Kendall S. WILLS

Person

Sugar Land, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wing-shaped support members for enhancing semiconductor probes and...
- Patent number 7,872,486
- Issue date Jan 18, 2011
- Texas Instruments Incorporated
- Kendall Scott Wills
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for non-invasively testing integrated circuits
- Patent number 7,474,112
- Issue date Jan 6, 2009
- Texas Instruments Incorporated
- Kendall Scott Wills
- G01 - MEASURING TESTING
Information Patent Grant
Wavelet analysis of one or more time domain reflectometry (TDR) sig...
- Patent number 7,313,490
- Issue date Dec 25, 2007
- Texas Instruments Incorporated
- Kendall S. Wills
- G01 - MEASURING TESTING
Information Patent Grant
Wavelet analysis of signals to determine characteristics of anomali...
- Patent number 7,130,749
- Issue date Oct 31, 2006
- Texas Instruments Incorporated
- Kendall S. Wills
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for non-invasively testing integrated circuits
- Patent number 7,057,409
- Issue date Jun 6, 2006
- Texas Instruments Incorporated
- Kendall Scott Wills
- G01 - MEASURING TESTING
Information Patent Grant
Repackaging semiconductor IC devices for failure analysis
- Patent number 6,521,479
- Issue date Feb 18, 2003
- Texas Instruments Incorporated
- Ray D. Harrison
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit having a sealed edge
- Patent number 6,355,973
- Issue date Mar 12, 2002
- Texas Instruments Incorporated
- Kendall Scott Wills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser programming of CMOS semiconductor devices using make-link str...
- Patent number 6,281,563
- Issue date Aug 28, 2001
- Texas Instruments Incorporated
- Kendall Scott Wills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser programming of CMOS semiconductor devices using make-link str...
- Patent number 5,960,263
- Issue date Sep 28, 1999
- Texas Instruments Incorporated
- Kendall Scott Wills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging using heat spreaders and assisted deposition of wi...
- Patent number 5,847,467
- Issue date Dec 8, 1998
- Texas Instruments Incorporated
- Kendall Scott Wills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging using heat spreaders and assisted deposition of wi...
- Patent number 5,605,863
- Issue date Feb 25, 1997
- Texas Instruments Incorporated
- Kendall S. Wills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scribe technique using laser by forming polysilicon
- Patent number 5,543,365
- Issue date Aug 6, 1996
- Texas Instruments Incorporated
- Kendall S. Wills
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of laser CVD seal a die edge
- Patent number 5,451,550
- Issue date Sep 19, 1995
- Texas Instruments Incorporated
- Kendall S. Wills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dopant implant for conductive charge leakage layer for use with vol...
- Patent number 5,406,116
- Issue date Apr 11, 1995
- Texas Instruments Incorporated
- Kendall S. Wills
- G01 - MEASURING TESTING
Information Patent Grant
Ring crystallization of wafers to prevent thermal shock
- Patent number 5,317,186
- Issue date May 31, 1994
- Texas Instruments Incorporated
- Kendall S. Wills
- C30 - CRYSTAL GROWTH
Information Patent Grant
Ring crystallization of wafers to prevent thermal shock
- Patent number 5,149,675
- Issue date Sep 22, 1992
- Texas Instruments Incorporated
- Kendall S. Wills
- C30 - CRYSTAL GROWTH
Information Patent Grant
Optical waveguides as interconnects from integrated circuit to inte...
- Patent number 5,119,451
- Issue date Jun 2, 1992
- Texas Instruments Incorporated
- Kendall S. Wills
- G02 - OPTICS
Information Patent Grant
Laser programming of semiconductor devices using diode make-link st...
- Patent number 5,008,729
- Issue date Apr 16, 1991
- Texas Instruments Incorporated
- Kendall S. Wills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical-walled contacts for VLSI semiconductor devices
- Patent number 5,006,916
- Issue date Apr 9, 1991
- Texas Instruments Incorporated
- Kendall S. Wills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Make-link programming of semiconductor devices using laser-enhanced...
- Patent number 4,912,066
- Issue date Mar 27, 1990
- Texas Instruments Incorporated
- Kendall S. Wills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Make-link programming of semiconductor devices using laser enhanced...
- Patent number 4,751,197
- Issue date Jun 14, 1988
- Texas Instruments Incorporated
- Kendall S. Wills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making contacts and interconnects for holes having vert...
- Patent number 4,720,908
- Issue date Jan 26, 1988
- Texas Instruments Incorporated
- Kendall S. Wills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Indexing of laser beam for programming VLSI devices
- Patent number 4,623,403
- Issue date Nov 18, 1986
- Texas Instruments Incorporated
- Kendall S. Wills
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
CONTACT OVER ISOLATOR
- Publication number 20100127344
- Publication date May 27, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Kendall S. WILLS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE POINT
- Publication number 20100127723
- Publication date May 27, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Rand B. CARAWAN
- G01 - MEASURING TESTING
Information Patent Application
WING-SHAPED SUPPORT MEMBERS FOR ENHANCING SEMICONDUCTOR PROBES AND...
- Publication number 20100052709
- Publication date Mar 4, 2010
- Kendall Scott Wills
- G01 - MEASURING TESTING
Information Patent Application
Method and Apparatus for Non-Invasively Testing Integrated Circuits
- Publication number 20060181296
- Publication date Aug 17, 2006
- Kendall Scott Wills
- G01 - MEASURING TESTING
Information Patent Application
Method and Apparatus for Non-Invasively Testing Integrated Circuits
- Publication number 20060181297
- Publication date Aug 17, 2006
- Kendall Scott Wills
- G01 - MEASURING TESTING
Information Patent Application
Die extender for protecting an integrated circuit die on a flip chi...
- Publication number 20050127484
- Publication date Jun 16, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Kendall Scott Wills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for non-invasively testing intergrated circuits
- Publication number 20050127933
- Publication date Jun 16, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Kendall Scott Wills
- G01 - MEASURING TESTING
Information Patent Application
Wavelet analysis of one or more time domain reflectometry (TDR) sig...
- Publication number 20050021256
- Publication date Jan 27, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Kendall S. Wills
- G01 - MEASURING TESTING
Information Patent Application
Wavelet analysis of signals to determine characteristics of anomali...
- Publication number 20050021257
- Publication date Jan 27, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Kendall S. Wills
- G06 - COMPUTING CALCULATING COUNTING

Kendall S. WILLS

Person

Patents Grantslast 30 patents

Wing-shaped support members for enhancing semiconductor probes and...

Method and apparatus for non-invasively testing integrated circuits

Wavelet analysis of one or more time domain reflectometry (TDR) sig...

Wavelet analysis of signals to determine characteristics of anomali...

Method and apparatus for non-invasively testing integrated circuits

Repackaging semiconductor IC devices for failure analysis

Integrated circuit having a sealed edge

Laser programming of CMOS semiconductor devices using make-link str...

Laser programming of CMOS semiconductor devices using make-link str...

Device packaging using heat spreaders and assisted deposition of wi...

Device packaging using heat spreaders and assisted deposition of wi...

Wafer scribe technique using laser by forming polysilicon

Method of laser CVD seal a die edge

Dopant implant for conductive charge leakage layer for use with vol...

Ring crystallization of wafers to prevent thermal shock

Ring crystallization of wafers to prevent thermal shock

Optical waveguides as interconnects from integrated circuit to inte...

Laser programming of semiconductor devices using diode make-link st...

Vertical-walled contacts for VLSI semiconductor devices

Make-link programming of semiconductor devices using laser-enhanced...

Make-link programming of semiconductor devices using laser enhanced...

Process for making contacts and interconnects for holes having vert...

Indexing of laser beam for programming VLSI devices

Patents Applicationslast 30 patents

CONTACT OVER ISOLATOR

PROBE POINT

WING-SHAPED SUPPORT MEMBERS FOR ENHANCING SEMICONDUCTOR PROBES AND...

Method and Apparatus for Non-Invasively Testing Integrated Circuits

Method and Apparatus for Non-Invasively Testing Integrated Circuits

Die extender for protecting an integrated circuit die on a flip chi...

Method and apparatus for non-invasively testing intergrated circuits

Wavelet analysis of one or more time domain reflectometry (TDR) sig...

Wavelet analysis of signals to determine characteristics of anomali...