King Owyang

Person

Baldwinsville, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with trench-like feed-throughs
- Patent number 10,032,901
- Issue date Jul 24, 2018
- Vishay-Siliconix
- Deva Pattanayak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with trench-like feed-throughs
- Patent number 9,306,056
- Issue date Apr 5, 2016
- Vishay Siliconix
- Deva Pattanayak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complete power management system implemented in a single surface mo...
- Patent number 9,093,359
- Issue date Jul 28, 2015
- Vishay Siliconix
- King Owyang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor including cup-shaped leadframe packaging techniques
- Patent number 9,040,356
- Issue date May 26, 2015
- Vishay Siliconix
- Mike Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complete power management system implemented in a single surface mo...
- Patent number 8,928,138
- Issue date Jan 6, 2015
- Vishay Siliconix
- King Owyang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Complete power management system implemented in a single surface mo...
- Patent number 8,471,381
- Issue date Jun 25, 2013
- Vishay Siliconix
- King Owyang
- G05 - CONTROLLING REGULATING
Information Patent Grant
High current density power field effect transistor
- Patent number 8,269,263
- Issue date Sep 18, 2012
- Vishay Siliconix
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including cup-shaped leadframe
- Patent number 7,595,547
- Issue date Sep 29, 2009
- Vishay Siliconix
- Mike Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including die interposed between cup-shaped l...
- Patent number 7,394,150
- Issue date Jul 1, 2008
- Siliconix Incorporated
- Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench MIS device having implanted drain-drift region and thick bot...
- Patent number 7,326,995
- Issue date Feb 5, 2008
- Siliconix Incorporated
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package including die interpose...
- Patent number 7,238,551
- Issue date Jul 3, 2007
- Siliconix Incorporated
- Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench MIS device having implanted drain-drift region and thick bot...
- Patent number 7,033,876
- Issue date Apr 25, 2006
- Siliconix Incorporated
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly with package using cup-shaped lead-frame
- Patent number 6,909,170
- Issue date Jun 21, 2005
- Siliconix Incorporated
- Mike Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including cup-shaped leadframe
- Patent number 6,744,124
- Issue date Jun 1, 2004
- Siliconix Incorporated
- Mike Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect Trench transistor having lightly doped epitaxial regio...
- Patent number 5,910,669
- Issue date Jun 8, 1999
- Siliconix Incorporated
- Mike F. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount and flip chip technology with diamond film passivatio...
- Patent number 5,767,578
- Issue date Jun 16, 1998
- Siliconix Incorporated
- Mike F. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount and flip chip technology for total integrated circuit...
- Patent number 5,757,081
- Issue date May 26, 1998
- Siliconix Incorporated
- Mike F. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount and flip chip technology for total integrated circuit...
- Patent number 5,753,529
- Issue date May 19, 1998
- Siliconix Incorporated
- Mike F. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trenched DMOS transistor fabrication having thick termination regio...
- Patent number 5,639,676
- Issue date Jun 17, 1997
- Siliconix Incorporated
- Fwu-Iuan Hshieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trenched DMOS transistor having thick field oxide in termination re...
- Patent number 5,578,851
- Issue date Nov 26, 1996
- Siliconix Incorporated
- Fwu-Iuan Hshieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a field effect trench transistor having lightly do...
- Patent number 5,532,179
- Issue date Jul 2, 1996
- Siliconix Incorporated
- Mike F. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of power mosfets, including termination structures
- Patent number 5,521,409
- Issue date May 28, 1996
- Siliconix Incorporated
- Fwu-Iuan Hshieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reverse battery protection device containing power MOSFET
- Patent number 5,517,379
- Issue date May 14, 1996
- Siliconix Incorporated
- Richard K. Williams
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Trenched DMOS transistor with channel block at cell trench corners
- Patent number 5,468,982
- Issue date Nov 21, 1995
- Siliconix Incorporated
- Fwu-Iuan Hshieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low on-resistance power MOS technology
- Patent number 5,429,964
- Issue date Jul 4, 1995
- Siliconix Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal crossover in high voltage IC with graduated doping control
- Patent number 5,426,325
- Issue date Jun 20, 1995
- Siliconix Incorporated
- Mike F. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and fabrication of power MOSFETs, including termination s...
- Patent number 5,404,040
- Issue date Apr 4, 1995
- Siliconix Incorporated
- Fwu-Iuan Hshieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trenched DMOS transistor fabrication using six masks
- Patent number 5,316,959
- Issue date May 31, 1994
- Siliconix, Incorporated
- Sze-Hon Kwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low on-resistance power MOS technology
- Patent number 5,304,831
- Issue date Apr 19, 1994
- Siliconix Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimization of BV and RDS-on by graded doping in LDD and other hig...
- Patent number 5,132,753
- Issue date Jul 21, 1992
- Siliconix Incorporated
- Mike F. Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH TRENCH-LIKE FEED-THROUGHS
- Publication number 20170025527
- Publication date Jan 26, 2017
- Deva Pattanayak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLETE POWER MANAGEMENT SYSTEM IMPLEMENTED IN A SINGLE SURFACE MO...
- Publication number 20150331438
- Publication date Nov 19, 2015
- VISHAY-SILICONIX
- King Owyang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE WITH TRENCH-LIKE FEED-THROUGHS
- Publication number 20110101525
- Publication date May 5, 2011
- VISHAY-SILICONIX
- Deva Pattanayak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLETE POWER MANAGEMENT SYSTEM IMPLEMENTED IN A SINGLE SURFACE MO...
- Publication number 20100219519
- Publication date Sep 2, 2010
- King Owyang
- G05 - CONTROLLING REGULATING
Information Patent Application
HIGH CURRENT DENSITY POWER FIELD EFFECT TRANSISTOR
- Publication number 20090278176
- Publication date Nov 12, 2009
- VISHAY-SILICONIX
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING TECHNIQUES
- Publication number 20090256246
- Publication date Oct 15, 2009
- VISHAY-SILICONIX
- Mike Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Complete power management system implemented in a single surface mo...
- Publication number 20070063341
- Publication date Mar 22, 2007
- King Owyang
- G05 - CONTROLLING REGULATING
Information Patent Application
Complete power management system implemented in a single surface mo...
- Publication number 20070063340
- Publication date Mar 22, 2007
- King Owyang
- G05 - CONTROLLING REGULATING
Information Patent Application
Semiconductor package including die interposed between cup-shaped l...
- Publication number 20060108671
- Publication date May 25, 2006
- Siliconix Incorporated
- Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating semiconductor package including die interpose...
- Publication number 20060110856
- Publication date May 25, 2006
- Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench MIS device having implanted drain-drift region and thick bot...
- Publication number 20050236665
- Publication date Oct 27, 2005
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench MIS device having implanted drain-drift region and thick bot...
- Publication number 20040121572
- Publication date Jun 24, 2004
- Mohamed N. Darwish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor assembly with package using cup-shaped lead frame
- Publication number 20030057532
- Publication date Mar 27, 2003
- Mike Chang
- H01 - BASIC ELECTRIC ELEMENTS

King Owyang

Person

Patents Grantslast 30 patents

Semiconductor device with trench-like feed-throughs

Semiconductor device with trench-like feed-throughs

Complete power management system implemented in a single surface mo...

Semiconductor including cup-shaped leadframe packaging techniques

Complete power management system implemented in a single surface mo...

Complete power management system implemented in a single surface mo...

High current density power field effect transistor

Semiconductor die package including cup-shaped leadframe

Semiconductor package including die interposed between cup-shaped l...

Trench MIS device having implanted drain-drift region and thick bot...

Method of fabricating semiconductor package including die interpose...

Trench MIS device having implanted drain-drift region and thick bot...

Semiconductor assembly with package using cup-shaped lead-frame

Semiconductor die package including cup-shaped leadframe

Field effect Trench transistor having lightly doped epitaxial regio...

Surface mount and flip chip technology with diamond film passivatio...

Surface mount and flip chip technology for total integrated circuit...

Surface mount and flip chip technology for total integrated circuit...

Trenched DMOS transistor fabrication having thick termination regio...

Trenched DMOS transistor having thick field oxide in termination re...

Method of making a field effect trench transistor having lightly do...

Structure of power mosfets, including termination structures

Reverse battery protection device containing power MOSFET

Trenched DMOS transistor with channel block at cell trench corners

Low on-resistance power MOS technology

Metal crossover in high voltage IC with graduated doping control

Structure and fabrication of power MOSFETs, including termination s...

Trenched DMOS transistor fabrication using six masks

Low on-resistance power MOS technology

Optimization of BV and RDS-on by graded doping in LDD and other hig...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH TRENCH-LIKE FEED-THROUGHS

COMPLETE POWER MANAGEMENT SYSTEM IMPLEMENTED IN A SINGLE SURFACE MO...

SEMICONDUCTOR DEVICE WITH TRENCH-LIKE FEED-THROUGHS

COMPLETE POWER MANAGEMENT SYSTEM IMPLEMENTED IN A SINGLE SURFACE MO...

HIGH CURRENT DENSITY POWER FIELD EFFECT TRANSISTOR

SEMICONDUCTOR PACKAGING TECHNIQUES

Complete power management system implemented in a single surface mo...

Complete power management system implemented in a single surface mo...

Semiconductor package including die interposed between cup-shaped l...

Method of fabricating semiconductor package including die interpose...

Trench MIS device having implanted drain-drift region and thick bot...

Trench MIS device having implanted drain-drift region and thick bot...

Semiconductor assembly with package using cup-shaped lead frame