Kisik Choi

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Tiered-profile contact for semiconductor
- Patent number 12,148,663
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures with backside gate contacts
- Patent number 12,087,691
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried power rails located in a base layer including first, second,...
- Patent number 11,990,412
- Issue date May 21, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnect having a line with a reduced bottom dimension
- Patent number 11,990,410
- Issue date May 21, 2024
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of rigid close-pitch interconnects
- Patent number 11,972,977
- Issue date Apr 30, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having spacers for improved top via critical dimensio...
- Patent number 11,961,759
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power rail integration
- Patent number 11,915,966
- Issue date Feb 27, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with damascene line and via
- Patent number 11,894,265
- Issue date Feb 6, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via process with damascene metal
- Patent number 11,869,808
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal interconnects with a replacement metal
- Patent number 11,842,961
- Issue date Dec 12, 2023
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with next level line selective growth
- Patent number 11,823,998
- Issue date Nov 21, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via cut fill process for line extension reduction
- Patent number 11,804,406
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned buried power rail cap for semiconductor devices
- Patent number 11,804,436
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive lines with subtractive cuts
- Patent number 11,791,258
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped top via for via resistance reduction
- Patent number 11,670,542
- Issue date Jun 6, 2023
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via stack
- Patent number 11,600,565
- Issue date Mar 7, 2023
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-mask alternating line deposition
- Patent number 11,437,317
- Issue date Sep 6, 2022
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier removal for conductor in top via integration scheme
- Patent number 11,430,735
- Issue date Aug 30, 2022
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned top via
- Patent number 11,315,872
- Issue date Apr 26, 2022
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad-layer high-k for metal-insulator-metal capacitors
- Patent number 11,309,383
- Issue date Apr 19, 2022
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive line with damascene second line type
- Patent number 11,302,575
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having spacers for improved top via critical dimensio...
- Patent number 11,295,978
- Issue date Apr 5, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top vias with selectively retained etch stops
- Patent number 11,289,371
- Issue date Mar 29, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via on subtractively etched conductive line
- Patent number 11,276,611
- Issue date Mar 15, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive lines with subtractive cuts
- Patent number 11,276,639
- Issue date Mar 15, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped top via for via resistance reduction
- Patent number 11,232,977
- Issue date Jan 25, 2022
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiered-profile contact for semiconductor
- Patent number 11,195,753
- Issue date Dec 7, 2021
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Well-controlled edge-to-edge spacing between adjacent interconnects
- Patent number 11,195,795
- Issue date Dec 7, 2021
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via stack
- Patent number 11,195,792
- Issue date Dec 7, 2021
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnect having a line with a reduced bottom dimension
- Patent number 11,189,568
- Issue date Nov 30, 2021
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE WITH ENHANCED PLACEHOLDER POSITION MARGIN
- Publication number 20250056864
- Publication date Feb 13, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BREAK BETWEEN PASSIVE DEVICE AND LOGIC DEVICE WITH BACKSI...
- Publication number 20250046714
- Publication date Feb 6, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH ISOLATION FOR BACKSIDE CONTACT FORMATION
- Publication number 20250022913
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Juntao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL
- Publication number 20250006664
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR
- Publication number 20250006629
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE
- Publication number 20250006590
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING
- Publication number 20250006663
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT MITIGATING CONTACT TO GATE SHORT
- Publication number 20240429103
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH ISOLATION STRUCTURES FOR BACKSIDE CONTACTS
- Publication number 20240429166
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE DEVICE WITH THINNER Si LAYER
- Publication number 20240413164
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BACKSIDE CONTACT WITH PROTRUDING SOURCE/DRAIN
- Publication number 20240413201
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED BACKSIDE CONTACT
- Publication number 20240413214
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECT LAYERS FOR FET ARCHITECTURES
- Publication number 20240404949
- Publication date Dec 5, 2024
- International Business Machines Corporation
- SON NGUYEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FVBP WITHOUT BACKSIDE Si RECESS
- Publication number 20240405112
- Publication date Dec 5, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PASSIVE DEVICE INTEGRATION FOR SILICON-ON-INSULATOR S...
- Publication number 20240395664
- Publication date Nov 28, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDES SUBTRACTIVE M1 PATTERNING WITH BACKSIDE CONTACT REPAIR FO...
- Publication number 20240395822
- Publication date Nov 28, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER ISLANDS FOR BACKSIDE POWER APPLICATIONS
- Publication number 20240321747
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT FORMATION
- Publication number 20240321959
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SELF-ALIGNED POWER VIA SHAPE WITH GATE CUT FIRST
- Publication number 20240321957
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Eric Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACT BASED VIA TO BACKSIDE POWER RAIL
- Publication number 20240290657
- Publication date Aug 29, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN
- Publication number 20240243062
- Publication date Jul 18, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE WITHOUT LINER INTERFACE
- Publication number 20240234297
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Power Rail Formation in Dielectric Isolation for Semiconduct...
- Publication number 20240234317
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Nikhil Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF NON-SELF-ALIGNED BACKSIDE CONTACT
- Publication number 20240213338
- Publication date Jun 27, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENLARGED SHALLOW TRENCH ISOLATION FOR BACKSIDE POWER
- Publication number 20240203878
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Shravana Kumar Katakam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS
- Publication number 20240203816
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BACKSIDE U-SHAPED SILICIDE
- Publication number 20240204063
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC FILLED ALIGNMENT MARK STRUCTURES
- Publication number 20240203780
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Somnath Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE DIRECT CONTACT FORMATION
- Publication number 20240194528
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED CAPACITANCE BETWEEN POWER VIA BAR AND GATES
- Publication number 20240186245
- Publication date Jun 6, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Tiered-profile contact for semiconductor

Semiconductor structures with backside gate contacts

Buried power rails located in a base layer including first, second,...

Top via interconnect having a line with a reduced bottom dimension

Fabrication of rigid close-pitch interconnects

Interconnects having spacers for improved top via critical dimensio...

Backside power rail integration

Top via with damascene line and via

Top via process with damascene metal

Advanced metal interconnects with a replacement metal

Top via with next level line selective growth

Top via cut fill process for line extension reduction

Self-aligned buried power rail cap for semiconductor devices

Conductive lines with subtractive cuts

Stepped top via for via resistance reduction

Top via stack

Single-mask alternating line deposition

Barrier removal for conductor in top via integration scheme

Self-aligned top via

Quad-layer high-k for metal-insulator-metal capacitors

Subtractive line with damascene second line type

Interconnects having spacers for improved top via critical dimensio...

Top vias with selectively retained etch stops

Top via on subtractively etched conductive line

Conductive lines with subtractive cuts

Stepped top via for via resistance reduction

Tiered-profile contact for semiconductor

Well-controlled edge-to-edge spacing between adjacent interconnects

Top via stack

Top via interconnect having a line with a reduced bottom dimension

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE WITH ENHANCED PLACEHOLDER POSITION MARGIN

DIFFUSION BREAK BETWEEN PASSIVE DEVICE AND LOGIC DEVICE WITH BACKSI...

TRENCH ISOLATION FOR BACKSIDE CONTACT FORMATION

THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL

DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR

DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE

DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING

BACKSIDE CONTACT MITIGATING CONTACT TO GATE SHORT

TRENCH ISOLATION STRUCTURES FOR BACKSIDE CONTACTS

PASSIVE DEVICE WITH THINNER Si LAYER

SELF-ALIGNED BACKSIDE CONTACT WITH PROTRUDING SOURCE/DRAIN

SELF ALIGNED BACKSIDE CONTACT

METAL INTERCONNECT LAYERS FOR FET ARCHITECTURES

FVBP WITHOUT BACKSIDE Si RECESS

SEMICONDUCTOR PASSIVE DEVICE INTEGRATION FOR SILICON-ON-INSULATOR S...

BACKSIDES SUBTRACTIVE M1 PATTERNING WITH BACKSIDE CONTACT REPAIR FO...

BACKSIDE POWER ISLANDS FOR BACKSIDE POWER APPLICATIONS

BACKSIDE CONTACT FORMATION

FLEXIBLE SELF-ALIGNED POWER VIA SHAPE WITH GATE CUT FIRST

SELF-ALIGNED CONTACT BASED VIA TO BACKSIDE POWER RAIL

HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN

VIA STRUCTURE WITHOUT LINER INTERFACE

Hybrid Power Rail Formation in Dielectric Isolation for Semiconduct...

FORMATION OF NON-SELF-ALIGNED BACKSIDE CONTACT

ENLARGED SHALLOW TRENCH ISOLATION FOR BACKSIDE POWER

HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS

SEMICONDUCTOR DEVICE WITH BACKSIDE U-SHAPED SILICIDE

DIELECTRIC FILLED ALIGNMENT MARK STRUCTURES

BACKSIDE DIRECT CONTACT FORMATION

REDUCED CAPACITANCE BETWEEN POWER VIA BAR AND GATES