Kenneth F. McAvey

Person

Shelburne, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dual adhesive bonding with perforated wafer
- Patent number 10,163,673
- Issue date Dec 25, 2018
- GLOBALFOUNDRIES Inc.
- Jeffrey P. Gambino
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Handle wafer
- Patent number 9,716,010
- Issue date Jul 25, 2017
- GLOBALFOUNDRIES Inc.
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal ground plane with improved metal adhesion and design...
- Patent number 8,912,091
- Issue date Dec 16, 2014
- International Business Machines Corporation
- Jay S. Burnham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Silicon-on-insulator substrate and method of forming
- Patent number 8,536,035
- Issue date Sep 17, 2013
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HANDLE WAFER
- Publication number 20150132527
- Publication date May 14, 2015
- International Business Machines Corporation
- Jeffrey P. GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL ADHESIVE BONDING WITH PERFORATED WAFER
- Publication number 20150096673
- Publication date Apr 9, 2015
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULATING BOW OF THIN WAFERS
- Publication number 20140225231
- Publication date Aug 14, 2014
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METAL GROUND PLANE WITH IMPROVED METAL ADHESION AND DESIGN...
- Publication number 20140191408
- Publication date Jul 10, 2014
- International Business Machines Corporation
- Jay S. BURNHAM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PATTERNED BACKSIDE METAL GROUND PLANE FOR IMPROVED METAL ADHESION
- Publication number 20140138844
- Publication date May 22, 2014
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR SUBSTRATE AND METHOD OF FORMING
- Publication number 20130196493
- Publication date Aug 1, 2013
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING COPPER DAMASCENE AND DUAL DAMASCENE INTERCONN...
- Publication number 20060063373
- Publication date Mar 23, 2006
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS

Kenneth F. McAvey

Person

Patents Grantslast 30 patents

Dual adhesive bonding with perforated wafer

Handle wafer

Backside metal ground plane with improved metal adhesion and design...

Silicon-on-insulator substrate and method of forming

Patents Applicationslast 30 patents

HANDLE WAFER

DUAL ADHESIVE BONDING WITH PERFORATED WAFER

MODULATING BOW OF THIN WAFERS

BACKSIDE METAL GROUND PLANE WITH IMPROVED METAL ADHESION AND DESIGN...

PATTERNED BACKSIDE METAL GROUND PLANE FOR IMPROVED METAL ADHESION

SILICON-ON-INSULATOR SUBSTRATE AND METHOD OF FORMING

METHOD OF FABRICATING COPPER DAMASCENE AND DUAL DAMASCENE INTERCONN...