Kisik Choi

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Self-aligned buried power rail cap for semiconductor devices
- Patent number 12,300,617
- Issue date May 13, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SRAM with backside cross-couple
- Patent number 12,295,133
- Issue date May 6, 2025
- International Business Machines Corporation
- Ruilong Xie
Information Patent Grant
Backside power rails and power distribution network for density sca...
- Patent number 12,268,031
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom barrier free interconnects without voids
- Patent number 12,266,607
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned backside contact integration for transistors
- Patent number 12,243,913
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Nikhil Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-mask alternating line deposition
- Patent number 12,243,819
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiered-profile contact for semiconductor
- Patent number 12,148,663
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures with backside gate contacts
- Patent number 12,087,691
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried power rails located in a base layer including first, second,...
- Patent number 11,990,412
- Issue date May 21, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnect having a line with a reduced bottom dimension
- Patent number 11,990,410
- Issue date May 21, 2024
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of rigid close-pitch interconnects
- Patent number 11,972,977
- Issue date Apr 30, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having spacers for improved top via critical dimensio...
- Patent number 11,961,759
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power rail integration
- Patent number 11,915,966
- Issue date Feb 27, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with damascene line and via
- Patent number 11,894,265
- Issue date Feb 6, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via process with damascene metal
- Patent number 11,869,808
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal interconnects with a replacement metal
- Patent number 11,842,961
- Issue date Dec 12, 2023
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with next level line selective growth
- Patent number 11,823,998
- Issue date Nov 21, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via cut fill process for line extension reduction
- Patent number 11,804,406
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned buried power rail cap for semiconductor devices
- Patent number 11,804,436
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive lines with subtractive cuts
- Patent number 11,791,258
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped top via for via resistance reduction
- Patent number 11,670,542
- Issue date Jun 6, 2023
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via stack
- Patent number 11,600,565
- Issue date Mar 7, 2023
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-mask alternating line deposition
- Patent number 11,437,317
- Issue date Sep 6, 2022
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier removal for conductor in top via integration scheme
- Patent number 11,430,735
- Issue date Aug 30, 2022
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned top via
- Patent number 11,315,872
- Issue date Apr 26, 2022
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad-layer high-k for metal-insulator-metal capacitors
- Patent number 11,309,383
- Issue date Apr 19, 2022
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive line with damascene second line type
- Patent number 11,302,575
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having spacers for improved top via critical dimensio...
- Patent number 11,295,978
- Issue date Apr 5, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top vias with selectively retained etch stops
- Patent number 11,289,371
- Issue date Mar 29, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via on subtractively etched conductive line
- Patent number 11,276,611
- Issue date Mar 15, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT WITH TOPVIA
- Publication number 20250226319
- Publication date Jul 10, 2025
- International Business Machines Corporation
- Gideon Oyibo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BACKSIDE CONTACTS WITH LOCAL INTERCONNECTS
- Publication number 20250210518
- Publication date Jun 26, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACTS FOR STACKED TRANSISTOR STRUCTURES WITH SHIFTED CH...
- Publication number 20250212483
- Publication date Jun 26, 2025
- International Business Machines Corporation
- Ruilong Xie
Information Patent Application
TWO-DIMENSIONAL LAYER ASSISTED THREE-DIMENSIONAL TOP VIA INTERCONNECTS
- Publication number 20250201697
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS PASSIVE DEVICE SOLUTION FOR BACKSIDE POWER DISTRIBUT...
- Publication number 20250203999
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORKSHEET DEVICE WITH WRAPPED CONTACT
- Publication number 20250203936
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Ruilong Xie
Information Patent Application
WRAP-AROUND DIELECTRIC LINER TO PREVENT BACKSIDE CONTACT TO GATE SHORT
- Publication number 20250194154
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Liqiao Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONTACT AREA MATCHING
- Publication number 20250185314
- Publication date Jun 5, 2025
- International Business Machines Corporation
- Juntao Li
Information Patent Application
STACKED TRANSISTOR BACKSIDE CONTACT FORMATION
- Publication number 20250185331
- Publication date Jun 5, 2025
- International Business Machines Corporation
- Ruilong Xie
Information Patent Application
EXTENDED BACKSIDE CONTACT FOR STACKED FIELD-EFFECT TRANSISTOR
- Publication number 20250169138
- Publication date May 22, 2025
- International Business Machines Corporation
- Ruilong Xie
Information Patent Application
SELF-ALIGNED BACKSIDE CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE PO...
- Publication number 20250169145
- Publication date May 22, 2025
- International Business Machines Corporation
- Huimei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE CUT STAGGERED STACKED FIELD EFFECT TRANSISTOR
- Publication number 20250159950
- Publication date May 15, 2025
- International Business Machines Corporation
- Ruilong Xie
Information Patent Application
STACKED FET POWER DELIVERY NETWORK FORMATION
- Publication number 20250157928
- Publication date May 15, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORKSHEET TRANSISTOR WITH ADVANCED CELL HEIGHT SCALING
- Publication number 20250142892
- Publication date May 1, 2025
- International Business Machines Corporation
- Ruilong Xie
Information Patent Application
BONDING A WAFER WITH A SUBSTRATE TO A WAFER WITH BACKSIDE INTERCONN...
- Publication number 20250140648
- Publication date May 1, 2025
- International Business Machines Corporation
- HUIMEI ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FET WITH ASYMMETRIC CELL BOUNDARY
- Publication number 20250133816
- Publication date Apr 24, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED TOPVIA AND METAL LINE WITH INCREASED HEIGHT
- Publication number 20250125193
- Publication date Apr 17, 2025
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE STACKED TRANSISTOR
- Publication number 20250118630
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH PLACEHOLDER POSITION MARGIN
- Publication number 20250113537
- Publication date Apr 3, 2025
- International Business Machines Corporation
- Ruilong Xie
Information Patent Application
SPACER MODIFICATION FOR SELECTIVE AIRGAP SPACER FORMATION
- Publication number 20250107219
- Publication date Mar 27, 2025
- International Business Machines Corporation
- Juntao Li
Information Patent Application
ANTENNA DIODE INTEGRATION WITH BACKSIDE BACK END OF THE LINE NETWORK
- Publication number 20250079349
- Publication date Mar 6, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH ENHANCED PLACEHOLDER POSITION MARGIN
- Publication number 20250056864
- Publication date Feb 13, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BREAK BETWEEN PASSIVE DEVICE AND LOGIC DEVICE WITH BACKSI...
- Publication number 20250046714
- Publication date Feb 6, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH ISOLATION FOR BACKSIDE CONTACT FORMATION
- Publication number 20250022913
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Juntao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL
- Publication number 20250006664
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE
- Publication number 20250006590
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR
- Publication number 20250006629
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING
- Publication number 20250006663
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT MITIGATING CONTACT TO GATE SHORT
- Publication number 20240429103
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH ISOLATION STRUCTURES FOR BACKSIDE CONTACTS
- Publication number 20240429166
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Self-aligned buried power rail cap for semiconductor devices

SRAM with backside cross-couple

Backside power rails and power distribution network for density sca...

Bottom barrier free interconnects without voids

Self-aligned backside contact integration for transistors

Single-mask alternating line deposition

Tiered-profile contact for semiconductor

Semiconductor structures with backside gate contacts

Buried power rails located in a base layer including first, second,...

Top via interconnect having a line with a reduced bottom dimension

Fabrication of rigid close-pitch interconnects

Interconnects having spacers for improved top via critical dimensio...

Backside power rail integration

Top via with damascene line and via

Top via process with damascene metal

Advanced metal interconnects with a replacement metal

Top via with next level line selective growth

Top via cut fill process for line extension reduction

Self-aligned buried power rail cap for semiconductor devices

Conductive lines with subtractive cuts

Stepped top via for via resistance reduction

Top via stack

Single-mask alternating line deposition

Barrier removal for conductor in top via integration scheme

Self-aligned top via

Quad-layer high-k for metal-insulator-metal capacitors

Subtractive line with damascene second line type

Interconnects having spacers for improved top via critical dimensio...

Top vias with selectively retained etch stops

Top via on subtractively etched conductive line

Patents Applicationslast 30 patents

INTERCONNECT WITH TOPVIA

DIRECT BACKSIDE CONTACTS WITH LOCAL INTERCONNECTS

BACKSIDE CONTACTS FOR STACKED TRANSISTOR STRUCTURES WITH SHIFTED CH...

TWO-DIMENSIONAL LAYER ASSISTED THREE-DIMENSIONAL TOP VIA INTERCONNECTS

SUBSTRATE-LESS PASSIVE DEVICE SOLUTION FOR BACKSIDE POWER DISTRIBUT...

FORKSHEET DEVICE WITH WRAPPED CONTACT

WRAP-AROUND DIELECTRIC LINER TO PREVENT BACKSIDE CONTACT TO GATE SHORT

SEMICONDUCTOR CONTACT AREA MATCHING

STACKED TRANSISTOR BACKSIDE CONTACT FORMATION

EXTENDED BACKSIDE CONTACT FOR STACKED FIELD-EFFECT TRANSISTOR

SELF-ALIGNED BACKSIDE CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE PO...

DUAL SIDE CUT STAGGERED STACKED FIELD EFFECT TRANSISTOR

STACKED FET POWER DELIVERY NETWORK FORMATION

FORKSHEET TRANSISTOR WITH ADVANCED CELL HEIGHT SCALING

BONDING A WAFER WITH A SUBSTRATE TO A WAFER WITH BACKSIDE INTERCONN...

STACKED FET WITH ASYMMETRIC CELL BOUNDARY

SELF-ALIGNED TOPVIA AND METAL LINE WITH INCREASED HEIGHT

DUAL SIDE STACKED TRANSISTOR

SEMICONDUCTOR STRUCTURE WITH PLACEHOLDER POSITION MARGIN

SPACER MODIFICATION FOR SELECTIVE AIRGAP SPACER FORMATION

ANTENNA DIODE INTEGRATION WITH BACKSIDE BACK END OF THE LINE NETWORK

SEMICONDUCTOR STRUCTURE WITH ENHANCED PLACEHOLDER POSITION MARGIN

DIFFUSION BREAK BETWEEN PASSIVE DEVICE AND LOGIC DEVICE WITH BACKSI...

TRENCH ISOLATION FOR BACKSIDE CONTACT FORMATION

THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL

DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE

DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR

DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING

BACKSIDE CONTACT MITIGATING CONTACT TO GATE SHORT

TRENCH ISOLATION STRUCTURES FOR BACKSIDE CONTACTS