Patent Application
20240186325
The present invention generally relates to semiconductor structures, and more particularly to stacked transistor structures having bottom contact with larger silicide area.
Integrated circuit (IC) chips are formed on semiconductor wafers at increasingly smaller scale. In current technology nodes, such as 7, 10 and 14 nanometer technologies, transistor devices are constructed as three-dimensional (3D) fin field effect transistor (FINFET) structures. However, chipmakers face a myriad of challenges at 5 nm, 3 nm and beyond. Currently, traditional chip scaling continues to slow as process complexities and costs escalate at each node.
A potential solution to this chip scaling problem is gate-all-around technology. One example of a complex gate-all-around technology is a complementary FET (CFET) where nFET and pFET nanowires/nanosheets are vertically stacked on top of each other.
According to an embodiment of the present invention, a semiconductor structure is provided. The semiconductor structure may include a top source drain region above a bottom source drain region, wherein a width of the bottom source drain region is greater than a width of the top source drain region, a bottom contact structure directly above and in electrical contact with the bottom source drain region, a metal silicide between the bottom source drain region and the bottom contact structure, the metal silicide having a width larger than a width of the bottom contact structure, a replacement spacer surrounding the bottom contact structure, and a top gate spacer separating the replacement spacer from a gate conductor.
According to another embodiment of the present invention, a semiconductor structure is provided. The semiconductor structure may include a top source drain region above a bottom source drain region, wherein a width of the bottom source drain region is greater than a width of the top source drain region, a bottom contact structure directly above and in electrical contact with the bottom source drain region, a metal silicide between the bottom source drain region and the bottom contact structure, the metal silicide having a lateral width larger than a lateral width of the bottom contact structure, a replacement spacer surrounding the bottom contact structure, and a top gate spacer separating the replacement spacer from a gate conductor, wherein the replacement spacer is made from a different material than the top gate spacer.
According to another embodiment of the present invention, a semiconductor structure is provided. The semiconductor structure may include a top stack of nanosheet channels above a bottom stack of nanosheet channels, wherein a width of the bottom stack of nanosheet channels is greater than a width of the top stack of nanosheet channels, a top source drain region above a bottom source drain region, wherein a width of the bottom source drain region is greater than a width of the top source drain region, a bottom contact structure directly above and in electrical contact with the bottom source drain region, a metal silicide between the bottom source drain region and the bottom contact structure, the metal silicide having a lateral width larger than a lateral width of the bottom contact structure, a replacement spacer surrounding all sides of the bottom contact structure, and a top gate spacer separating the replacement spacer from a gate conductor.
The following detailed description, given by way of example and not intended to limit the invention solely thereto, will best be appreciated in conjunction with the accompanying drawings, in which:
The drawings are not necessarily to scale. The drawings are merely schematic representations, not intended to portray specific parameters of the invention. For clarity and ease of illustration, scale of elements may be exaggerated. The drawings are intended to depict only typical embodiments of the invention. In the drawings, like numbering represents like elements.
Additionally, XYZ Cartesian coordinates may be also shown in each of the drawings to provide additional spatial context. The terms “vertical” or “vertical direction” or “vertical height” as used herein denote a Z-direction of the Cartesian coordinates shown in the drawings, and the terms “horizontal,” or “horizontal direction,” or “lateral direction” as used herein denote an X-direction and/or a Y-direction of the Cartesian coordinates shown in the drawings.
Detailed embodiments of the claimed structures and methods are disclosed herein; however, it can be understood that the disclosed embodiments are merely illustrative of the claimed structures and methods that may be embodied in various forms. This invention may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. In the description, details of well-known features and techniques may be omitted to avoid unnecessarily obscuring the presented embodiments.
References in the specification to “one embodiment”, “an embodiment”, “an example embodiment”, etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
For purposes of the description hereinafter, the terms “upper”, “lower”, “right”, “left”, “vertical”, “horizontal”, “top”, “bottom”, and derivatives thereof shall relate to the disclosed structures and methods, as oriented in the drawing figures. It will be understood that when an element as a layer, region or substrate is referred to as being “on” or “over” another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” or “directly over” another element, there are no intervening elements present. It will also be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present. Also, the term “sub-lithographic” may refer to a dimension or size less than current dimensions achievable by photolithographic processes, and the term “lithographic” may refer to a dimension or size equal to or greater than current dimensions achievable by photolithographic processes. The sub-lithographic and lithographic dimensions may be determined by a person of ordinary skill in the art at the time the application is filed.
The terms substantially, substantially similar, about, or any other term denoting functionally equivalent similarities refer to instances in which the difference in length, height, or orientation convey no practical difference between the definite recitation (e.g. the phrase sans the substantially similar term), and the substantially similar variations. In one embodiment, substantial (and its derivatives) denote a difference by a generally accepted engineering or manufacturing tolerance for similar devices, up to, for example, 10% deviation in value or 10° deviation in angle.
In the interest of not obscuring the presentation of embodiments of the present invention, in the following detailed description, some processing steps or operations that are known in the art may have been combined together for presentation and for illustration purposes and in some instances may have not been described in detail. In other instances, some processing steps or operations that are known in the art may not be described at all. It should be understood that the following description is rather focused on the distinctive features or elements of various embodiments of the present invention.
Complementary field effect transistors, or stacked transistors, have known advantages over conventional transistor structures in terms of density, performance, power consumption, and integration. However, fabricating a bottom contact for a bottom device of a stacked transistor has become increasingly difficult as device spacing continues to shrink with the advent of smaller technology nodes. More specifically, for example, it is particularly challenging to form the bottom contact in small pitch devices without adequate isolation from the top source drain region and without decreasing the effective contact area with the bottom source drain region. For purposes of this description, and all embodiments described herein, typical device pitch ranges from approximately 40 nm to approximately 60 nm.
The present invention generally relates to semiconductor structures, and more particularly to stacked transistor structures having bottom contact with larger silicide area. More specifically, the stacked transistor structures and associated method disclosed herein enables a novel solution for providing an electrical contact to the bottom source drain region with a replacement spacer and a larger silicide area to prevent shorting to the gate or the top source drain region while also decreasing the contact resistance with the bottom source drain region. Exemplary embodiments of stacked transistors having bottom contact with replacement spacer with a larger silicide area are described in detail below by referring to the accompanying drawings in
Referring now to
The structure 100 illustrated in
Additionally, bottom source drain regions 114 and top source drain regions 116 are formed between adjacent stacks (104, 106) in direct contact with exposed ends of the silicon channels 108. More specifically, the bottom source drain regions 114 and the top source drain regions 116 are epitaxially grown from the exposed ends of the silicon channels 108 according to known techniques.
The structure 100 further includes inner spacers 118 between alternate channels (108). The inner spacers 118 laterally separate the gate conductor 110 from both the bottom source drain regions 114 and the top source drain regions 116, respectively, as illustrated. The inner spacers 118 provide necessary electrical insulation between the gate conductor 110 and the source drawing regions (114, 116). Dielectric features 120 separate the bottom source drain regions 114 from the top source drain regions 116, as illustrated. The dielectric features 120 provide necessary electrical insulation between the bottom source drain regions 114 and the top source drain regions 116.
When forming the gate conductor 110, top gate spacers 122 and gate caps 124 are added to separate and electrically insulate the gate conductor 110 from subsequently formed structures, such as, for example, contact structures. The top gate spacers 122 are critical for electrically insulating the gate conductor from any subsequently formed source drain regions (for example the top source drain region 116) or contact structures. The gate caps 124 may further protect the gate conductor 110 during subsequent processing. In at least one embodiment, the top gate spacers 122 and the gate caps 124 include silicon nitride, silicon boron nitride, silicon carbon nitride, silicon boron carbon nitride, or other known equivalents.
Although the stack isolation layer 112 is shown as a separate component form the top gate spacers 122, they may, in some embodiments, be made from identical dielectric materials and thus be indistinguishable from one another in the final structure. For example, both the stack isolation layer 112 and the top gate spacers 122 can be made from any of the dielectric materials listed above with respect to the top gate spacers 122. In another example, the stack isolation layer 112 and the top gate spacers 122 can be made different materials. Finally, the existing components are substantially surrounded by a dielectric layer 126, such as known interlevel dielectrics, and adjacent devices can be electrically insulated from one another with conventional shallow trench isolation features 128. In at least one embodiment, the dielectric layer 126 may include silicon oxide. Alternatively, the dielectric layer 126 may include some combination of materials, for example a silicon nitride dielectric liner and a silicon oxide fill.
Although only a limited number of components, devices, or structures are shown, embodiments of the present invention shall not be limited by any quantity otherwise illustrated or discussed herein.
Referring now to
First, the mask 130 is deposited and subsequently patterned to expose certain portions of the structure 100 according to known techniques. Specifically, portions of the dielectric layer 126 between the gate conductors 110 and directly above a portion of the bottom source drain regions 114.
According to an embodiment, the mask 130 can be an organic planarization layer (OPL) or a layer of material that is capable of being planarized, etched, or patterned by known techniques. In an embodiment, for example, the mask 130 can be an amorphous carbon layer able to withstand subsequent processing temperatures. The mask 130 can preferably have a thickness sufficient to cover and protect existing structures during subsequent processing. After depositing the mask 130, a dry etching technique is applied to pattern the mask 130. Although general alignment of the mask 130 is important, there is some room for misalignment provided by the top gate spacers 122. In a preferred embodiment, patterning the mask 130 exposes small portions of the uppermost surface of the top gate spacers 122, as shown. Doing so ensures success of subsequent processing steps.
Next, portions of the dielectric layer 126 are selectively removed according to known techniques and until uppermost surfaces of the bottom source drain regions 114 are exposed. Specifically, portions of the dielectric layer 126 are removed selective to the top gate spacers 122. For example, portions of the dielectric layer 126 are removed selective to the top gate spacers 122 using known etching techniques, suitable to remove interlevel dielectrics selective to silicon nitride, or the chosen material of the top gate spacers 122. In at least an embodiment, a directional dry etch technique, such as reactive ion etching, is used to selectively remove portions of the dielectric layer 126, as shown. Such techniques are commonly referred to as “self-aligned” etching techniques because the top gate spacers 122 form at least two boundaries of the resulting trench. As such, the bottom contact trenches 132 may also be referred to as a self-aligned contact trenches.
In all cases, vertical sidewalls of the top gate spacer 122 must be exposed after removing portions of the dielectric layer 126 and forming the bottom contact trenches 132. Additionally, in some embodiments, portions of the top source drain regions 116 may be etched or removed during etching to form the contact trenches 132. Although removing portions of the top source drain regions 116 is not necessarily an object of the invention, it is a very likely result in view of the tight pitch and limited space. In other embodiments, portions of the bottom source drain regions 114 may be removed during forming of the bottom contact trenches 132. For example, an uppermost surface of the bottom source drain regions 114 may generally be used as an etch stop; however, etching may continue and remove a small portion of the bottom source drain regions 114 (not shown).
Referring now to
First, the mask 130 is removed using known techniques, for example, by ashing. Next, the metal layer 131 is deposited according to known techniques. For example, a directional deposition technique, such as physical vapor deposition, may be preferred to limit deposition of the metal layer 131 on vertical, or substantially vertical, sidewalls. Although disposition thickness tolerance of the metal layer 131 is not critical, it is necessary for the metal layer 131 to have a sufficient thickness, in the z-direction, to enable adequate silicide formation during subsequent processing. The metal layer 131 may include any metal or combination of metals suitable for silicide formation at the bottom source drain regions 114. In an embodiment, the metal layer 131 is made from titanium. In another embodiment, the metal layer 131 is Ni, Co, and NiPt.
Referring now to
As illustrated in
Referring now to
As illustrated in
Trimming the top gate spacer 122, the stack isolation layer 112, and the inner spacers 118 effectively increases the length, in the x-direction, of the bottom contact trenches 132. It is very important to ensure the length, in the x-direction, of the bottom contact trenches 132 is increased across its entire depth to ensure formation of a usable contact structure as discussed in greater detail below. Stated differently, trimming the top gate spacer 122, the stack isolation layer 112, and the inner spacers 118 is critical to embodiments of the present invention because a useable bottom contact structure would not otherwise be possible. Moreover, trimming the top gate spacer 122 alone, without also trimming the stack isolation layer 112, and the inner spacers 118, would be insufficient because the length, in the x-direction, of the bottom contact trenches 132 would remain narrow at the bottom and undesirably increase contact resistance, as discussed in more detail below.
It is worth noting, in accordance with the embodiments illustrated in the figures, the topmost surface of the bottom source drain regions 114 must be lower than the stack isolation layer 112 in order to expose a small portion of the inner spacers 118. Alternatively, as previously discussed the bottom source drain regions 114 may be recessed a desired amount during formation of the contact trenches 132 in order to expose the inner spacers 118, see
Referring now to
First, another mask (not shown), for example OPL, is formed within the contact trenches 132, and exposed additional portions of the metal layer 131 across top surfaces of the structure 100 are removed according to known techniques. For example, a dry etch or wet etch technique may be employed to etch or remove the additional or top portions of the metal layer 131. After removing the exposed portions of the metal layer 131 the other mask is removed using known techniques.
The replacement spacers 134 must be formed along sidewalls of the bottom contact trench 132. The replacement spacers 134 are critical to provide electrical insulation between subsequently formed contact structures and the top source drain regions 116. As a recap, portions, or sidewalls, of the metal layer 132, the top source drain regions 116, or both, were exposed during forming of the bottom contact trenches 132. For example, forming contract structures directly in the bottom contact trenches 132 without the replacement spacers 134 would result in direct contact, and thus a short, between the contact structures and the top source drain regions 116.
As illustrated in
In a typical fashion, the replacement spacers 134 are deposited in a conformal manner followed by a directional etching technique to remove portions of the replacement spacer 134 and expose the bottom source drain regions 114, as illustrated in
Conceptually, similar results could be achieved by designing the bottom source drain regions 114 significantly longer than the top source drain regions 116; however, doing so is not practical because it would consume too much real estate on the wafer and compete with scaling efforts.
Referring now to
First, the gate contact trenches and the top contact trenches are formed according to known patterning an etching techniques similar to those described above with respect to the bottom contact trenches 132. Next, the gate contact trenches, the top contact trenches, and the bottom contact trenches 132 are all filled with a conducive material to form the gate contacts 136, the top contacts 138 and the bottom contacts 140.
The contact structures (136, 138, 140) may include any suitable conductive material, such as, for example, copper, ruthenium, aluminum, tungsten, cobalt, or alloys thereof. In the present embodiment, a metal silicide is formed at the bottom of the contact trenches prior to and/or during filling them with the conductive material. After, excess conductive material can be polished using known techniques until a topmost surface of the contact structures (136, 138, 140) are flush, or substantially flush, with topmost surfaces of the dielectric layer 126. It is noted, the replacement spacers 134 surround all sides of the bottom contacts 140, as illustrated in
In sum, for purposes of this description the structure 100 illustrated in the figures and described herein includes multiple stacked transistor structures positioned adjacent, or next, to one another, and manufactured in a process flow. Embodiments of the present invention, and the detailed description provide above, are directed primarily at silicide and contact formation after a replacement metal gate is formed. Further, each stacked transistor structure includes a top device and a bottom device. More specifically, both top devices and bottom devices of each stacked transistor structure have a nanosheet, or gate-all-around, structure.
As illustrated in
Unlike conventional structures, both the top gate spacers 122 and the replacement spacers 134 separate the bottom contacts 140 from the gate conductors 110. In order to make room for the additional replacement spacers 134, the top gate spacers 122 are trimmed or laterally recessed. In some embodiments this causes the gate spacers 122 to be thinner than the replacement spacers 134. Furthermore, the replacement spacers 134 are the only structure separating the top source drain regions 116 from the bottom contacts 140. As such, the replacement spacers 134 directly contact both the top source drain regions 116 and the bottom contacts 140, as illustrated in
Additional distinctive notable features include the inner spacers (118) nearest to an uppermost surface of the bottom source drain region 114 includes a first top surface above a second top surface, the second top surface being substantially flush with the uppermost surface of the bottom source drain region 114. As illustrated in
Yet, additional distinctive notable features include a relatively larger silicide area (131) between the bottom source drain regions 114 and the bottom contacts 140. Although beneficial, forming the replacement spacers 134 significantly reduces the contact area between the bottom source drain regions 114 and the bottom contacts 140, regardless of whether a silicide is formed or not. The smaller contact area created by the replacement spacers 134 increase contact resistance. As such, embodiments of the present invention, as disclosed herein, describe forming a metal layer directly on top of the bottom source drain regions 114 prior to forming the otherwise beneficial replacement spacers 134. Doing so increases the contact area between the bottom source drain regions 114 and the bottom contacts 140, thereby improving or lowering contact resistance. In such cases, the length, in the x-direction, of the larger silicide area (131) is substantially equal to a length of the bottom source drain region 114.
For reference purposes measurements taken in the x-direction, perpendicular to the gate conductors 110, are herein referred to as “length”, while measurements taken in the y-direction, parallel to the gate conductors 110, are herein referred to as “width”.
The descriptions of the various embodiments of the present invention have been presented for purposes of illustration, but are not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention. The terminology used herein was chosen to best explain the principles of the embodiment, the practical application or technical improvement over technologies found in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
