Patent Application
20080062665
Embodiments of the present invention will be described in detail.
A full grid BGA which is a low heat resistant component (the heat resistant temperature: 220° C., the component size: 23 mm×23 mm, the bump pitch: 1.0 mm, the number of bumps: 484 (22 rows×22 columns), the bump composition: Sn-9Zn) is mounted on a substrate on which a Sn-9Zn solder paste (the supply thickness: 0.15 mm, the supply diameter: 0.5 mm) has been printed, and then reflow soldering is performed so that the peak temperature of the bumps in the center of the component becomes 220° C.
The following two kinds of substrates are used for the connection. In substrate B, the five columns on an outer side (340 bumps) are set as an outer peripheral portion, and the land size in this portion is made smaller than that in a central portion.
Therefore, the remaining portion, that is, a portion consisting of the 12 rows×12 columns (144 bumps) is called the central portion.
For the respective substrate samples, one BGA is connected to each substrate, and 100 substrates per each kind, namely, 200 substrates in total are produced.
Land size in central portion (diameter): 0.5 mm Land size in outer peripheral portion (diameter): 0.5 mm
As a result thereof, connection errors between the bumps and paste molten portions occur in the ratio of 1% of substrates A, but no connection error occurs in substrates B.
As a result of carrying out a temperature cycle test (−55 to 125° C., 1 cycle/h) by selecting ten substrates in which the connection error does not occur from each sample, namely, selecting 20 substrates in total, it is confirmed that breakage in an interface between an electrode on the BGA side and the solder bump occurs in the corner portion in each of two substrates among ten substrates with respect to substrates A, at the time of about the 200th cycle.
However, no breakage is found in substrates B even after the lapse of 500 cycles. Therefore, it is confirmed that the effects of prevention of the solder connection error and enhancement of connection reliability are obtained by the present method.
The full grid BGA which is a low heat resistant component (the heat resistant temperature: 220° C., the component size: 23 mm×23 mm, the bump pitch: 1.0 mm, the number of bumps: 484 (22 rows×22 columns), the bump composition: Sn-9Zn) is mounted on the substrate on which the Sn-9Zn solder paste (the supply thickness: 0.15 mm, the supply diameter: 0.5 mm) has been printed, and then the reflow soldering is performed so that the peak temperature of the bumps in the center of the component becomes 220° C.
The following substrate, and components A and B are used for the connection.
No treatment is applied to the BGA.
The five columns on an outer side of the BGA (340 bumps) are set as an outer peripheral portion, and a part of each bump surface in this portion is coated with a solder resist.
At this time, the solder resist is applied to a portion of about 60% in height on a component package side, and is not attached to a portion of about 40% in height on a side to be contacted with the paste. Therefore, the remaining portion consisting of 12 rows×12 columns (144 bumps) is called the central portion, and the bumps in this portion are not coated with the solder resist at all.
For the respective substrate samples, one BGA is connected to each substrate, and 100 substrates per each component, namely, 200 substrates in total are produced.
The substrates to which components A and B are connected will be called substrates A and B, respectively.
As a result thereof, connection errors between the bumps and paste molten portions occur in the ratio of 1% of substrates A, but no connection error occurs in substrates B.
As a result of carrying out the temperature cycle test (−55 to 125° C., 1 cycle/h) by selecting ten substrates in which the connection error does not occur from each sample, namely, selecting 20 substrates in total, it is confirmed that breakage in the interface of the electrode on the BGA side and the solder bump occurs in the corner portion in each of two substrates among ten substrates with respect to substrates A at the time of about the 200th cycle.
However, no breakage is found in substrates B even after the lapse of 500 cycles. Therefore, it is confirmed that the effects of prevention of the solder connection error and enhancement of connection reliability are obtained by the present method.
The full grid BGA which is a low heat resistant component (the heat resistant temperature: 220° C., the component size: 23 mm×23 mm, the bump pitch: 1.0 mm, the number of bumps: 484 (22 rows×22 columns), the bump composition: Sn-9Zn) is mounted on the substrate on which the Sn-9Zn solder paste (the supply thickness: 0.15 mm, the supply diameter: 0.5 mm) has been printed, and then the reflow soldering is performed so that the peak temperature of the bumps in the center of the component becomes 220° C.
The following two kinds of substrates are used for the connection. In substrate B, the five columns on the outer side (340 bumps) are set as an outer peripheral portion, and each substrate side land shape 7 in this portion is formed so that an outer peripheral length becomes about 3.8 times as large as the land size by providing notched portions at four spots in its circular shape with a diameter of 0.5 mm as shown in
Meanwhile, the remaining portion, that is, the portion consisting of the 12 rows×12 columns (144 bumps) is called the central portion, and each land shape of this portion is remained the circular shape with a diameter of 0.5 mm.
For the respective substrate samples, one BGA is connected to each substrate, and 100 substrates per each kind, namely, 200 substrates in total are produced.
As a result thereof, connection errors between the bumps and paste molten portions occur in the ratio of 1% of substrates A, but no connection error occurs in substrates B.
As a result of carrying out the temperature cycle test (−55 to 125° C., 1 cycle/h) by selecting ten substrates in which the connection error does not occur from each sample, namely, selecting 20 substrates in total, it is confirmed that breakage in the interface of the electrode on the BGA side and the solder bump occurs in the corner portion in each of two substrates among ten substrates with respect to substrates A at the time of about the 200th cycle.
However, no breakage is found in substrates B even after the lapse of 500 cycles. Therefore, it was confirmed that the effects of prevention of the solder connection error and enhancement of connection reliability are obtained by the present method.
The full grid BGA which is a low heat resistant component (the heat resistant temperature: 220° C., the component size: 23 mm×23 mm, the bump pitch: 1.0 mm, the number of bumps: 484 (22 rows×22 columns), the bump composition: Sn-9Zn) is mounted on the substrate on which the Sn-9Zn solder paste (the supply thickness: 0.15 mm) has been printed, and then the reflow soldering is performed so that the peak temperature of the bumps in the center of the component becomes 220° C.
The following four kinds of substrates are used for the connection. In each of substrates B, C and D, the five columns on the outer side (340 bumps) are set as an outer peripheral portion, and the solder paste supply diameter in this portion is made larger than that of the remaining portion (which will be called the central portion) of the 12 rows×12 columns (144 bumps), so that a larger amount of solder paste is supplied thereon.
For the respective substrate samples, one BGA is connected to each substrate, and 50 substrates per each kind, namely, 200 substrates in total are produced.
Solder paste supply diameter in central portion: 0.5 mm Solder paste supply diameter in outer peripheral portion: 0.5 mm
Solder paste supply diameter in central portion: 0.5 mm
Solder paste supply diameter in outer peripheral portion: 0.53 mm
Solder paste supply diameter in central portion: 0.5 mm
Solder paste supply diameter in outer peripheral portion: 0.6 mm
Solder paste supply diameter in central portion: 0.5 mm
Solder paste supply diameter in outer peripheral portion: 0.65 mm
As a result thereof, connection errors between the bumps and paste molten portions occur in the ratio of 2% of substrates A, but no connection error occurs in substrates B, C and D.
However, in substrates D, solder bridges are generated between adjacent connecting portions in the ratio of 4%.
In substrates A, B, C and D, the solder paste supply amounts near the outer peripheral portions are made larger by 0%, about 12%, about 44% and about 69%, respectively, with respect to those near the inside.
As a result of carrying out the temperature cycle test (−55 to 125° C., 1 cycle/h) by selecting ten substrates in which the connection error and the solder bridges do not occur from each sample, namely, 40 substrates in total, it is confirmed that breakage in the interface of the electrode on the BGA side and the solder bump occurs in the corner portion in each of two substrates among ten substrates with respect to substrates A at the time of about the 200th cycle.
However, no breakage is found in substrates B, C and D even after the lapse of 500 cycles. Therefore, it is confirmed that the effects of prevention of the solder connection error and enhancement of connection reliability are obtained by the present method.
The full grid BGA which is a low heat resistant component (the heat resistant temperature: 220° C., the component size: 23 mm×23 mm, the bump pitch: 1.0 mm, the number of bumps: 484 (22 rows×22 columns)) is mounted on the substrate on which the Sn-9Zn solder paste (the supply thickness: 0.15 mm, the supply diameter: 0.5 mm) has been printed, and then the reflow soldering is performed so that the peak temperature of the bumps in the center of the component becomes 220° C. The following substrate is used for the connection.
In the substrate, the five columns on the outer side (340 bumps) are set as an outer peripheral portion, and each land size in this portion is made smaller than that in a central portion.
The remaining portion, that is, the portion consisting of the 12 rows×12 columns (144 bumps) is the central portion.
A component in which the solder bumps of Sn-9Znn are provided in the central portion, and the solder bumps of Sn-9Zn are also provided in the outer peripheral portion is referred to as component A.
Further, a component in which the solder bumps of Sn-9Zn are provided in the central portion, and the solder of Sn-4Zn with relatively less Zn content and high reliability is provided in the outer peripheral portion is referred to as component B.
For the respective substrate samples, one BGA is connected to each substrate, and 100 substrates per each component, namely, 200 substrates in total are produced.
As a result thereof, no connection error between the bumps and paste molten portions occur with respect to both substrates A and B.
As a result of carrying out the temperature cycle test (−55 to 125° C., 1 cycle/h) by using ten substrates from each sample, namely, using 20 in total, it is confirmed that breakage in the interface between the electrode on the BGA side and the solder bump occurs in the corner portion in one substrate among ten substrates with respect to substrates A at the time of about the 700th cycle.
However, no breakage is found in substrates B even after the lapse of 1000 cycles. Therefore, it is confirmed that the effects of prevention of the solder connection error and enhancement of connection reliability are obtained by the present method.
Several embodiments have been described taking a Sn—Zn solder paste as an example in the above, but the present invention is not limited to those, and needless to say, the effect can be obtained even if another solder paste is used as long as it is combined with the above described structures.
According to the present invention, by improving a supply form and a composition of a paste which is connected with a bump of a low heat resistant component for performing bump connection, it is possible to provide a method of performing reflow soldering of the component while thermally protecting the component and ensuring high connection reliability.
The invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiment is therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
| Number | Date | Country | Kind |
|---|---|---|---|
| JP 2006-246255 | Sep 2006 | JP | national |
