Kimio NAKAMURA

Person

Suzaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing electronic device and electronic device
- Patent number 9,391,031
- Issue date Jul 12, 2016
- Fujitsu Limited
- Tetsuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compression-bonding apparatus
- Patent number 8,381,963
- Issue date Feb 26, 2013
- Fujitsu Limited
- Kimio Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting a semiconductor chip
- Patent number 7,712,650
- Issue date May 11, 2010
- Fujitsu Limited
- Takayoshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of flip-chip mounting
- Patent number 7,670,873
- Issue date Mar 2, 2010
- Fujitsu Limited
- Kimio Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding flying leads
- Patent number 7,582,553
- Issue date Sep 1, 2009
- Fujitsu Limited
- Takashi Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,566,586
- Issue date Jul 28, 2009
- Fujitsu Limited
- Norio Kainuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for flip-chip mounting utilizing a delay curing-type adhesiv...
- Patent number 7,416,921
- Issue date Aug 26, 2008
- Fujitsu Limited
- Norio Kainuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding flying leads
- Patent number 7,367,108
- Issue date May 6, 2008
- Fujitsu Limited
- Takashi Kubota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply circuit for automotive vehicles
- Patent number 4,323,837
- Issue date Apr 6, 1982
- Nissan Motor Company, Limited
- Kimio Nakamura
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELEC...
- Publication number 20180358320
- Publication date Dec 13, 2018
- Fujitsu Limited
- Kimio Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE AND OPTICAL MODULE MANUFACTURING METHOD
- Publication number 20170357063
- Publication date Dec 14, 2017
- Fujitsu Limited
- Shuichi Takeuchi
- G02 - OPTICS
Information Patent Application
COMPONENT-MOUNTED BOARD, METHOD OF MANUFACTURING COMPONENT-MOUNTED...
- Publication number 20170020000
- Publication date Jan 19, 2017
- Fujitsu Limited
- TAKATOYO YAMAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20160372441
- Publication date Dec 22, 2016
- Fujitsu Limited
- Hiroshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20140084491
- Publication date Mar 27, 2014
- Tetsuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20130255878
- Publication date Oct 3, 2013
- Fujitsu Limited
- Tetsuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF
- Publication number 20130249087
- Publication date Sep 26, 2013
- Fujitsu Limited
- Kimio Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, PORTABLE ELECTRONIC TERMINAL, AND METHOD OF MANU...
- Publication number 20120230001
- Publication date Sep 13, 2012
- Fujitsu Limited
- Tetsuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD OF ELECT...
- Publication number 20120080220
- Publication date Apr 5, 2012
- Fujitsu Limited
- Kimio NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD
- Publication number 20110079896
- Publication date Apr 7, 2011
- Fujitsu Limited
- Yoshiyuki Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF
- Publication number 20100327435
- Publication date Dec 30, 2010
- FUJITSU LIMITED
- Kimio Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSION-BONDING APPARATUS
- Publication number 20100327043
- Publication date Dec 30, 2010
- FUJITSU LIMITED
- Kimio NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ASSEMBLING A CARRIAGE ASSEMBLY
- Publication number 20100095515
- Publication date Apr 22, 2010
- TOSHIBA STORAGE DEVICE CORPORATION
- Hidehiko Kira
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD AND APPARATUS FOR ASSEMBLING A CARRIAGE ASSEMBLY
- Publication number 20090320270
- Publication date Dec 31, 2009
- Naoki Ishikawa
- G11 - INFORMATION STORAGE
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20070264752
- Publication date Nov 15, 2007
- FUJITSU LIMITED
- Norio Kainuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of flip-chip mounting
- Publication number 20070184582
- Publication date Aug 9, 2007
- FUJITSU LIMITED
- Kimio Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of bonding flying leads
- Publication number 20070141825
- Publication date Jun 21, 2007
- FUJITSU LIMITED
- Takashi Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of bonding flying leads
- Publication number 20070137026
- Publication date Jun 21, 2007
- FUJITSU LIMITED
- Takashi Kubota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of bonding flying leads
- Publication number 20070137025
- Publication date Jun 21, 2007
- FUJITSU LIMITED
- Takashi Kubota
- G11 - INFORMATION STORAGE
Information Patent Application
Method of mounting a semiconductor chip
- Publication number 20070080190
- Publication date Apr 12, 2007
- FUJITSU LIMITED
- Takayoshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of flip-chip mounting a semiconductor chip and mounting appa...
- Publication number 20060099809
- Publication date May 11, 2006
- FUJITSU LIMITED
- Norio Kainuma
- H01 - BASIC ELECTRIC ELEMENTS

Kimio NAKAMURA

Person

Patents Grantslast 30 patents

Method for manufacturing electronic device and electronic device

Compression-bonding apparatus

Method of mounting a semiconductor chip

Method of flip-chip mounting

Method of bonding flying leads

Method of manufacturing a semiconductor device

Method for flip-chip mounting utilizing a delay curing-type adhesiv...

Method of bonding flying leads

Power supply circuit for automotive vehicles

Patents Applicationslast 30 patents

ELECTRONIC DEVICE, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELEC...

OPTICAL MODULE AND OPTICAL MODULE MANUFACTURING METHOD

COMPONENT-MOUNTED BOARD, METHOD OF MANUFACTURING COMPONENT-MOUNTED...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD MANUFACTURING METHOD

ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF

ELECTRONIC DEVICE, PORTABLE ELECTRONIC TERMINAL, AND METHOD OF MANU...

ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD OF ELECT...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF

COMPRESSION-BONDING APPARATUS

METHOD AND APPARATUS FOR ASSEMBLING A CARRIAGE ASSEMBLY

METHOD AND APPARATUS FOR ASSEMBLING A CARRIAGE ASSEMBLY

Method of manufacturing a semiconductor device

Method of flip-chip mounting

Method of bonding flying leads

Method of bonding flying leads

Method of bonding flying leads

Method of mounting a semiconductor chip

Method of flip-chip mounting a semiconductor chip and mounting appa...