Kenji Masumoto

Person

Hayami-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged electronic devices having die attach regions with selectiv...
- Patent number 8,298,874
- Issue date Oct 30, 2012
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic devices having die attach regions with selectiv...
- Patent number 8,222,748
- Issue date Jul 17, 2012
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar bonding for fine pitch flip chip devices
- Patent number 8,115,310
- Issue date Feb 14, 2012
- Texas Instruments Incorporated
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductive device having improved copper density for package-on...
- Patent number 7,679,002
- Issue date Mar 16, 2010
- Texas Instruments Incorporated
- Masazumi Amagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for a semiconductor device
- Patent number 7,344,916
- Issue date Mar 18, 2008
- Texas Instruments Incorporated
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor package, with a rerouted elect...
- Patent number 7,157,363
- Issue date Jan 2, 2007
- Fujikura Ltd.
- Takanao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device and electronic device
- Patent number 7,023,088
- Issue date Apr 4, 2006
- Fujikura Ltd.
- Takanao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure having a flip-chip mounted photoreceiver
- Patent number 7,005,719
- Issue date Feb 28, 2006
- Texas Instruments Incorporated
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for semiconductor device having a device-supporting polymer...
- Patent number 6,992,380
- Issue date Jan 31, 2006
- Texas Instruments Incorporated
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 6,929,971
- Issue date Aug 16, 2005
- Texas Instruments Incorporated
- Kensho Murata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package insulation film and manufacturing method thereof
- Patent number 6,894,374
- Issue date May 17, 2005
- Texas Instruments Incorporated
- Makoto Yoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 6,876,077
- Issue date Apr 5, 2005
- Texas Instruments Incorporated
- Kensho Murata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package insulation film and manufacturing method thereof
- Patent number 6,875,637
- Issue date Apr 5, 2005
- Texas Instruments Incorporated
- Makoto Yoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package, semiconductor device, electronic device, and...
- Patent number 6,835,595
- Issue date Dec 28, 2004
- Fujikura Ltd.
- Takanao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging a low profile semiconductor device
- Patent number 6,830,956
- Issue date Dec 14, 2004
- Texas Instruments Incorporated
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor chip comprising multiple bo...
- Patent number 6,780,749
- Issue date Aug 24, 2004
- Texas Instruments Incorporated
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,759,745
- Issue date Jul 6, 2004
- Texas Instruments Incorporated
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side coating of semiconductor wafers
- Patent number 6,734,532
- Issue date May 11, 2004
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 6,583,483
- Issue date Jun 24, 2003
- Texas Instruments Incorporated
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 6,525,424
- Issue date Feb 25, 2003
- Texas Instruments Incorporated
- Kensho Murata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 6,482,730
- Issue date Nov 19, 2002
- Texas Instruments Incorporated
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounting method utilizing ultrasonic vibrations
- Patent number 6,269,999
- Issue date Aug 7, 2001
- Texas Instruments Incorporated
- Tomohiro Okazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing resin-encapsulated semiconductor device pac...
- Patent number 5,258,331
- Issue date Nov 2, 1993
- Texas Instruments Incorporated
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device package with nonconductive...
- Patent number 5,176,366
- Issue date Jan 5, 1993
- Texas Instruments Incorporated
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND STRUCTURE OF PANELIZED PACKAGING OF SEMICONDUCTOR DEVICES
- Publication number 20150008566
- Publication date Jan 8, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICES HAVING DIE ATTACH REGIONS WITH SELECTIV...
- Publication number 20120252170
- Publication date Oct 4, 2012
- TEXAS INSTRUMENTS INCORPORATED
- BERNARDO GALLEGOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING DROSS WELDING PHENOMENON DURING IRRADIATION ENGRAVING OF A...
- Publication number 20120205354
- Publication date Aug 16, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Takahiko Kudoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE FOR CAVITY PACKAGE
- Publication number 20110024899
- Publication date Feb 3, 2011
- Kenji MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BONDING FOR FINE PITCH FLIP CHIP DEVICES
- Publication number 20100314745
- Publication date Dec 16, 2010
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICES HAVNG DIE ATTACH REGIONS WITH SELECTIVE...
- Publication number 20100301493
- Publication date Dec 2, 2010
- TEXAS INSTRUMENTS INCORPORATED
- BERNARDO GALLEGOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE FOR FLIP-CHIP INTERCONNECT DEVICE
- Publication number 20100289138
- Publication date Nov 18, 2010
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE CONTACT PADS WITH ELEVATED RING FOR RESTRICTING HORIZONTA...
- Publication number 20090289360
- Publication date Nov 26, 2009
- Texas Instruments Inc.
- YOSHIMI TAKAHASHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTILAYER SEMICONDUCTOR DEVICE PACKAGE ASSEMBLY AND METHOD
- Publication number 20090108433
- Publication date Apr 30, 2009
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductive Device Having Improved Copper Density for Package-on...
- Publication number 20080048303
- Publication date Feb 28, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Masazumi Amagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package for a semiconductor device
- Publication number 20060110927
- Publication date May 25, 2006
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit structure having a flip-chip mounted photoreceiver
- Publication number 20050189631
- Publication date Sep 1, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Kenji Masumoto
- G02 - OPTICS
Information Patent Application
Package for a semiconductor device
- Publication number 20050082649
- Publication date Apr 21, 2005
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package, semiconductor device, electronic device, and...
- Publication number 20050037539
- Publication date Feb 17, 2005
- FUJIKURA LTD.
- Takanao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package insulation film and manufacturing method thereof
- Publication number 20040070068
- Publication date Apr 15, 2004
- Makoto Yoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package, semiconductor device, electronic device, and...
- Publication number 20030207494
- Publication date Nov 6, 2003
- FUJIKURA LTD.
- Takanao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20030205725
- Publication date Nov 6, 2003
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20030155652
- Publication date Aug 21, 2003
- Kensho Murata
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Back side coating of semiconductor wafers
- Publication number 20030109082
- Publication date Jun 12, 2003
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20030107054
- Publication date Jun 12, 2003
- Kensho Murata
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20030062613
- Publication date Apr 3, 2003
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method
- Publication number 20030036219
- Publication date Feb 20, 2003
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method
- Publication number 20030036257
- Publication date Feb 20, 2003
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package insulation film and manufacturing method thereof
- Publication number 20030017653
- Publication date Jan 23, 2003
- Makoto Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20020145198
- Publication date Oct 10, 2002
- Kensho Murata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devcice and its manufacturing method
- Publication number 20020050653
- Publication date May 2, 2002
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS

Kenji Masumoto

Person

Patents Grantslast 30 patents

Packaged electronic devices having die attach regions with selectiv...

Packaged electronic devices having die attach regions with selectiv...

Copper pillar bonding for fine pitch flip chip devices

Semiconductive device having improved copper density for package-on...

Package for a semiconductor device

Method for producing a semiconductor package, with a rerouted elect...

Semiconductor package, semiconductor device and electronic device

Integrated circuit structure having a flip-chip mounted photoreceiver

Package for semiconductor device having a device-supporting polymer...

Semiconductor device and its manufacturing method

Semiconductor package insulation film and manufacturing method thereof

Semiconductor device and its manufacturing method

Semiconductor package insulation film and manufacturing method thereof

Semiconductor package, semiconductor device, electronic device, and...

Method for packaging a low profile semiconductor device

Method of manufacturing a semiconductor chip comprising multiple bo...

Semiconductor device and manufacturing method thereof

Back side coating of semiconductor wafers

Semiconductor device and its manufacturing method

Semiconductor device and its manufacturing method

Method for manufacturing a semiconductor device

Semiconductor chip mounting method utilizing ultrasonic vibrations

Method of manufacturing resin-encapsulated semiconductor device pac...

Resin-encapsulated semiconductor device package with nonconductive...

Patents Applicationslast 30 patents

METHOD AND STRUCTURE OF PANELIZED PACKAGING OF SEMICONDUCTOR DEVICES

PACKAGED ELECTRONIC DEVICES HAVING DIE ATTACH REGIONS WITH SELECTIV...

REDUCING DROSS WELDING PHENOMENON DURING IRRADIATION ENGRAVING OF A...

SUBSTRATE STRUCTURE FOR CAVITY PACKAGE

COPPER PILLAR BONDING FOR FINE PITCH FLIP CHIP DEVICES

PACKAGED ELECTRONIC DEVICES HAVNG DIE ATTACH REGIONS WITH SELECTIVE...

SUBSTRATE STRUCTURE FOR FLIP-CHIP INTERCONNECT DEVICE

WORKPIECE CONTACT PADS WITH ELEVATED RING FOR RESTRICTING HORIZONTA...

MULTILAYER SEMICONDUCTOR DEVICE PACKAGE ASSEMBLY AND METHOD

Semiconductive Device Having Improved Copper Density for Package-on...

Package for a semiconductor device

Integrated circuit structure having a flip-chip mounted photoreceiver

Package for a semiconductor device

Semiconductor package, semiconductor device, electronic device, and...

Semiconductor package insulation film and manufacturing method thereof

Semiconductor package, semiconductor device, electronic device, and...

Semiconductor device and its manufacturing method

Semiconductor device and its manufacturing method

Back side coating of semiconductor wafers

Semiconductor device and its manufacturing method

Semiconductor device and manufacturing method thereof

Semiconductor device manufacturing method

Semiconductor device manufacturing method

Semiconductor package insulation film and manufacturing method thereof

Semiconductor device and its manufacturing method

Semiconductor devcice and its manufacturing method