Claims
- 1. A flip chip package comprising:
a chip, the chip comprising a top surface, a bottom surface and one or more side surfaces disposed between the top and bottom surfaces; a substrate, the substrate comprising an upper surface; a plurality of reflowed solder bumps, the reflowed solder bumps electrically coupling the top surface with an adjacent portion of the upper surface; and a monolithic element comprising solidified resin, the monolithic element encapsulating and adhesively bonded to (i) substantially all of the one or more side surfaces, (ii) a substantial portion of the upper surface, and (iii) the plurality of reflowed solder bumps located in a gap between the top surface and the upper surface.
- 2. The flip chip package of claim 1, wherein the solidified resin does not encapsulate the bottom surface.
- 3. The flip chip package of claim 2, wherein the resin further comprises a filler material.
- 4. The flip chip package of claim 3, wherein the filler material comprises silica micro spheres.
- 5. The flip chip package of claim 1, wherein the resin encapsulates substantially all of the one or more side surfaces.
- 6. The flip chip package of claim 5, wherein the resin does not encapsulate the bottom surface.
- 7. The flip chip package of the claim 1, wherein the solidified resin comprises an epoxy.
- 8. The flip chip package of claim 1, wherein the substrate is a thin substrate.
- 9. The flip chip package of claim 1, wherein the substrate is comprised of a polymeric material.
- 10. The flip chip package of claim 8, wherein the substrate is approximately 0.05 mm to 0.5 mm thick.
- 11. The flip chip package of claim 1, further comprising at least one passive component electrically coupled with the substrate.
- 12. The flip chip package of claim 11, wherein the solidified resin fills a gap between a first surface of the at least one passive component and an adjacent surface of the substrate.
- 13. The flip chip package of claim 11, wherein the solidified resin fully encapsulates the at least one passive component.
CROSS-REFERENCE TO RELATED APPLICAITONS
[0001] This application is a divisional of U.S. patent application Ser. No. 09/741,535 filed Dec. 19, 2000 and assigned to the assignee of the present application.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09741535 |
Dec 2000 |
US |
Child |
10051980 |
Jan 2002 |
US |