Kuan-Yeh Huang

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method
- Patent number 12,191,158
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method for manufacturing the same
- Patent number 12,183,628
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with passivation layer for dark current reduction
- Patent number 12,166,054
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air spacer surrounding conductive features and method forming same
- Patent number 12,165,914
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,990
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabricating method thereof
- Patent number 12,165,992
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Germanium-based sensor with junction-gate field effect transistor a...
- Patent number 12,148,853
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhy-Jyi Sze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,148,678
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an optical sensor
- Patent number 12,125,934
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic silicon spatial beam transformer integrated on 3DIC packag...
- Patent number 12,124,078
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Yu Huang
- G02 - OPTICS
Information Patent Grant
Packages with multiple types of underfill and method forming the same
- Patent number 12,087,733
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure in semiconductor package and manufacturing method t...
- Patent number 12,087,727
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill structure for semiconductor packages and methods of formi...
- Patent number 12,080,617
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned double patterning
- Patent number 12,068,167
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Germanium-containing photodetector and methods of forming the same
- Patent number 12,051,763
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jyh-Ming Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,051,668
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 12,046,676
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with reduced capacitances
- Patent number 12,046,506
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copolymer and method of manufacturing the same
- Patent number 12,037,448
- Issue date Jul 16, 2024
- Industrial Technology Research Institute
- Feng-Jen Hsieh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contouring system
- Patent number 12,014,813
- Issue date Jun 18, 2024
- Quanta Computer Inc.
- Kuei-Hong Kuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus and method for pipeline control
- Patent number 12,014,176
- Issue date Jun 18, 2024
- Realtek Semiconductor Corp.
- Kuan-Lin Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor sensor and methods thereof
- Patent number 12,015,099
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yin-Kai Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,015,023
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor structure
- Patent number 12,002,721
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and methods of forming the same
- Patent number 12,002,710
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method of manufacture
- Patent number 11,990,443
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dust-proof sensing device
- Patent number 11,953,344
- Issue date Apr 9, 2024
- FOXLINK IMAGE TECHNOLOGY CO., LTD.
- You Chung Chou
- G01 - MEASURING TESTING
Information Patent Grant
Dielectric protection layer in middle-of-line interconnect structur...
- Patent number 11,942,372
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Da Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 11,916,023
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHOTONIC SILICON SPATIAL BEAM TRANSFORMER INTEGRATED ON 3DIC PACKAG...
- Publication number 20240418932
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Yu HUANG
- G02 - OPTICS
Information Patent Application
Germanium-Based Sensor with Junction-Gate Field Effect Transistor a...
- Publication number 20240387766
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhy-Jyi Sze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240387311
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSCEIVER AND MANUFACTURING METHOD THEREOF
- Publication number 20240385398
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGE SENSOR AND METHOD FOR FORMING THE SAME
- Publication number 20240387587
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JHY-JYI SZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240387248
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR SPACER SURROUNDING CONDUCTIVE FEATURES AND METHOD FORMING SAME
- Publication number 20240379414
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN OPTICAL SENSOR
- Publication number 20240372028
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-SHIN CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR DEVICE AND DEVICES FABRICATED TH...
- Publication number 20240363395
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Fu KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240363756
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GERMANIUM-CONTAINING PHOTODETECTOR AND METHODS OF FORMING THE SAME
- Publication number 20240355953
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jyh-Ming HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND STRUCTURE HAVING SHIELDING STRUCTURES FOR STACKED IC CHIPS
- Publication number 20240355859
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYMMETRIC BOND SIGNAL INTEGRITY PRESERVATION STRUCTURE AND METHOD
- Publication number 20240347576
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ZIG-ZAG SIGNAL SHIELDING FOR PIXEL ARRAY
- Publication number 20240339467
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20240339432
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL SHIELDING FOR INTEGRATED CIRCUITS
- Publication number 20240339475
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SENSOR AND METHODS THEREOF
- Publication number 20240339555
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yin-Kai LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND STRUCTURES HAVING SHIELDING STRUCTURES FOR STACKED CHIPS
- Publication number 20240332333
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240297166
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION DEVICE
- Publication number 20240235081
- Publication date Jul 11, 2024
- Molex, LLC
- Hsin-Hung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE HARDMASK ON HARDMASK
- Publication number 20240168371
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Da Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC PROTECTION LAYER IN MIDDLE-OF-LINE INTERCONNECT STRUCTUR...
- Publication number 20240162095
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Da Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
- Publication number 20240162166
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPING FREE CONNECTION STRUCTURES AND METHODS
- Publication number 20240145298
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING IMAGE SENSOR
- Publication number 20240145520
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JHY-JYI SZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYER FOR EPITAXIAL SEMICONDUCTOR PROCESS
- Publication number 20240136401
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yin-Kai Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRUCIFORM BONDING STRUCTURE FOR 3D-IC
- Publication number 20240128216
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Germanium-Based Sensor with Junction-Gate Field Effect Transistor a...
- Publication number 20240105877
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhy-Jyi Sze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHODS FOR FORMING THE SAME
- Publication number 20240099030
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGING AND METHODS FOR FORMING THE SAME
- Publication number 20240096918
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS

Kuan-Yeh Huang

Person

Patents Grantslast 30 patents

Semiconductor device and method

Integrated circuit and method for manufacturing the same

Image sensor with passivation layer for dark current reduction

Air spacer surrounding conductive features and method forming same

Semiconductor device

Package structure and fabricating method thereof

Germanium-based sensor with junction-gate field effect transistor a...

Semiconductor package and manufacturing method thereof

Method of manufacturing an optical sensor

Photonic silicon spatial beam transformer integrated on 3DIC packag...

Packages with multiple types of underfill and method forming the same

Joint structure in semiconductor package and manufacturing method t...

Underfill structure for semiconductor packages and methods of formi...

Self-aligned double patterning

Germanium-containing photodetector and methods of forming the same

Semiconductor package and method of forming the same

Semiconductor devices and methods of manufacturing thereof

Devices with reduced capacitances

Copolymer and method of manufacturing the same

Chip package structure

Contouring system

Apparatus and method for pipeline control

Semiconductor sensor and methods thereof

Integrated circuit package and method of forming same

Method of fabricating semiconductor structure

Semiconductor structure and methods of forming the same

Semiconductor die package and method of manufacture

Dust-proof sensing device

Dielectric protection layer in middle-of-line interconnect structur...

Thermal interface material having different thicknesses in packages

Patents Applicationslast 30 patents

PHOTONIC SILICON SPATIAL BEAM TRANSFORMER INTEGRATED ON 3DIC PACKAG...

Germanium-Based Sensor with Junction-Gate Field Effect Transistor a...

SEMICONDUCTOR PACKAGE

OPTICAL TRANSCEIVER AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR IMAGE SENSOR AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

AIR SPACER SURROUNDING CONDUCTIVE FEATURES AND METHOD FORMING SAME

METHOD OF MANUFACTURING AN OPTICAL SENSOR

METHOD FOR FORMING A SEMICONDUCTOR DEVICE AND DEVICES FABRICATED TH...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

GERMANIUM-CONTAINING PHOTODETECTOR AND METHODS OF FORMING THE SAME

BOND STRUCTURE HAVING SHIELDING STRUCTURES FOR STACKED IC CHIPS

SYMMETRIC BOND SIGNAL INTEGRITY PRESERVATION STRUCTURE AND METHOD

ZIG-ZAG SIGNAL SHIELDING FOR PIXEL ARRAY

JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...

SIGNAL SHIELDING FOR INTEGRATED CIRCUITS

SEMICONDUCTOR SENSOR AND METHODS THEREOF

BOND STRUCTURES HAVING SHIELDING STRUCTURES FOR STACKED CHIPS

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

ELECTRICAL CONNECTION DEVICE

SELECTIVE HARDMASK ON HARDMASK

DIELECTRIC PROTECTION LAYER IN MIDDLE-OF-LINE INTERCONNECT STRUCTUR...

THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES

DOPING FREE CONNECTION STRUCTURES AND METHODS

METHODS FOR FABRICATING IMAGE SENSOR

PASSIVATION LAYER FOR EPITAXIAL SEMICONDUCTOR PROCESS

CRUCIFORM BONDING STRUCTURE FOR 3D-IC

Germanium-Based Sensor with Junction-Gate Field Effect Transistor a...

CHIP PACKAGE AND METHODS FOR FORMING THE SAME

IMAGE SENSOR PACKAGING AND METHODS FOR FORMING THE SAME