Kinya Ichikawa

Person

Tsukuba, JP

People

Patents Grantslast 30 patents

Information Patent Grant
High density substrate interconnect formed through inkjet printing
- Patent number 9,741,664
- Issue date Aug 22, 2017
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Picture frame stiffeners for microelectronic packages
- Patent number 9,685,388
- Issue date Jun 20, 2017
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Picture frame stiffeners for microelectronic packages
- Patent number 9,502,368
- Issue date Nov 22, 2016
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making high density substrate interconnect using inkjet...
- Patent number 9,349,703
- Issue date May 24, 2016
- Intel Corporation
- Chia-Pin Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of connecting a first electronic package to a second electr...
- Patent number 9,263,329
- Issue date Feb 16, 2016
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-package microelectronic apparatus, and methods of using same
- Patent number 8,110,920
- Issue date Feb 7, 2012
- Intel Corporation
- Sriram Dattaguru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate connector for integrated circuit devices
- Patent number 7,495,330
- Issue date Feb 24, 2009
- Intel Corporation
- Kinya Ichikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable integrated circuit packaging
- Patent number 7,345,361
- Issue date Mar 18, 2008
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated stack of dice and support therefor
- Patent number 7,132,739
- Issue date Nov 7, 2006
- Intel Corporation
- Masayuki Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation of a stack of semiconductor dice
- Patent number 7,132,311
- Issue date Nov 7, 2006
- Intel Corporation
- Masayuki Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch substrate for external connection
- Patent number 7,097,462
- Issue date Aug 29, 2006
- Intel Corporation
- Kinya Ichikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device packaging using tape automated bonding (TAB) strip bonded to...
- Patent number 7,005,729
- Issue date Feb 28, 2006
- Intel Corporation
- Yukihiro Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded flip chip package
- Patent number 6,838,313
- Issue date Jan 4, 2005
- Intel Corporation
- Takashi Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Easy mount socket
- Patent number 6,785,148
- Issue date Aug 31, 2004
- Intel Corporation
- Kenzo Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molded flip chip package
- Patent number 6,632,704
- Issue date Oct 14, 2003
- Intel Corporation
- Takashi Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit substrate with solder formed on pad-on-via and pad-...
- Patent number 6,020,561
- Issue date Feb 1, 2000
- Intel Corporation
- Kenzo Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Design for flip chip joint pad/LGA pad
- Patent number 5,811,883
- Issue date Sep 22, 1998
- Intel Corporation
- Kinya Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling solder bump height and volume for substrates...
- Patent number 5,660,321
- Issue date Aug 26, 1997
- Intel Corporation
- Kenzo Ishida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PICTURE FRAME STIFFENERS FOR MICROELECTRONIC PACKAGES
- Publication number 20170040238
- Publication date Feb 9, 2017
- Intel Corporation
- YOSHIHIRO TOMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING HIGH DENSITY SUBSTRATE INTERCONNECT USING INKJET...
- Publication number 20160247763
- Publication date Aug 25, 2016
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICTURE FRAME STIFFENERS FOR MICROELECTRONIC PACKAGES
- Publication number 20160172323
- Publication date Jun 16, 2016
- Intel Corporation
- YOSHIHIRO TOMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF CONNECTING A FIRST ELECTRONIC PACKAGE TO A SECOND ELECTR...
- Publication number 20150270169
- Publication date Sep 24, 2015
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE INTERCONNECT USING INKJET PRINTING
- Publication number 20150084210
- Publication date Mar 26, 2015
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED DIE, MICROELECTRONIC PACKAGE CONTAINING SAME, AND METH...
- Publication number 20120112336
- Publication date May 10, 2012
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-pakage microelectronic apparatus, and methods of using same
- Publication number 20100309704
- Publication date Dec 9, 2010
- Sriram Dattaguru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductor structure on dielectric material
- Publication number 20070231475
- Publication date Oct 4, 2007
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate connector for integrated circuit devices
- Publication number 20070001277
- Publication date Jan 4, 2007
- Kinya Ichikawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Patch substrate for external connection
- Publication number 20060191134
- Publication date Aug 31, 2006
- Kinya Ichikawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Patch substrate for external connection
- Publication number 20050287829
- Publication date Dec 29, 2005
- Kinya Ichikawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Tape automated bonding with strip carrier frame assembly
- Publication number 20050217787
- Publication date Oct 6, 2005
- Yukihiro Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable integrated circuit packaging
- Publication number 20050121764
- Publication date Jun 9, 2005
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated stack of dice and support therefor
- Publication number 20050085034
- Publication date Apr 21, 2005
- Masayuki Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded flip chip package
- Publication number 20040053443
- Publication date Mar 18, 2004
- Takashi Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulation of a stack of semiconductor dice
- Publication number 20040016939
- Publication date Jan 29, 2004
- Masayuki Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tape automated bonding with strip carrier frame assembly
- Publication number 20030201524
- Publication date Oct 30, 2003
- Yukihiro Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded flip chip package
- Publication number 20020114144
- Publication date Aug 22, 2002
- Takashi Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip lead frames
- Publication number 20020110956
- Publication date Aug 15, 2002
- Takashi Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded flip chip package
- Publication number 20020109241
- Publication date Aug 15, 2002
- Takashi Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS

Kinya Ichikawa

Person

Patents Grantslast 30 patents

High density substrate interconnect formed through inkjet printing

Picture frame stiffeners for microelectronic packages

Picture frame stiffeners for microelectronic packages

Method for making high density substrate interconnect using inkjet...

Methods of connecting a first electronic package to a second electr...

In-package microelectronic apparatus, and methods of using same

Substrate connector for integrated circuit devices

Stackable integrated circuit packaging

Encapsulated stack of dice and support therefor

Encapsulation of a stack of semiconductor dice

Patch substrate for external connection

Device packaging using tape automated bonding (TAB) strip bonded to...

Molded flip chip package

Easy mount socket

Molded flip chip package

Printed circuit substrate with solder formed on pad-on-via and pad-...

Design for flip chip joint pad/LGA pad

Method for controlling solder bump height and volume for substrates...

Patents Applicationslast 30 patents

PICTURE FRAME STIFFENERS FOR MICROELECTRONIC PACKAGES

METHOD FOR MAKING HIGH DENSITY SUBSTRATE INTERCONNECT USING INKJET...

PICTURE FRAME STIFFENERS FOR MICROELECTRONIC PACKAGES

METHODS OF CONNECTING A FIRST ELECTRONIC PACKAGE TO A SECOND ELECTR...

HIGH DENSITY SUBSTRATE INTERCONNECT USING INKJET PRINTING

ENCAPSULATED DIE, MICROELECTRONIC PACKAGE CONTAINING SAME, AND METH...

In-pakage microelectronic apparatus, and methods of using same

Conductor structure on dielectric material

Substrate connector for integrated circuit devices

Patch substrate for external connection

Patch substrate for external connection

Tape automated bonding with strip carrier frame assembly

Stackable integrated circuit packaging

Encapsulated stack of dice and support therefor

Molded flip chip package

Encapsulation of a stack of semiconductor dice

Tape automated bonding with strip carrier frame assembly

Molded flip chip package

Chip lead frames

Molded flip chip package