ASSOCIATED SYSTEMS AND METHODS

SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...

SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...

SEMICONDUCTOR DEVICES WITH MULTIPLE SUBSTRATES AND DIE STACKS

SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR MANAGING HIGH...