Kenji Ohsawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Memory card
- Patent number 7,374,104
- Issue date May 20, 2008
- Sony Corporation
- Yoshitaka Aoki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for making semiconductor device using a nickel film for stop...
- Patent number 6,838,368
- Issue date Jan 4, 2005
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, manufacturing method of a lead frame, semiconductor dev...
- Patent number 6,563,202
- Issue date May 13, 2003
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a semiconductor device
- Patent number 6,514,847
- Issue date Feb 4, 2003
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and production method thereof, and semiconductor device...
- Patent number 6,465,279
- Issue date Oct 15, 2002
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having an underplate metal layer
- Patent number 6,403,402
- Issue date Jun 11, 2002
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and manufacturing method thereof
- Patent number 6,391,684
- Issue date May 21, 2002
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor chip having an underplate metal...
- Patent number 6,369,441
- Issue date Apr 9, 2002
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having an underplate metal layer
- Patent number 6,351,025
- Issue date Feb 26, 2002
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and production method thereof, and semiconductor device...
- Patent number 6,340,840
- Issue date Jan 22, 2002
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and the manufacturing method
- Patent number 6,258,631
- Issue date Jul 10, 2001
- Sony Corporation
- Makoto Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing lead frame and integrated circuit package
- Patent number 6,240,632
- Issue date Jun 5, 2001
- Sony Corporation
- Makoto Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved cross talk and grounding, and m...
- Patent number 6,194,778
- Issue date Feb 27, 2001
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, the manufacturing method, semiconductor device and the...
- Patent number 6,140,153
- Issue date Oct 31, 2000
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including chip housing, encapsulation and the...
- Patent number 6,114,755
- Issue date Sep 5, 2000
- Sony Corporation
- Makoto Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and the manufacturing method
- Patent number 6,104,091
- Issue date Aug 15, 2000
- Sony Corporation
- Makoto Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,093,970
- Issue date Jul 25, 2000
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame
- Patent number 6,078,097
- Issue date Jun 20, 2000
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and integrated circuit package
- Patent number 6,074,898
- Issue date Jun 13, 2000
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,054,773
- Issue date Apr 25, 2000
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, manufacturing method of a lead frame, semiconductor dev...
- Patent number 6,051,450
- Issue date Apr 18, 2000
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,020,626
- Issue date Feb 1, 2000
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package
- Patent number 5,982,033
- Issue date Nov 9, 1999
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip housing having a reinforcing plate
- Patent number 5,945,741
- Issue date Aug 31, 1999
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing lead frame having inner lead connected to o...
- Patent number 5,937,278
- Issue date Aug 10, 1999
- Sony Corporation
- Makoto Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing lead frame
- Patent number 5,901,436
- Issue date May 11, 1999
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and integrated circuit package
- Patent number 5,886,399
- Issue date Mar 23, 1999
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package
- Patent number 5,786,239
- Issue date Jul 28, 1998
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and manufacturing method thereof
- Patent number 5,756,377
- Issue date May 26, 1998
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin mold type semiconductor device
- Patent number 5,723,900
- Issue date Mar 3, 1998
- Sony Corporation
- Akira Kojima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Memory card
- Publication number 20060097060
- Publication date May 11, 2006
- Yoshitaka Aoki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Lead frame and production method thereof, and semiconductor device...
- Publication number 20020031862
- Publication date Mar 14, 2002
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20010014491
- Publication date Aug 16, 2001
- KENJI OHSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD MAKING THE SAME, AND ELECTRONIC DEVICE...
- Publication number 20010005050
- Publication date Jun 28, 2001
- KENJI OHSAWA
- H01 - BASIC ELECTRIC ELEMENTS

Kenji Ohsawa

Person

Patents Grantslast 30 patents

Memory card

Method for making semiconductor device using a nickel film for stop...

Lead frame, manufacturing method of a lead frame, semiconductor dev...

Method for making a semiconductor device

Lead frame and production method thereof, and semiconductor device...

Semiconductor chip having an underplate metal layer

Lead frame and manufacturing method thereof

Method of producing a semiconductor chip having an underplate metal...

Semiconductor chip having an underplate metal layer

Lead frame and production method thereof, and semiconductor device...

Semiconductor package and the manufacturing method

Method of manufacturing lead frame and integrated circuit package

Semiconductor package with improved cross talk and grounding, and m...

Lead frame, the manufacturing method, semiconductor device and the...

Semiconductor package including chip housing, encapsulation and the...

Semiconductor package and the manufacturing method

Semiconductor device and method for manufacturing the same

Lead frame

Lead frame and integrated circuit package

Semiconductor device and method of manufacturing the same

Lead frame, manufacturing method of a lead frame, semiconductor dev...

Semiconductor device

Semiconductor chip package

Semiconductor chip housing having a reinforcing plate

Method of manufacturing lead frame having inner lead connected to o...

Method of manufacturing lead frame

Lead frame and integrated circuit package

Method of manufacturing a semiconductor package

Lead frame and manufacturing method thereof

Resin mold type semiconductor device

Patents Applicationslast 30 patents

Memory card

Lead frame and production method thereof, and semiconductor device...

LEAD FRAME AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, METHOD MAKING THE SAME, AND ELECTRONIC DEVICE...