Kim J. Blackwell

Person

Owego, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Circuitized substrate with internal stacked semiconductor chips, me...
- Patent number 7,800,916
- Issue date Sep 21, 2010
- Endicott Interconnect Technologies, Inc.
- Kim J. Blackwell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hyperbga buildup laminate
- Patent number 7,213,336
- Issue date May 8, 2007
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hyperbga buildup laminate
- Patent number 6,879,492
- Issue date Apr 12, 2005
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress reducing stiffener ring
- Patent number 6,703,704
- Issue date Mar 9, 2004
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered laminate
- Patent number 6,518,516
- Issue date Feb 11, 2003
- International Business Machines Corporation
- Kim J. Blackwell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High adhesion performance roll sputtered strike layer
- Patent number 6,337,004
- Issue date Jan 8, 2002
- International Business Machines Corporation
- Kim Joseph Blackwell
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of forming adherent metal components on a polyimide substrate
- Patent number 6,284,329
- Issue date Sep 4, 2001
- International Business Machines Corporation
- Luis J. Matienzo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for coating a substrate with metallic layer
- Patent number 6,235,411
- Issue date May 22, 2001
- International Business Machines Corporation
- Kim Joseph Blackwell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming adherent metal components on a polyimide substrate
- Patent number 6,194,076
- Issue date Feb 27, 2001
- International Business Machines Corporation
- Luis J. Matienzo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of making a circuitized substrate
- Patent number 5,766,499
- Issue date Jun 16, 1998
- International Business Machines Corporation
- Kim Joseph Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for metallizing through holes in thin film substrates, and r...
- Patent number 5,525,369
- Issue date Jun 11, 1996
- International Business Machines Corporation
- Kim J. Blackwell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic package including lower water content polyimide film
- Patent number 5,461,203
- Issue date Oct 24, 1995
- International Business Machines Corporation
- Kim J. Blackwell
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process for creating organic polymeric substrate with copper
- Patent number 5,372,848
- Issue date Dec 13, 1994
- International Business Machines Corporation
- Kim J. Blackwell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for metallizing through holes in thin film substrates, and r...
- Patent number 5,288,541
- Issue date Feb 22, 1994
- International Business Machines Corporation
- Kim J. Blackwell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Shield for improved magnetron sputter deposition into surface recesses
- Patent number 4,508,612
- Issue date Apr 2, 1985
- International Business Machines Corporation
- Kim J. Blackwell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
HIGH BANDWIDTH SEMICONDUCTOR BALL GRID ARRAY PACKAGE
- Publication number 20120112345
- Publication date May 10, 2012
- Endicott Interconnect Technologies, Inc.
- Kim J. Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuitized substrate with internal stacked semiconductor chips, me...
- Publication number 20080244902
- Publication date Oct 9, 2008
- Endicott Interconnect Technologies, Inc.
- Kim J. Blackwell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hyperbga buildup laminate
- Publication number 20050099783
- Publication date May 12, 2005
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hyperbga buildup laminate
- Publication number 20020139578
- Publication date Oct 3, 2002
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayered laminate
- Publication number 20020108780
- Publication date Aug 15, 2002
- International Business Machines Corporation
- Kim J. Blackwell
- H01 - BASIC ELECTRIC ELEMENTS

Kim J. Blackwell

Person

Patents Grantslast 30 patents

Circuitized substrate with internal stacked semiconductor chips, me...

Hyperbga buildup laminate

Hyperbga buildup laminate

Stress reducing stiffener ring

Multilayered laminate

High adhesion performance roll sputtered strike layer

Method of forming adherent metal components on a polyimide substrate

Process for coating a substrate with metallic layer

Method of forming adherent metal components on a polyimide substrate

Method of making a circuitized substrate

Method for metallizing through holes in thin film substrates, and r...

Electronic package including lower water content polyimide film

Process for creating organic polymeric substrate with copper

Method for metallizing through holes in thin film substrates, and r...

Shield for improved magnetron sputter deposition into surface recesses

Patents Applicationslast 30 patents

HIGH BANDWIDTH SEMICONDUCTOR BALL GRID ARRAY PACKAGE

Circuitized substrate with internal stacked semiconductor chips, me...

Hyperbga buildup laminate

Hyperbga buildup laminate

Multilayered laminate