Kenneth Chun Kuen Cheng

Person

Shatin, HK

People

Patents Grantslast 30 patents

Information Patent Grant
Beol tip-to-tip shorting and time dependent dielectric breakdown
- Patent number 12,087,624
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnects without barrier metal between via and above line
- Patent number 12,057,395
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated top via interconnects
- Patent number 12,040,230
- Issue date Jul 16, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of rigid close-pitch interconnects
- Patent number 11,972,977
- Issue date Apr 30, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-fuse with laterally extended liner
- Patent number 11,881,431
- Issue date Jan 23, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with stacked vias having dome-shaped tips
- Patent number 11,848,264
- Issue date Dec 19, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magneto-resistive random access memory with laterally-recessed free...
- Patent number 11,758,819
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Grant
Interconnects having air gap spacers
- Patent number 11,430,690
- Issue date Aug 30, 2022
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar bump with noble metal seed layer for advanced heterogeneous...
- Patent number 11,380,641
- Issue date Jul 5, 2022
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MAGNETO-RESISTIVE RANDOM ACCESS MEMORY WITH LATERALLY-RECESSED FREE...
- Publication number 20230371394
- Publication date Nov 16, 2023
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Application
TOP VIA INTERCONNECT WITH AN EMBEDDED ANTIFUSE
- Publication number 20230268267
- Publication date Aug 24, 2023
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA INTERCONNECT WITH AIRGAP
- Publication number 20230260895
- Publication date Aug 17, 2023
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING COPPER LINE RESISTANCE
- Publication number 20230215806
- Publication date Jul 6, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LINER FREE INTERFACE FOR METAL VIA
- Publication number 20230187341
- Publication date Jun 15, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA INTERCONNECT STRUCTURE WITH TEXTURE SUPPRESSION LAYERS
- Publication number 20230187343
- Publication date Jun 15, 2023
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR STRUCTURE WITH ENLARGED CAPACITOR AREA
- Publication number 20230178588
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-DAMASCENE FAV INTERCONNECTS WITH DIELECTRIC PLUG
- Publication number 20230170253
- Publication date Jun 1, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FUSE WITH LATERALLY EXTENDED LINER
- Publication number 20230163026
- Publication date May 25, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA CONTAINING RANDOM-ACCESS MEMORY CROSS-BAR ARRAY
- Publication number 20230139648
- Publication date May 4, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY-ALIGNED AND DIELECTRIC DAMAGE-LESS TOP VIA INTERCONNECT STRUC...
- Publication number 20230134820
- Publication date May 4, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM BOTTOM ELECTRODE SHROUD
- Publication number 20230137421
- Publication date May 4, 2023
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION PREVENTION SPACER
- Publication number 20230125615
- Publication date Apr 27, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONVERTIBLE INTERCONNECT BARRIER
- Publication number 20230120110
- Publication date Apr 20, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECTS WITH AN EMBEDDED DIELECTRIC CAP BETWEEN LINES
- Publication number 20230120199
- Publication date Apr 20, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA STRUCTURE MADE WITH BI-LAYER TEMPLATE
- Publication number 20230116440
- Publication date Apr 13, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECTS WITH SELF-ALIGNED HOURGLASS-SHAPED METAL CAP
- Publication number 20230110587
- Publication date Apr 13, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL TIP-TO-TIP SHORTING AND TIME DEPENDENT DIELECTRIC BREAKDOWN
- Publication number 20230090755
- Publication date Mar 23, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA INTERCONNECTS WITHOUT BARRIER METAL BETWEEN VIA AND ABOVE LINE
- Publication number 20230077760
- Publication date Mar 16, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF CLOSE-PITCH INTERCONNECTS
- Publication number 20230072315
- Publication date Mar 9, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH A TOP VIA INTERCONNECT HAVING AN ENLAR...
- Publication number 20220392838
- Publication date Dec 8, 2022
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETO-RESISTIVE RANDOM ACCESS MEMORY WITH LATERALLY-RECESSED FREE...
- Publication number 20220190235
- Publication date Jun 16, 2022
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR BUMP WITH NOBLE METAL SEED LAYER FOR ADVANCED HETEROGENEOUS...
- Publication number 20220139858
- Publication date May 5, 2022
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED TOP VIA INTERCONNECTS
- Publication number 20220044967
- Publication date Feb 10, 2022
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bottom Barrier Free Interconnects Without Voids
- Publication number 20220028797
- Publication date Jan 27, 2022
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS HAVING AIR GAP SPACERS
- Publication number 20210118722
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Kenneth Chun Kuen Cheng

Person

Patents Grantslast 30 patents

Beol tip-to-tip shorting and time dependent dielectric breakdown

Top via interconnects without barrier metal between via and above line

Encapsulated top via interconnects

Fabrication of rigid close-pitch interconnects

Anti-fuse with laterally extended liner

Semiconductor structure with stacked vias having dome-shaped tips

Magneto-resistive random access memory with laterally-recessed free...

Interconnects having air gap spacers

Pillar bump with noble metal seed layer for advanced heterogeneous...

Patents Applicationslast 30 patents

MAGNETO-RESISTIVE RANDOM ACCESS MEMORY WITH LATERALLY-RECESSED FREE...

TOP VIA INTERCONNECT WITH AN EMBEDDED ANTIFUSE

TOP VIA INTERCONNECT WITH AIRGAP

REDUCING COPPER LINE RESISTANCE

BARRIER LINER FREE INTERFACE FOR METAL VIA

TOP VIA INTERCONNECT STRUCTURE WITH TEXTURE SUPPRESSION LAYERS

METAL-INSULATOR-METAL CAPACITOR STRUCTURE WITH ENLARGED CAPACITOR AREA

DUAL-DAMASCENE FAV INTERCONNECTS WITH DIELECTRIC PLUG

ANTI-FUSE WITH LATERALLY EXTENDED LINER

TOP VIA CONTAINING RANDOM-ACCESS MEMORY CROSS-BAR ARRAY

FULLY-ALIGNED AND DIELECTRIC DAMAGE-LESS TOP VIA INTERCONNECT STRUC...

MRAM BOTTOM ELECTRODE SHROUD

DIFFUSION PREVENTION SPACER

CONVERTIBLE INTERCONNECT BARRIER

COPPER INTERCONNECTS WITH AN EMBEDDED DIELECTRIC CAP BETWEEN LINES

TOP VIA STRUCTURE MADE WITH BI-LAYER TEMPLATE

COPPER INTERCONNECTS WITH SELF-ALIGNED HOURGLASS-SHAPED METAL CAP

BEOL TIP-TO-TIP SHORTING AND TIME DEPENDENT DIELECTRIC BREAKDOWN

TOP VIA INTERCONNECTS WITHOUT BARRIER METAL BETWEEN VIA AND ABOVE LINE

FABRICATION OF CLOSE-PITCH INTERCONNECTS

SEMICONDUCTOR STRUCTURE WITH A TOP VIA INTERCONNECT HAVING AN ENLAR...

MAGNETO-RESISTIVE RANDOM ACCESS MEMORY WITH LATERALLY-RECESSED FREE...

PILLAR BUMP WITH NOBLE METAL SEED LAYER FOR ADVANCED HETEROGENEOUS...

ENCAPSULATED TOP VIA INTERCONNECTS

Bottom Barrier Free Interconnects Without Voids

INTERCONNECTS HAVING AIR GAP SPACERS