Konstantinos l. Papathomas

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electrically conductive adhesive (ECA) for multilayer device interc...
- Patent number 9,451,693
- Issue date Sep 20, 2016
- i3 ELECTRONICS, INC.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrate with low loss capacitive material and method...
- Patent number 8,446,707
- Issue date May 21, 2013
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulant of epoxy or cyanate ester resin, reactive flexibilizer...
- Patent number 7,560,501
- Issue date Jul 14, 2009
- International Business Machines Corporation
- Konstantinos I. Papathomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conducting adhesives for via fill applications
- Patent number 7,467,742
- Issue date Dec 23, 2008
- International Business Machines Corporation
- Jeffrey Donald Gelorme
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method and structure for producing Z-axis interconnection assembly...
- Patent number 7,402,254
- Issue date Jul 22, 2008
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package with epoxy or cyanate ester resin encapsulant
- Patent number 7,384,682
- Issue date Jun 10, 2008
- International Business Machines Corporation
- Konstantinos I. Papathomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulant composition and electronic package utilizing same
- Patent number 7,321,005
- Issue date Jan 22, 2008
- International Business Machines Corporation
- Konstantinos I. Papathomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulant composition and electronic package utilizing same
- Patent number 7,192,997
- Issue date Mar 20, 2007
- International Business Machines Corporation
- Konstantinos I. Papathomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid via layer to layer interconnect
- Patent number 7,076,869
- Issue date Jul 18, 2006
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cap attach surface modification for improved adhesion
- Patent number 7,064,013
- Issue date Jun 20, 2006
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a thermoset-containing dielectric mater...
- Patent number 7,014,731
- Issue date Mar 21, 2006
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of multisegmented plated through holes
- Patent number 6,996,903
- Issue date Feb 14, 2006
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making and interconnect structure
- Patent number 6,931,726
- Issue date Aug 23, 2005
- International Business Machines Corporation
- Christina M. Boyko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tamper-responding encapsulated enclosure having flexible protective...
- Patent number 6,929,900
- Issue date Aug 16, 2005
- International Business Machines Corporation
- Donald S. Farquhar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Laminate circuit structure and method of fabricating
- Patent number 6,820,332
- Issue date Nov 23, 2004
- International Business Machines Corporation
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cap attach surface modification for improved adhesion
- Patent number 6,803,256
- Issue date Oct 12, 2004
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flowable compositions and use in filling vias and plated through-holes
- Patent number 6,794,040
- Issue date Sep 21, 2004
- International Business Machines Corporation
- Gary Alan Johansson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead protective coating composition, process and structure thereof
- Patent number 6,790,473
- Issue date Sep 14, 2004
- International Business Machines Corporation
- Konstantinos I. Papathomas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing printed circuit board with embedded decoupling...
- Patent number 6,739,027
- Issue date May 25, 2004
- International Business Machines Corporation
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition with a polymerizing agent and method of manufactu...
- Patent number 6,734,259
- Issue date May 11, 2004
- International Business Machines Corporation
- Robert M. Japp
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Die attachment with reduced adhesive bleed-out
- Patent number 6,734,569
- Issue date May 11, 2004
- International Business Machines Corporation
- Bernd Karl Appelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of multisegmented plated through holes
- Patent number 6,700,078
- Issue date Mar 2, 2004
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tamper-responding encapsulated enclosure having flexible protective...
- Patent number 6,686,539
- Issue date Feb 3, 2004
- International Business Machines Corporation
- Donald S. Farquhar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect structure and method of making same
- Patent number 6,660,945
- Issue date Dec 9, 2003
- International Business Machines Corporation
- Christina M. Boyko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for producing Z-axis interconnection assembly...
- Patent number 6,645,607
- Issue date Nov 11, 2003
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and article for filling apertures in a high performance elec...
- Patent number 6,599,833
- Issue date Jul 29, 2003
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board structure with z-axis interconnections
- Patent number 6,593,534
- Issue date Jul 15, 2003
- International Business Machines Corporation
- Gerald W. Jones
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hole fill composition and method for filling holes in a substrate
- Patent number 6,589,639
- Issue date Jul 8, 2003
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for filling high aspect ratio via holes in electronic substr...
- Patent number 6,581,280
- Issue date Jun 24, 2003
- International Business Machines Corporation
- Brian Eugene Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for high speed printed wiring boards with multiple differ...
- Patent number 6,570,102
- Issue date May 27, 2003
- International Business Machines Corporation
- Thomas Richard Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERC...
- Publication number 20130033827
- Publication date Feb 7, 2013
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE METAL MICRO-PILLARS FOR ENHANCED ELECTRICAL INTERCONNECTION
- Publication number 20120257343
- Publication date Oct 11, 2012
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENCAPSULANT COMPOSITION
- Publication number 20080227902
- Publication date Sep 18, 2008
- Konstantinos I. Papathomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT COMPOSITION AND ELECTRONIC PACKAGE UTILIZING SAME
- Publication number 20080012156
- Publication date Jan 17, 2008
- Konstantinos I. Papathomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT COMPOSITION AND ELECTRONIC PACKAGE UTILIZING SAME
- Publication number 20070185227
- Publication date Aug 9, 2007
- Konstantinos I. Papathomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of multisegmented plated through holes
- Publication number 20050079289
- Publication date Apr 14, 2005
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cap attach surface modification for improved adhesion
- Publication number 20040238967
- Publication date Dec 2, 2004
- Stephen Leslie Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tamper-responding encapsulated enclosure having flexible protective...
- Publication number 20040195001
- Publication date Oct 7, 2004
- Donald S. Farquhar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RESIN COMPOSITION WITH A POLYMERIZING AGENT AND METHOD OF MANUFACTU...
- Publication number 20040082730
- Publication date Apr 29, 2004
- International Business Machines Corporation
- Robert M. Japp
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method and structure for producing Z-axis interconnection assembly...
- Publication number 20040052945
- Publication date Mar 18, 2004
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hole fill composition and method for filling holes in a substrate
- Publication number 20030216490
- Publication date Nov 20, 2003
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect structure and method of making same
- Publication number 20030172525
- Publication date Sep 18, 2003
- International Business Machines Corporation
- Christina M. Boyko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die attachment with reduced adhesive bleed-out
- Publication number 20030119226
- Publication date Jun 26, 2003
- International Business Machines Corporation
- Bernd Karl Appelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structure and method of making same
- Publication number 20030070839
- Publication date Apr 17, 2003
- Christina M. Boyko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flowable compositions and use in filling vias and plated through-holes
- Publication number 20030064212
- Publication date Apr 3, 2003
- Gary Alan Johansson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Laminate circuit structure and method of fabricating
- Publication number 20030042046
- Publication date Mar 6, 2003
- International Business Machines Corporation
- Robert M. Japp
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Solid via layer to layer interconnect
- Publication number 20030035272
- Publication date Feb 20, 2003
- Brian E. Curcio
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Halogen free triazines, bismaleimide/epoxy polymers, prepregs made...
- Publication number 20030003305
- Publication date Jan 2, 2003
- International Business Machines Corporation
- Robert Maynard Japp
- B32 - LAYERED PRODUCTS
Information Patent Application
Method and structure for producing Z-axis interconnection assembly...
- Publication number 20020192444
- Publication date Dec 19, 2002
- International Business Machines Corporation
- Brian E. Curcio
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Hole fill composition and method for filling holes in a substrate
- Publication number 20020187316
- Publication date Dec 12, 2002
- International Business Machines Corporation
- Donald S. Farquhar
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method and article for filling apertures in a high performance elec...
- Publication number 20020182832
- Publication date Dec 5, 2002
- Donald S. Farquhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID VIA LAYER TO LAYER INTERCONNECT
- Publication number 20020179334
- Publication date Dec 5, 2002
- Brian E. Curcio
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method for filling high aspect ratio via holes in electronic substr...
- Publication number 20020179335
- Publication date Dec 5, 2002
- International Business Machines Corporation
- Brian Eugene Curcio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of multisegmented plated through holes
- Publication number 20020164468
- Publication date Nov 7, 2002
- Donald S. Farquhar
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
METHOD AND STRUCTURE FOR PRODUCING Z-AXIS INTERCONNECTION ASSEMBLY...
- Publication number 20020150741
- Publication date Oct 17, 2002
- International Business Machines Corporation
- Brian E. Curcio
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method of injection molded flip chip encapsulation
- Publication number 20020134569
- Publication date Sep 26, 2002
- International Business Machines Corporation
- Donald Seton Farquhar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Lead protective coating composition, process and structure thereof
- Publication number 20020132873
- Publication date Sep 19, 2002
- Konstantinos I. Papathomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed wiring board structure with z-axis interconnections
- Publication number 20020131229
- Publication date Sep 19, 2002
- International Business Machines Corporation
- Gerald W. Jones
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cap attach surface modification for improved adhesion
- Publication number 20020121698
- Publication date Sep 5, 2002
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill compositions
- Publication number 20020111420
- Publication date Aug 15, 2002
- International Business Machines Corporation
- Konstantinos Papathomas
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Konstantinos l. Papathomas

Person

Patents Grantslast 30 patents

Electrically conductive adhesive (ECA) for multilayer device interc...

Circuitized substrate with low loss capacitive material and method...

Encapsulant of epoxy or cyanate ester resin, reactive flexibilizer...

Electrically conducting adhesives for via fill applications

Method and structure for producing Z-axis interconnection assembly...

Electronic package with epoxy or cyanate ester resin encapsulant

Encapsulant composition and electronic package utilizing same

Encapsulant composition and electronic package utilizing same

Solid via layer to layer interconnect

Cap attach surface modification for improved adhesion

Semiconductor device having a thermoset-containing dielectric mater...

Formation of multisegmented plated through holes

Method of making and interconnect structure

Tamper-responding encapsulated enclosure having flexible protective...

Laminate circuit structure and method of fabricating

Cap attach surface modification for improved adhesion

Flowable compositions and use in filling vias and plated through-holes

Lead protective coating composition, process and structure thereof

Method for producing printed circuit board with embedded decoupling...

Resin composition with a polymerizing agent and method of manufactu...

Die attachment with reduced adhesive bleed-out

Formation of multisegmented plated through holes

Tamper-responding encapsulated enclosure having flexible protective...

Interconnect structure and method of making same

Method and structure for producing Z-axis interconnection assembly...

Method and article for filling apertures in a high performance elec...

Printed wiring board structure with z-axis interconnections

Hole fill composition and method for filling holes in a substrate

Method for filling high aspect ratio via holes in electronic substr...

Structure for high speed printed wiring boards with multiple differ...

Patents Applicationslast 30 patents

ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERC...

CONDUCTIVE METAL MICRO-PILLARS FOR ENHANCED ELECTRICAL INTERCONNECTION

ENCAPSULANT COMPOSITION

ENCAPSULANT COMPOSITION AND ELECTRONIC PACKAGE UTILIZING SAME

ENCAPSULANT COMPOSITION AND ELECTRONIC PACKAGE UTILIZING SAME

Formation of multisegmented plated through holes

Cap attach surface modification for improved adhesion

Tamper-responding encapsulated enclosure having flexible protective...

RESIN COMPOSITION WITH A POLYMERIZING AGENT AND METHOD OF MANUFACTU...

Method and structure for producing Z-axis interconnection assembly...

Hole fill composition and method for filling holes in a substrate

Interconnect structure and method of making same

Die attachment with reduced adhesive bleed-out

Interconnect structure and method of making same

Flowable compositions and use in filling vias and plated through-holes

Laminate circuit structure and method of fabricating

Solid via layer to layer interconnect

Halogen free triazines, bismaleimide/epoxy polymers, prepregs made...

Method and structure for producing Z-axis interconnection assembly...

Hole fill composition and method for filling holes in a substrate

Method and article for filling apertures in a high performance elec...

SOLID VIA LAYER TO LAYER INTERCONNECT

Method for filling high aspect ratio via holes in electronic substr...

Formation of multisegmented plated through holes

METHOD AND STRUCTURE FOR PRODUCING Z-AXIS INTERCONNECTION ASSEMBLY...

Method of injection molded flip chip encapsulation

Lead protective coating composition, process and structure thereof

Printed wiring board structure with z-axis interconnections

Cap attach surface modification for improved adhesion

Underfill compositions