Ku H. Chong

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a multiple layer circuit board die carrier...
- Patent number 5,758,413
- Issue date Jun 2, 1998
- International Business Machines Corporation
- Ku Ho Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine dimension stacked vias for a multiple layer circuit board stru...
- Patent number 5,699,613
- Issue date Dec 23, 1997
- International Business Machines Corporation
- Ku Ho Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch solder formation on printed circuit board process and pr...
- Patent number 5,535,936
- Issue date Jul 16, 1996
- International Business Machines Corporation
- Ku H. Chong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine pitch solder formation on printed circuit board process and pr...
- Patent number 5,493,075
- Issue date Feb 20, 1996
- International Business Machines Corporation
- Ku H. Chong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR