Claims
- 1. A semiconductor device comprising a plurality of leads embedded in an insulating film such that a plane surface is comprised of first surfaces of said leads and a first surface of said insulating film, said first surface of said insulating film being opposite a second surface on which protruding electrodes are formed, and a protective insulation film, having a device hole on said plane surface, inner portions of said leads extended to said device hole to connect corresponding electrodes of a semiconductor chip, said protruding electrodes connected to outer portions of said leads.
- 2. A lead frame according to claim 1, wherein a reinforcement plate is formed on the surface opposite the surface of said protective insulation film on which said leads are formed.
- 3. A semiconductor device comprising:
- a plurality of leads having inner lead portions and outer lead portions;
- a portion of said leads embedded in an insulating film such that a first surface of the insulating film is substantially co-planar with a surface of a portion of the leads, protruding electrodes formed at the exposed outer lead portions extending over a second surface of the insulating film which is opposite the first surface;
- a surface of a protective insulation film formed adjacent the first surface; and
- wherein the inner lead portions connect with respective electrodes of a semiconductor device.
- 4. A semiconductor device comprising:
- a plurality of leads embedded in an insulating film such that a first surface of said leads is substantially in a same plane as a first surface of said insulating film and wherein a portion of said leads extends from said insulating film and is connected to corresponding electrodes of a semiconductor chip;
- said insulating film having openings therein corresponding to each of said leads to expose said leads and protruding electrodes formed in each of said openings.
- 5. The semiconductor device of claim 4, wherein said insulating film is comprised of a photosensitive material.
- 6. The semiconductor device of claim 5, comprising semiconductor chip having a plurality of electrodes, each of which are connected to a corresponding inner lead portion.
- 7. A semiconductor device according to claim 4, wherein the semiconductor chip is adhered to said same plane with with an adhering layer.
- 8. A semiconductor device according to claim 7, wherein said adhering layer is comprised of an elastic material.
Priority Claims (1)
Number |
Date |
Country |
Kind |
6-314166 |
Nov 1994 |
JPX |
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Parent Case Info
This is a continuation, of application Ser. No. 08/561.245, filed Nov. 21, 1995 now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
5409865 |
Karnezos |
Apr 1995 |
|
5608265 |
Kitano et al. |
Mar 1997 |
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Continuations (1)
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Number |
Date |
Country |
Parent |
561245 |
Nov 1995 |
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