Kenneth M. Fallon

Person

Johnson City, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Piezoelectric acoustic resonator manufactured with piezoelectric th...
- Patent number 11,424,728
- Issue date Aug 23, 2022
- AKOUSTIS, INC.
- Dae Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming printed circuit card
- Patent number 7,353,590
- Issue date Apr 8, 2008
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming printed circuit card
- Patent number 6,986,198
- Issue date Jan 17, 2006
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems interconnected by bumps of joining material
- Patent number 6,759,738
- Issue date Jul 6, 2004
- International Business Machines Corporation
- Kenneth Michael Fallon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two signal one power plane circuit board
- Patent number 6,750,405
- Issue date Jun 15, 2004
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming reflowed solder ball with low melting point meta...
- Patent number 6,344,234
- Issue date Feb 5, 2002
- International Business Machines Corportion
- Hormazdyar Minocher Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflowed solder ball with low melting point metal cap
- Patent number 6,259,159
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Hormazdyar Minocher Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two signal one power plane circuit board
- Patent number 6,204,453
- Issue date Mar 20, 2001
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package and fabrication thereof
- Patent number 5,923,090
- Issue date Jul 13, 1999
- International Business Machines Corporation
- Kenneth Michael Fallon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for transferring material to semiconductor chip conductive...
- Patent number 5,872,051
- Issue date Feb 16, 1999
- International Business Machines Corporation
- Kenneth Michael Fallon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making electronic module with multiple solder dams in sol...
- Patent number 5,798,285
- Issue date Aug 25, 1998
- International Business Machines Corpoation
- Mark Rudolf Bentlage
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct chip attach circuit card
- Patent number 5,796,591
- Issue date Aug 18, 1998
- International Business Machines Corporation
- Hormazdyar Minocher Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for attaching a flip chip on flexible circuit carrier using...
- Patent number 5,729,896
- Issue date Mar 24, 1998
- International Business Machines Corporation
- Hormazdyar M. Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for selective application of solder to circuit packages
- Patent number 5,672,260
- Issue date Sep 30, 1997
- International Business Machines Corporation
- Charles Francis Carey
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus
- Patent number 5,656,139
- Issue date Aug 12, 1997
- International Business Machines Corporation
- Charles Francis Carey
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electronic module with multiple solder dams in soldermask window
- Patent number 5,650,595
- Issue date Jul 22, 1997
- International Business Machines Corporation
- Mark Rudolf Bentlage
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making direct chip attach circuit card
- Patent number 5,634,268
- Issue date Jun 3, 1997
- International Business Machines Corporation
- Hormazdyar M. Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for selective application of solder to circuit packages
- Patent number 5,597,469
- Issue date Jan 28, 1997
- International Business Machines Corporation
- Charles F. Carey
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Rework process for semiconductor chips mounted in a flip chip confi...
- Patent number 5,542,601
- Issue date Aug 6, 1996
- International Business Machines Corporation
- Kenneth M. Fallon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature controlled collapse chip attach process
- Patent number 5,075,965
- Issue date Dec 31, 1991
- International Business Machines
- Charles F. Carey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF PACKAGING ACOUSTIC WAVE RESONATOR DEVICES ON WAFERS AND...
- Publication number 20240258991
- Publication date Aug 1, 2024
- Akoustis, Inc.
- Kenneth Fallon
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PIEZOELECTRIC ACOUSTIC RESONATOR MANUFACTURED WITH PIEZOELECTRIC TH...
- Publication number 20220352863
- Publication date Nov 3, 2022
- Akoustis, Inc.
- Dae Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZOELECTRIC ACOUSTIC RESONATOR MANUFACTURED WITH PIEZOELECTRIC TH...
- Publication number 20200313639
- Publication date Oct 1, 2020
- Akoustis, Inc.
- Dae Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming printed circuit card
- Publication number 20060005383
- Publication date Jan 12, 2006
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Two signal one power plane circuit board
- Publication number 20040134685
- Publication date Jul 15, 2004
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Image sensor positioning system and method
- Publication number 20040121503
- Publication date Jun 24, 2004
- Albert Ferland
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FLIP CHIP ATTACH ON FLEXIBLE CIRCUIT CARRIER USING CHIP WITH METALL...
- Publication number 20010013423
- Publication date Aug 16, 2001
- HORMAZDYAR M. DALAL
- H01 - BASIC ELECTRIC ELEMENTS

Kenneth M. Fallon

Person

Patents Grantslast 30 patents

Piezoelectric acoustic resonator manufactured with piezoelectric th...

Method of forming printed circuit card

Method of forming printed circuit card

Systems interconnected by bumps of joining material

Two signal one power plane circuit board

Method for forming reflowed solder ball with low melting point meta...

Reflowed solder ball with low melting point metal cap

Two signal one power plane circuit board

Microelectronic package and fabrication thereof

Process for transferring material to semiconductor chip conductive...

Method of making electronic module with multiple solder dams in sol...

Direct chip attach circuit card

Method for attaching a flip chip on flexible circuit carrier using...

Process for selective application of solder to circuit packages

Electroplating apparatus

Electronic module with multiple solder dams in soldermask window

Method for making direct chip attach circuit card

Process for selective application of solder to circuit packages

Rework process for semiconductor chips mounted in a flip chip confi...

Low temperature controlled collapse chip attach process

Patents Applicationslast 30 patents

METHODS OF PACKAGING ACOUSTIC WAVE RESONATOR DEVICES ON WAFERS AND...

PIEZOELECTRIC ACOUSTIC RESONATOR MANUFACTURED WITH PIEZOELECTRIC TH...

PIEZOELECTRIC ACOUSTIC RESONATOR MANUFACTURED WITH PIEZOELECTRIC TH...

Method of forming printed circuit card

Two signal one power plane circuit board

Image sensor positioning system and method

FLIP CHIP ATTACH ON FLEXIBLE CIRCUIT CARRIER USING CHIP WITH METALL...