Kevin W. Kolvenbach

Person

Walden, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Via leakage and breakdown testing
- Patent number 9,851,398
- Issue date Dec 26, 2017
- GLOBALFOUNDRIES Inc.
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-planar field effect transistor test structure and lateral diele...
- Patent number 9,453,873
- Issue date Sep 27, 2016
- GLOBALFOUNDRIES Inc.
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Grant
Electromigration immune through-substrate vias
- Patent number 9,153,558
- Issue date Oct 6, 2015
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration immune through-substrate vias
- Patent number 8,304,863
- Issue date Nov 6, 2012
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and methodology for characterizing device self-heating
- Patent number 7,805,274
- Issue date Sep 28, 2010
- International Business Machines Corporation
- Ping-Chuan Wang
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for dynamic characterization of reliability we...
- Patent number 7,710,141
- Issue date May 4, 2010
- International Business Machines Corporation
- Giuseppe La Rosa
- G01 - MEASURING TESTING
Information Patent Grant
Structure and method for thermally stressing or testing a semicondu...
- Patent number 7,375,371
- Issue date May 20, 2008
- International Business Machines Corporation
- Giuseppe La Rosa
- G01 - MEASURING TESTING
Information Patent Grant
Ring oscillator design for MOSFET device reliability investigations...
- Patent number 6,476,632
- Issue date Nov 5, 2002
- International Business Machines Corporation
- Gluseppe La Rosa
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
VIA LEAKAGE AND BREAKDOWN TESTING
- Publication number 20160291084
- Publication date Oct 6, 2016
- GLOBALFOUNDRIES INC.
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Application
NON-PLANAR FIELD EFFECT TRANSISTOR TEST STRUCTURE AND LATERAL DIELE...
- Publication number 20150198654
- Publication date Jul 16, 2015
- International Business Machines Corporation
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Application
ELECTROMIGRATION IMMUNE THROUGH-SUBSTRATE VIAS
- Publication number 20120292763
- Publication date Nov 22, 2012
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION IMMUNE THROUGH-SUBSTRATE VIAS
- Publication number 20110193199
- Publication date Aug 11, 2011
- International Business Machines Corporation
- Ronald G. Filippi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DYNAMIC CHARACTERIZATION OF RELIABILITY WE...
- Publication number 20090167336
- Publication date Jul 2, 2009
- International Business Machines Corporation
- Giuseppe La Rosa
- G01 - MEASURING TESTING
Information Patent Application
STRUCTURE AND METHODOLOGY FOR CHARACTERIZING DEVICE SELF-HEATING
- Publication number 20080112458
- Publication date May 15, 2008
- International Business Machines Corporation
- Ping-Chuan Wang
- G01 - MEASURING TESTING
Information Patent Application
STRUCTURE AND METHOD FOR THERMALLY STRESSING OR TESTING A SEMICONDU...
- Publication number 20070235769
- Publication date Oct 11, 2007
- International Business Machines Corporation
- Giuseppe La Rosa
- G01 - MEASURING TESTING

Kevin W. Kolvenbach

Person

Patents Grantslast 30 patents

Via leakage and breakdown testing

Non-planar field effect transistor test structure and lateral diele...

Electromigration immune through-substrate vias

Electromigration immune through-substrate vias

Structure and methodology for characterizing device self-heating

Method and apparatus for dynamic characterization of reliability we...

Structure and method for thermally stressing or testing a semicondu...

Ring oscillator design for MOSFET device reliability investigations...

Patents Applicationslast 30 patents

VIA LEAKAGE AND BREAKDOWN TESTING

NON-PLANAR FIELD EFFECT TRANSISTOR TEST STRUCTURE AND LATERAL DIELE...

ELECTROMIGRATION IMMUNE THROUGH-SUBSTRATE VIAS

ELECTROMIGRATION IMMUNE THROUGH-SUBSTRATE VIAS

METHOD AND APPARATUS FOR DYNAMIC CHARACTERIZATION OF RELIABILITY WE...

STRUCTURE AND METHODOLOGY FOR CHARACTERIZING DEVICE SELF-HEATING

STRUCTURE AND METHOD FOR THERMALLY STRESSING OR TESTING A SEMICONDU...