Koji Serizawa

Person

Fujisawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component with varying rigidity leads using Pb-free solder
- Patent number 7,911,062
- Issue date Mar 22, 2011
- Hitachi, Ltd.
- Tetsuya Nakatsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having solder bumps reliably reflow solderable
- Patent number 7,145,236
- Issue date Dec 5, 2006
- Renesas Technology Corp.
- Kazuma Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 6,774,490
- Issue date Aug 10, 2004
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electron device and semiconductor device
- Patent number 6,555,052
- Issue date Apr 29, 2003
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module having solder bumps and solder portions with d...
- Patent number 6,486,411
- Issue date Nov 26, 2002
- Hitachi, Ltd.
- Kazuma Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Film carrier tape and laminated multi-chip semiconductor device inc...
- Patent number 6,297,074
- Issue date Oct 2, 2001
- Hitachi, Ltd.
- Ichiro Miyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of manufacturing an electronic circuit board
- Patent number 6,204,490
- Issue date Mar 20, 2001
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Film carrier tape and laminated multi-chip semiconductor device inc...
- Patent number 5,804,872
- Issue date Sep 8, 1998
- Hitachi, Ltd.
- Ichiro Miyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film carrier tape and laminated multi-chip semiconductor device inc...
- Patent number 5,631,497
- Issue date May 20, 1997
- Hitachi, Ltd.
- Ichiro Miyano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Mounting Substrate Suitable for Use to Install Surface Mount Compon...
- Publication number 20080261001
- Publication date Oct 23, 2008
- Tetsuya Nakatsuka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MOUNTING STRUCTURE
- Publication number 20080062665
- Publication date Mar 13, 2008
- Tetsuya NAKATSUKA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC COMPONENT WITH LEAD USING PB-FREE SOLDER
- Publication number 20070210139
- Publication date Sep 13, 2007
- Tetsuya NAKATSUKA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electron device and semiconductor device
- Publication number 20030186072
- Publication date Oct 2, 2003
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having solder bumps reliably reflow solderable
- Publication number 20030030149
- Publication date Feb 13, 2003
- Kazuma Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electron device and semiconductor device
- Publication number 20020066583
- Publication date Jun 6, 2002
- Tasao Soga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module and circuit substrate
- Publication number 20010050181
- Publication date Dec 13, 2001
- Kazuma Miura
- H01 - BASIC ELECTRIC ELEMENTS

Koji Serizawa

Person

Patents Grantslast 30 patents

Electronic component with varying rigidity leads using Pb-free solder

Semiconductor device having solder bumps reliably reflow solderable

Electronic device

Electron device and semiconductor device

Semiconductor module having solder bumps and solder portions with d...

Film carrier tape and laminated multi-chip semiconductor device inc...

Method and apparatus of manufacturing an electronic circuit board

Film carrier tape and laminated multi-chip semiconductor device inc...

Film carrier tape and laminated multi-chip semiconductor device inc...

Patents Applicationslast 30 patents

Mounting Substrate Suitable for Use to Install Surface Mount Compon...

MOUNTING STRUCTURE

ELECTRONIC COMPONENT WITH LEAD USING PB-FREE SOLDER

Electron device and semiconductor device

Semiconductor device having solder bumps reliably reflow solderable

Electron device and semiconductor device

Semiconductor module and circuit substrate