Koichi Motoyama

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bottom barrier free interconnects without voids
- Patent number 12,266,607
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement bottom electrode structure for MRAM devices
- Patent number 12,167,700
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Grant
Structure and method to pattern pitch lines
- Patent number 12,148,617
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-diameter magnetic random-access memory pillar structure
- Patent number 12,108,685
- Issue date Oct 1, 2024
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Grant
Beol tip-to-tip shorting and time dependent dielectric breakdown
- Patent number 12,087,624
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic fuse structure embedded in top via
- Patent number 12,062,609
- Issue date Aug 13, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnects without barrier metal between via and above line
- Patent number 12,057,395
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated top via interconnects
- Patent number 12,040,230
- Issue date Jul 16, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BEOL etch stop layer without capacitance penalty
- Patent number 12,027,416
- Issue date Jul 2, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial top MRAM electrode
- Patent number 12,002,498
- Issue date Jun 4, 2024
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Grant
Fabrication of rigid close-pitch interconnects
- Patent number 11,972,977
- Issue date Apr 30, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via CD controllable top via structure
- Patent number 11,923,246
- Issue date Mar 5, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternating spacers for pitch structure
- Patent number 11,908,732
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous electrodes for magneto-resistive random access memory...
- Patent number 11,887,641
- Issue date Jan 30, 2024
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Grant
Anti-fuse with laterally extended liner
- Patent number 11,881,431
- Issue date Jan 23, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully aligned top vias
- Patent number 11,854,884
- Issue date Dec 26, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with stacked vias having dome-shaped tips
- Patent number 11,848,264
- Issue date Dec 19, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Line formation with cut-first tip definition
- Patent number 11,798,842
- Issue date Oct 24, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical unclonable function for secure integrated hardware systems
- Patent number 11,791,290
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magneto-resistive random access memory with laterally-recessed free...
- Patent number 11,758,819
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Grant
Interconnect structures including self aligned vias
- Patent number 11,735,468
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal of barrier and liner layers from a bottom of a via
- Patent number 11,735,475
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene crossbar array for disabling a defective resistive s...
- Patent number 11,682,471
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Joseph F. Maniscalco
- G11 - INFORMATION STORAGE
Information Patent Grant
Dual damascene with short liner
- Patent number 11,664,271
- Issue date May 30, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization stop region for use with low pattern density intercon...
- Patent number 11,637,036
- Issue date Apr 25, 2023
- International Business Machines Corporation
- Cornelius Brown Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having air gap spacers
- Patent number 11,430,690
- Issue date Aug 30, 2022
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive back-end-of-line vias
- Patent number 11,410,879
- Issue date Aug 9, 2022
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar bump with noble metal seed layer for advanced heterogeneous...
- Patent number 11,380,641
- Issue date Jul 5, 2022
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned top via
- Patent number 11,315,872
- Issue date Apr 26, 2022
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully aligned interconnects with selective area deposition
- Patent number 11,289,375
- Issue date Mar 29, 2022
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELF-ALIGNED CONTACT FOR FIELD EFFECT TRANSISTORS
- Publication number 20250105061
- Publication date Mar 27, 2025
- International Business Machines Corporation
- James P. Mazza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH TUNNEL BARRIER OVERHANG
- Publication number 20250107452
- Publication date Mar 27, 2025
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Application
BOTTOM CONTACT JUMPERS FOR STACKED FIELD EFFECT TRANSISTOR SEMICOND...
- Publication number 20250096128
- Publication date Mar 20, 2025
- International Business Machines Corporation
- James P. Mazza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE METAL PATTERNING AND DAMASCENE-BASED INTERCONNECT
- Publication number 20250046703
- Publication date Feb 6, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH OVERLAPPING METAL VIAS
- Publication number 20250038107
- Publication date Jan 30, 2025
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC ISOLATION FOR MRAM ARRAY
- Publication number 20250031382
- Publication date Jan 23, 2025
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Application
TERRACED CONDUCTOR STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20250014994
- Publication date Jan 9, 2025
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTREMELY HIGH DENSITY SILICON CAPACITOR
- Publication number 20250006780
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED INTERCONNECTS WITH HYPERBOLOID PROFILE
- Publication number 20240421076
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIGHT PITCH DIRECTIONAL SELECTIVE VIA GROWTH
- Publication number 20240421069
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FETs WITH BACKSIDE ANGLE CUT
- Publication number 20240413084
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH TRAPEZOID SHAPED ELECTRODES
- Publication number 20240389468
- Publication date Nov 21, 2024
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Application
BACKSIDE POWER ISLANDS FOR BACKSIDE POWER APPLICATIONS
- Publication number 20240321747
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA INTERCONNECT
- Publication number 20240321630
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY ALIGNED VIA TO SINGLE DAMASCENE UPPER TRENCH
- Publication number 20240312839
- Publication date Sep 19, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE SEMICONDUCTOR INTERCONNECT STRUCTURE
- Publication number 20240304546
- Publication date Sep 12, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE METAL VIA WITH METAL BRIDGE
- Publication number 20240282704
- Publication date Aug 22, 2024
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH OCTAGON PROFILE
- Publication number 20240233793
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Application
BACKSIDE-CONNECTING VIA WITH NANOSHEET SPACERS FOR TRANSISTORS
- Publication number 20240222395
- Publication date Jul 4, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OCTAGONAL INTERCONNECT WIRING FOR ADVANCED LOGIC
- Publication number 20240213092
- Publication date Jun 27, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED PITCH INTERCONNECTS WITH MULTIPLE LOW ASPECT RATIO SEGMENTS
- Publication number 20240213087
- Publication date Jun 27, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKIP VIA WITH DISCONTINUOUS DIELECTRIC CAP
- Publication number 20240203867
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR POWER DELIVERY ON SEMICONDUCTOR DEVICE
- Publication number 20240204067
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPER VIA WITH SIDEWALL SPACER
- Publication number 20240194585
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH HAMMERHEAD PROFILE
- Publication number 20240196758
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Koichi Motoyama
- G11 - INFORMATION STORAGE
Information Patent Application
Interconnects with Sidewall Barrier Layer Divot Fill
- Publication number 20240194587
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH BACKSIDE METALLIZATION LAYERS
- Publication number 20240194586
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY STRUCTURE WITH NON-ION BEAM ETCHED MTJ AND TOP ELECTRODE
- Publication number 20240188447
- Publication date Jun 6, 2024
- International Business Machines Corporation
- Chanro Park
- G11 - INFORMATION STORAGE
Information Patent Application
STACKED TRANSISTORS HAVING BOTTOM CONTACT WITH LARGER SILICIDE
- Publication number 20240186325
- Publication date Jun 6, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Structure for Low Resistance Interconnects
- Publication number 20240186242
- Publication date Jun 6, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS

Koichi Motoyama

Person

Patents Grantslast 30 patents

Bottom barrier free interconnects without voids

Replacement bottom electrode structure for MRAM devices

Structure and method to pattern pitch lines

Multi-diameter magnetic random-access memory pillar structure

Beol tip-to-tip shorting and time dependent dielectric breakdown

Electronic fuse structure embedded in top via

Top via interconnects without barrier metal between via and above line

Encapsulated top via interconnects

BEOL etch stop layer without capacitance penalty

Coaxial top MRAM electrode

Fabrication of rigid close-pitch interconnects

Via CD controllable top via structure

Alternating spacers for pitch structure

Simultaneous electrodes for magneto-resistive random access memory...

Anti-fuse with laterally extended liner

Fully aligned top vias

Semiconductor structure with stacked vias having dome-shaped tips

Line formation with cut-first tip definition

Physical unclonable function for secure integrated hardware systems

Magneto-resistive random access memory with laterally-recessed free...

Interconnect structures including self aligned vias

Removal of barrier and liner layers from a bottom of a via

Dual damascene crossbar array for disabling a defective resistive s...

Dual damascene with short liner

Planarization stop region for use with low pattern density intercon...

Interconnects having air gap spacers

Subtractive back-end-of-line vias

Pillar bump with noble metal seed layer for advanced heterogeneous...

Self-aligned top via

Fully aligned interconnects with selective area deposition

Patents Applicationslast 30 patents

SELF-ALIGNED CONTACT FOR FIELD EFFECT TRANSISTORS

MRAM DEVICE WITH TUNNEL BARRIER OVERHANG

BOTTOM CONTACT JUMPERS FOR STACKED FIELD EFFECT TRANSISTOR SEMICOND...

SUBTRACTIVE METAL PATTERNING AND DAMASCENE-BASED INTERCONNECT

INTERCONNECT STRUCTURES WITH OVERLAPPING METAL VIAS

DIELECTRIC ISOLATION FOR MRAM ARRAY

TERRACED CONDUCTOR STRUCTURE FOR SEMICONDUCTOR DEVICES

EXTREMELY HIGH DENSITY SILICON CAPACITOR

ADVANCED INTERCONNECTS WITH HYPERBOLOID PROFILE

TIGHT PITCH DIRECTIONAL SELECTIVE VIA GROWTH

STACKED FETs WITH BACKSIDE ANGLE CUT

MRAM DEVICE WITH TRAPEZOID SHAPED ELECTRODES

BACKSIDE POWER ISLANDS FOR BACKSIDE POWER APPLICATIONS

TOP VIA INTERCONNECT

FULLY ALIGNED VIA TO SINGLE DAMASCENE UPPER TRENCH

LOW RESISTANCE SEMICONDUCTOR INTERCONNECT STRUCTURE

SUBTRACTIVE METAL VIA WITH METAL BRIDGE

MRAM DEVICE WITH OCTAGON PROFILE

BACKSIDE-CONNECTING VIA WITH NANOSHEET SPACERS FOR TRANSISTORS

OCTAGONAL INTERCONNECT WIRING FOR ADVANCED LOGIC

ADVANCED PITCH INTERCONNECTS WITH MULTIPLE LOW ASPECT RATIO SEGMENTS

SKIP VIA WITH DISCONTINUOUS DIELECTRIC CAP

CONTACT STRUCTURE FOR POWER DELIVERY ON SEMICONDUCTOR DEVICE

SUPER VIA WITH SIDEWALL SPACER

MRAM DEVICE WITH HAMMERHEAD PROFILE

Interconnects with Sidewall Barrier Layer Divot Fill

SEMICONDUCTOR STRUCTURE WITH BACKSIDE METALLIZATION LAYERS

MEMORY STRUCTURE WITH NON-ION BEAM ETCHED MTJ AND TOP ELECTRODE

STACKED TRANSISTORS HAVING BOTTOM CONTACT WITH LARGER SILICIDE

Wire Structure for Low Resistance Interconnects